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M36L0R7050T0ZAQF

STMicroelectronics

M36L0R7050T0ZAQF by STMicroelectronics

M36L0R7050T0ZAQF by STMicroelectronics is a mixed memory IC featuring 8M x 16 organization, operating at a nominal voltage of 1.8V. It supports asynchronous mode and has a max temp of 85 °C, ideal for compact applications in consumer electronics. Its thin profile and fine pitch design enhance space efficiency in modern devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 5,737 parts In-Stock

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5,737

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Vyrian

USA . 3,155 parts In-Stock

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Anansix

USA . 1,634 parts In-Stock

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1,634

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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50

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,506 parts In-Stock

1+ parts

$4.398

100+ parts

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$3.958

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1,506

$4.398

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$3.958

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MKK Technologies

India . 2,007 parts In-Stock

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$8.269

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2,007

$8.269

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DigiPath Technology Company

USA . 2,007 parts In-Stock

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$8.269

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$8.269

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Corphita

USA . 1,255 parts In-Stock

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Parana Technologies

USA . 600 parts In-Stock

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$5.258

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600

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Overview

Unlock the potential of your projects with the M36L0R7050T0ZAQF from STMicroelectronics, a leader in innovative memory solutions. This versatile FLASH+PSRAM memory IC combines reliability and efficiency, making it ideal for demanding applications like IoT devices, consumer electronics, and automotive systems. With its compact design and low power consumption, this memory solution not only enhances performance but also delivers exceptional value, helping you stay ahead in today’s competitive landscape. Experience the benefits of superior quality and cutting-edge technology with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental stresses, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient space utilization on printed circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into existing layouts and optimal board space management.

Operating Mode: ASYNCHRONOUS

Asynchronous operation improves performance in applications where speed and quick response time are critical.

Mixed Memory Type: FLASH+PSRAM

Combining FLASH and PSRAM allows for flexibility in memory usage, benefiting a wide range of application requirements.

Nominal Supply Voltage / Vsup: 1.8 V

Operates at a low voltage, contributing to energy efficiency and lower power consumption in devices.

Power Supplies (V): 1.8

Ensures compatibility with modern low-voltage systems, enhancing versatility in design.

No. of Terminals: 88

A higher number of terminals provides more connectivity options, enabling complex circuit designs.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch of the grid array are ideal for high-density applications where space is premium.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can function reliably in demanding environments.

Organization: 8MX16

The organization of memory provides a solid balance of capacity and efficiency, tailored for various applications.

Minimum Operating Temperature: -25 °C

This wide temperature range ensures functionality in extreme conditions, making it suitable for harsh environments.

Terminal Finish: TIN SILVER COPPER

Tin-silver-copper finish enhances solderability and ensures long-term reliability of connections.

Terminal Position: BOTTOM

Bottom terminal position allows for better thermal management and improved electrical performance.

Maximum Seated Height: 1.2 mm

A low seated height contributes to slim designs, making the product ideal for compact electronic devices.

Width: 8 mm

A width of 8mm supports fitting into various form factors, ensuring versatility across devices.

Minimum Supply Voltage (Vsup): 1.7 V

A low minimum supply voltage extends the range of compatible designs, enhancing the product's applicability.

Length: 10 mm

A length of 10mm strikes a balance between size and performance, fitting a variety of applications.

Technology: CMOS

CMOS technology ensures low static power consumption, ideal for portable electronic devices.

Terminal Form: BALL

Ball terminal form facilitates effective heat dissipation and improved reliability of connections.

Maximum Supply Current: 47 mA

A maximum supply current of 47mA allows for efficient power management while meeting performance demands.

No. of Words: 8388608 words

The capacity to store over 8 million words makes this IC suitable for data-intensive applications.

Memory Width: 16

A memory width of 16 bits enables efficient data processing and enhances performance in data tasks.

Terminal Pitch: 0.8 mm

A 0.8mm terminal pitch allows for more compact designs while maintaining ease of manufacturing.

No. of Words Code: 8M

Providing an 8M word code provides substantial data storage, catering to modern application needs.

Maximum Supply Voltage (Vsup): 1.95 V

The range of supply voltage ensures adaptability to different systems and enhances compatibility with various designs.

Memory Density: 134217728 bit

The high memory density supports complex applications and rich data storage requirements.

Memory IC Type: MEMORY CIRCUIT

A dedicated memory circuit ensures optimized performance specifically tailored for memory tasks.

Maximum Standby Current: 0.00007 Amp

A very low standby current allows for excellent power conservation, especially beneficial in battery-operated devices.

Technical Specifications

Other Function Memory ICs M36L0R7050T0ZAQF attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Additional Features:

PSRAM IS ORGANIZED AS 2M X 16

JESD-30 Code:

R-PBGA-B88

JESD-609 Code:

e1

Length:

10 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

Mixed Memory Type:

FLASH+PSRAM

No. of Functions:

1

No. of Terminals:

88

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

8MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA88,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00007 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

47 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36L0R7050T0ZAQF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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