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M36L0R7050U1ZAME

STMicroelectronics

M36L0R7050U1ZAME by STMicroelectronics

M36L0R7050U1ZAME by STMicroelectronics is a high-density memory IC featuring 64M words of FLASH+PSRAM with a supply voltage range of 1.7-1.95V. It operates asynchronously and supports surface mount in a thin profile package. Ideal for compact applications requiring efficient data storage, it withstands temperatures from -25 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,590 parts In-Stock

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1,590

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Digiode

USA . 1,102 parts In-Stock

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1,102

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Vyrian

USA . 128 parts In-Stock

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128

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 512 parts In-Stock

1+ parts

$3.938

100+ parts

-

1k+ parts

$3.544

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512

$3.938

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$3.544

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MKK Technologies

India . 760 parts In-Stock

1+ parts

$7.404

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760

$7.404

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DigiPath Technology Company

USA . 760 parts In-Stock

1+ parts

$7.404

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760

$7.404

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Corphita

USA . 4,194 parts In-Stock

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Parana Technologies

USA . 2,352 parts In-Stock

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$4.708

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2,352

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$4.708

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Overview

Unlock innovation with the M36L0R7050U1ZAME from STMicroelectronics, a leader in cutting-edge technology. This advanced memory IC seamlessly integrates FLASH and PSRAM, ensuring top-notch performance for diverse applications—from IoT devices to automotive systems. With its robust design and efficiency at low power, it empowers your projects while optimizing energy use. Trust in STMicroelectronics for quality and reliability that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection of the internal components, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic circuits.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space on PCB, enhancing layout options for engineers.

Operating Mode: ASYNCHRONOUS

Asynchronous operation supports faster data access speeds, providing high performance in applications such as mobile and consumer electronics.

Mixed Memory Type: FLASH+PSRAM

Combining FLASH and PSRAM allows for versatile storage solutions, enabling both storage and faster access times.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8 V enhances energy efficiency, crucial for battery-powered devices.

Power Supplies (V): 1.8

A single power supply requirement simplifies circuit design and increases reliability.

No. of Terminals: 88

A higher number of terminals allows for more connections and greater flexibility in designs, accommodating complex functions.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Thin profile and fine pitch design enable high-density packaging, optimizing space on the PCB without compromising performance.

Maximum Operating Temperature: 85 °C

Withstands high operating temperatures, making it suitable for various environments, including industrial applications.

Organization: 64MX32

The memory organization allows efficient data storage and retrieval, ensuring optimal performance for data-intensive applications.

Minimum Operating Temperature: -25 °C

This wide temperature range supports diverse applications, from consumer electronics to industrial-grade devices in harsh conditions.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient heat dissipation and reduces the overall footprint, ideal for compact devices.

Maximum Seated Height: 1.2 mm

A low seated height contributes to slimmer designs, which is crucial for modern device aesthetics and portability.

Width: 8 mm

Compact width supports space-constrained applications, enhancing design flexibility.

Minimum Supply Voltage (Vsup): 1.7 V

A low minimum supply voltage helps broaden the range of compatible systems, facilitating integration into various devices.

Length: 10.05 mm

The moderate length allows for efficient layout design and maximizes space utilization on the PCB.

Temperature Grade: COMMERCIAL EXTENDED

This grade ensures reliability in a wide range of temperatures, making it suitable for both commercial and light industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high performance, which is beneficial for portable devices requiring efficiency.

Terminal Form: BALL

Ball terminal form enhances the reliability of connections, which is essential in maintaining stable performance over time.

No. of Words: 67108864 words

A significant number of words allows for substantial data storage capabilities, perfect for applications needing extensive memory.

Memory Width: 32

The 32-bit memory width enhances data throughput, improving overall performance in data-intensive tasks.

Terminal Pitch: 0.8 mm

A fine terminal pitch supports high-density designs while maintaining effective signal integrity.

No. of Words Code: 64M

Represents a robust memory capacity, ideal for a variety of applications requiring substantial data handling.

Maximum Supply Voltage (Vsup): 1.95 V

A higher maximum supply voltage ensures compatibility with a wider range of applications and performance requirements.

Memory Density: 2147483648 bit

High memory density enables extensive data storage in a compact form factor, allowing for innovative applications.

Memory IC Type: MEMORY CIRCUIT

Classifying it as a memory circuit signifies its essential function in data storage, making it valuable in countless electronic applications.

Technical Specifications

Other Function Memory ICs M36L0R7050U1ZAME attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PBGA-B88

Length:

10.05 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

32

Mixed Memory Type:

FLASH+PSRAM

No. of Functions:

1

No. of Terminals:

88

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

64MX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA88,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36L0R7050U1ZAME Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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