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TMS4023NC

Texas Instruments

TMS4023NC by Texas Instruments

TMS4023NC by Texas Instruments is a 1KX1 MOS memory IC with 1024-bit density and 32 refresh cycles. It features 3-STATE output characteristics, operates b/w -25 to 70 °C, and has a rectangular PLASTIC/EPOXY package. Commonly used in applications requiring high-speed data storage with a terminal pitch of 2.54 mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,449 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,449

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-

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Digiode

USA . 3,049 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,049

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,750 parts In-Stock

1+ parts

$3.175

100+ parts

-

1k+ parts

$3.697

10k+ parts

-

1,750

$3.175

-

$3.697

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DigiPath Technology Company

USA . 340 parts In-Stock

1+ parts

$3.496

100+ parts

-

1k+ parts

-

10k+ parts

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340

$3.496

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-

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ChromeModa Solutions

Germany . 6,231 parts In-Stock

1+ parts

$3.567

100+ parts

$2.925

1k+ parts

-

10k+ parts

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6,231

$3.567

$2.925

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IDEA Electronic Components Group

UK . 1,151 parts In-Stock

1+ parts

$3.567

100+ parts

-

1k+ parts

$3.210

10k+ parts

-

1,151

$3.567

-

$3.210

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One Stop Electronics

USA . 854 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

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10k+ parts

-

854

$8.000

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-

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AZTECH Wire

Italy . 668 parts In-Stock

1+ parts

$17.502

100+ parts

-

1k+ parts

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10k+ parts

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668

$17.502

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Corphita

USA . 900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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900

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Overview

Discover the unparalleled quality and reliability of the TMS4023NC by Texas Instruments, a leading manufacturer known for its cutting-edge technology. This innovative Other Function Memory IC offers a multitude of applications with its versatile design and superior performance. With a focus on value and customer satisfaction, this product provides unmatched benefits and advantages to meet your specific needs. Experience the difference with Texas Instruments and elevate your projects to the next level with the TMS4023NC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the memory IC, making it suitable for various environments.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient and space-saving integration of the memory IC into different systems and devices.

Input/Output Type: COMMON

The common input/output type simplifies the connection and interaction with other components in the system, enhancing compatibility and ease of use.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and functionalities, making this memory IC suitable for a variety of applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this memory IC can withstand elevated temperatures and operate reliably in demanding conditions.

Organization: 1KX1

The 1KX1 organization of this memory IC indicates a high capacity and efficient organization of memory cells, offering ample storage and retrieval capabilities.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for flexible control and management of output signals, enabling efficient data transmission and processing.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25°C ensures that this memory IC can function effectively even in cold environments without performance degradation.

Technology: MOS

Utilizing MOS technology provides high-speed operation, low power consumption, and reliable performance, making this memory IC a cost-effective and efficient choice.

No. of Words: 1024 words

With 1024 words of memory, this IC offers ample storage capacity for data and instructions, making it suitable for a wide range of applications requiring memory-intensive operations.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy and convenient connection to external devices, facilitating integration and installation of this memory IC in various systems.

Memory Density: 1024 bit

The high memory density of 1024 bits enables efficient data storage and retrieval, providing high performance and functionality for applications requiring extensive memory usage.

Refresh Cycles: 32

The 32 refresh cycles ensure the reliability and consistency of stored data over time, preventing data corruption and enhancing the longevity of this memory IC.

Technical Specifications

Other Function Memory ICs TMS4023NC attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Input/Output Type:

COMMON

JESD-30 Code:

R-PDIP-T24

Memory Density:

1024 bit

Memory Width:

1

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

1KX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Refresh Cycles:

32

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS4023NC Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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