Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M36LLR8760M1ZAQF by STMicroelectronics is a low-profile, asynchronous memory IC featuring 16M words of mixed FLASH+PSRAM. It operates at a nominal voltage of 1.8V and supports temperatures from -25 °C to 85 °C. Ideal for compact applications requiring efficient data storage and retrieval.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Digiode
Anansix
IDEA Electronic Components Group
$4.847
$4.363
MKK Technologies
$9.115
DigiPath Technology Company
Parana Technologies
$5.796
Corphita
The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for a variety of applications.
Surface mount capability allows for compact design and efficient utilization of PCB space, enhancing overall product performance.
The rectangular shape ensures easy integration into various devices and maximizes the effective use of circuit board area.
Asynchronous operation supports faster access speeds, contributing to improved performance in data processing applications.
Combining FLASH and PSRAM offers both persistent storage and fast access memory, making this chip versatile for diverse processing needs.
The low nominal supply voltage helps in power efficiency, making this product ideal for battery-operated devices.
Operating at 1.8 V minimizes energy consumption, which is crucial for energy-sensitive applications.
Having 88 terminals facilitates advanced connectivity options, allowing for more complex designs and functionality.
The low-profile and fine pitch grid array design is excellent for high-density applications while enabling efficient thermal and electrical performance.
Designed to operate up to 85 °C, this IC can function effectively in high-temperature environments.
The 16MX16 organization provides a large data access structure, accommodating high-volume data storage needs.
A minimum operating temperature of -25 °C allows this memory IC to be used in cooler climates and various outdoor applications.
The tin-silver-copper finish enhances solderability and increases reliability, ensuring long-term performance in diverse environments.
Bottom terminal positioning allows for easier mounting and saves valuable space on printed circuit boards.
A maximum seated height of 1.4 mm contributes to a low-profile mounting that is beneficial in space-constrained applications.
An 8 mm width is suitable for applications that require compact memory solutions without compromising reliability.
The option for lower supply voltage supports a wider range of battery configurations, enhancing device compatibility.
A length of 10 mm maximizes space utilization while remaining easy to integrate into various device layouts.
CMOS technology ensures low power consumption and high-speed operation, ideal for modern electronic devices.
Ball terminal form provides robust connectivity and better thermal performance, crucial for advanced applications.
A maximum supply current of 52 mA indicates adequate power handling capabilities for demanding applications.
Offering 16,777,216 words of memory allows for storing substantial data sets, supporting various memory-intensive applications.
A memory width of 16 bits facilitates efficient data transfer and processing, improving overall system performance.
0.8 mm terminal pitch is suitable for high-density designs, enabling advanced applications in limited spaces.
The 16M word capacity caters to modern data applications, making this product flexible for a wide range of uses.
The maximum supply voltage of 1.95 V allows this component to function securely in various voltage environments.
With a density of 268,435,456 bits, this memory IC supports high-performance applications requiring extensive data storage.
Being classified as a memory circuit ensures that it is tailored for efficient data storage and retrieval, which is essential for many applications.
A maximum standby current of only 0.00011 A highlights energy efficiency during idle periods, making the device more efficient overall.
Other Function Memory ICs M36LLR8760M1ZAQF attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
Additional Features:
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Power Supplies (V):
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M36LLR8760M1ZAQF Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
2N7002
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
SMBJ18CA
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
BSS138
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
General Instrument
BAV99
Weitron Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
2N2222A
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FDN306P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
Transys Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148-GS08
Telefunken Microelectronics
RECTIFIER DIODE; Surface Mount: YES; JESD-609 Code: e0; No. of Elements: 1; Maximum Operating Temperature: 175 Cel; Maximum Non Repetitive Peak Forward Current: 2 A;
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
Diodes Incorporated
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
DS1652SB
Analog Devices
DS1652SB by Analog Devices is a 64-bit MEMORY CIRCUIT with 64x1 organization. Operating at 5V, it has a CMOS technology and operates in ASYNCHRONOUS mode. Ideal for applications requiring small outline packages and surface mount capabilities.
SN74S262NP1
Texas Instruments
SN74S262NP1 by Texas Instruments is a TTL memory circuit IC with 20 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, suitable for commercial applications. The through-hole terminals are spaced at 2.54mm pitch, making it ideal for various function memory circuits.
ATSHA204A-SSHDA-B
Atmel
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
SM27C512-30J
Other Memory ICs;
SN74LS170FN3
SN74LS170FN3 by Texas Instruments is a TTL technology IC with 20 terminals in a square chip carrier package. It operates at temperatures b/w 0°C to 70°C and has a nominal voltage of 5V. This memory IC is commonly used in commercial applications requiring other function memory capabilities.
TMS2150-45DW
TMS2150-45DW by Texas Instruments is a 512x9 MOS memory IC with 45ns access time and 135mA supply current. It operates at temperatures from 0 to 70°C, making it suitable for commercial applications requiring fast data retrieval in a small outline package.
M36W0R6030T0ZAQE
STMicroelectronics
M36W0R6030T0ZAQE by STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It combines FLASH and SRAM technologies for efficient data storage in industrial applications. With a max temp of 85 °C and access time of 70ns, it ensures reliable performance.
TMS2564-50JDL
TMS2564-50JDL by Texas Instruments is an 8KX8 memory IC with 65536 bit density and 500 ns access time. It features a MOS technology, operates b/w 0 to 70 °C, and has a package style of IN-LINE. Ideal for applications requiring fast data retrieval in commercial temperature environments.
SN74HC670N1
SN74HC670N1 by Texas Instruments is a CMOS memory IC with 16 terminals, operating b/w -40°C to 85°C. It has a voltage range of 2-6V and comes in an industrial-grade rectangular package suitable for various applications requiring other function memory ICs.
TMS27L08-45JL
TMS27L08-45JL by Texas Instruments is a 1KX8 OTP ROM memory IC with 8192-bit memory density. It features 3-STATE output characteristics and has a max access time of 450 ns. This MOS technology device operates b/w 0 to 70°C, making it suitable for various commercial applications requiring reliable memory storage.
TMS27PC32-25JE4
MTFDHBM1T0TDQ-1AT12ATYYTR
Micron Technology
MEMORY CIRCUIT;
SN74AS870NTP1
SN74AS870NTP1 by Texas Instruments is a TTL technology IC with 24 terminals in an IN-LINE package. Operating temperature range is 0-70°C, suitable for commercial applications. Ideal for memory functions due to its dual terminal position and rectangular shape.
TMS27PC32-2NE
DS28C39Q+T
MEMORY CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; Terminal Finish: Matte Tin (Sn) - annealed;
DS9093F
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED; Surface Mount: NO;
RP-SMLE04DA1
Panasonic
The Panasonic RP-SMLE04DA1 is a rectangular, surface-mount memory IC with 4GX8 organization and 8-bit memory width. Operating asynchronously from -25°C to 85°C, it offers a memory density of 34.36 Gb for various applications requiring high-speed data storage and retrieval in compact electronic devices.
CY15B102Q-SXET
Cypress Semiconductor
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5.28 mm;
M36W0R6040B0ZAQF
M36W0R6040B0ZAQF from STMicroelectronics is a mixed memory IC featuring 4M x 16 organization with Flash+PSRAM technology. It operates asynchronously at a nominal voltage of 1.8V, supporting temperatures from -30 °C to 85 °C. Ideal for compact applications, it has a thin profile grid array package with low power consumption.
DS1204U-G2C
Analog Devices' DS1204U-G2C is a 256-bit MEMORY CIRCUIT with CMOS technology. Operating at 5V, it has a temperature range of 0-70 °C and synchronous mode. Ideal for applications requiring a 256X1 organization in commercial-grade environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M36L0R7050T0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
M36L0R7050B0ZAQF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
M36L0R7040B0ZAQE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
M36L0R7040T0ZAQT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 8M;
M36L0R7050L1ZAME
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Width: 32;
M36L0R7040B0ZAQT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;
M36L0R7050B0ZAQE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words: 8388608 words;
M36L0R7050T0ZAQT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B88;
M36L0R7050B0ZAQT
M36L0R7040T0ZAQE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
M36L0R7040T0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
M36L0R7050L1ZAMF
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
M36L0R7050T0ZAQE
M36L0R7050B0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH;
M36L0R7050T0ZAQF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
M36L0R7050U1ZAMF
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
M36L0R7050U1ZAME
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
M36L0R7040B0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
M36L0R7040B0ZAQF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M36L0R7040T0ZAQF
Supply Digital Components
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