Loading...

LC331632M-80

Onsemi

LC331632M-80 by Onsemi

LC331632M-80 by Onsemi is a 32KX16 memory IC with 3-STATE output, operating at 5V. It has a max access time of 80ns and standby current of 0.002A. This CMOS technology device is ideal for applications requiring high-speed data storage and retrieval in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,128

-

-

-

-

Digiode

USA . 1,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,455

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,149

-

-

-

-

SupplyDigital Components

Austria . 4,812 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,812

-

-

-

-

TANS Electronics

Latvia . 4,195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,195

-

-

-

-

Kulean Microsystems

USA . 2,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,447

-

-

-

-

Corphita

USA . 802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

802

-

-

-

-

UHIMA Technologies

Türkiye . 760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

760

-

-

-

-

Corohmni

South Africa . 359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

359

-

-

-

-

Overview

Unlock the power of advanced memory solutions with the LC331632M-80 by Onsemi. Designed with precision and quality in mind, this memory IC offers unmatched reliability and performance in a variety of applications. From industrial automation to consumer electronics, this product delivers seamless integration and unparalleled efficiency. Experience the value and benefits of Onsemi's cutting-edge technology, providing customers with a competitive edge in today's fast-paced market. Choose Onsemi for superior quality and innovation in memory ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the IC, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy PCB assembly and integration, saving time and effort during the manufacturing process.

Input/Output Type: COMMON

Common input/output type simplifies the interface design and ensures compatibility with other components, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it versatile for a wide range of applications.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options, allowing for complex circuit designs and integration with various systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can withstand high temperatures without compromising performance, making it suitable for harsh environments.

Memory Width: 16

With a memory width of 16, this IC can store and retrieve data efficiently, improving overall system speed and performance.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this IC energy-efficient and reliable for long-term use.

Technical Specifications

Other Function Memory ICs LC331632M-80 attributes and parameters. Explore more Other Function Memory ICs devices from Onsemi

Specs

Maximum Access Time:

80 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G40

Memory Density:

524288 bit

Memory Width:

16

No. of Terminals:

40

No. of Words:

32768 words

No. of Words Code:

32K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP40,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.002 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

90 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LC331632M-80 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 6