Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
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Resion (Excess)
Other Function Memory ICs MR0A16ACYS35 attributes and parameters. Explore more Other Function Memory ICs devices from Everspin Technologies
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MR0A16ACYS35 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Everspin Technologies, Inc. Headquartered in Chandler, Arizona, Everspin Technologies, Inc. is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-transfer Torque MRAM (STT-MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount. With over 120 Million MRAM and STT-MRAM products deployed in data center, cloud storage, energy, industrial, automotive, and transportation markets, Everspin has built the strongest and fastest growing foundation of MRAM users in the world. Core Competence with MRAM: From Perpendicular to Field-Switched Everspin’s knowledge and experience in magnetic memory design, manufacture and delivery into relevant applications is unique within the semiconductor industry. With an intellectual property portfolio of more than 600 active patents and applications, Everspin leads the market in development of both in-plane and perpendicular magnetic tunnel junction (MTJ) STT-MRAM bit cells. Manufacturing - The Capacity to Deliver In 2014, Everspin partnered with GLOBALFOUNDRIES for full turn-key 300mm high-volume production of in-plane and perpendicular MTJ ST-MRAM on advanced technology nodes including 40nm, 28nm and beyond. In addition, Everspin owns and operates an integrated magnetic fabrication line located in Chandler, Arizona, where Everspin produces MRAM products are based on 180nm, 130nm, and 90nm process technology nodes. Product package and test operations are located in China, Taiwan and other Asian countries.
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
1N4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
OHN3140U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
BAV99
Plessey Semiconductors Discrete Components Div
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Semiconductors
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
SMBJ18CA
General Instrument
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803ADWR
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
TMS4C1060-60SD
TMS4C1060-60SD by Texas Instruments is a 20-terminal MEMORY CIRCUIT IC with 5V supply, 50ns access time, and 35mA max supply current. It operates b/w 0-70°C in commercial grade applications requiring reliable memory storage solutions.
TMS44C251-10DJ
TMS44C251-10DJ by Texas Instruments is a 256KX4 memory IC with 262144 words, 1048576 bit memory density, and 100 ns max access time. It operates at a nominal voltage of 5V and is suitable for commercial applications requiring small outline package style and dual terminal position.
47L64-I/SN
Microchip Technology
47L64-I/SN by Microchip Technology is a small outline memory IC with 8KX8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is suitable for industrial applications requiring a memory density of 65536 bit, fast access time of 550 ns, and a supply voltage range from 2.7V to 3.6V.
AT88SC25616C-SU-T
Atmel
CRYPTO MEMORY; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Length: 4.925 mm;
M36W108T100ZN1
M36W108T100ZN1 by STMicroelectronics is a mixed memory IC featuring 1M x 8 organization with FLASH+SRAM technology. It operates asynchronously at voltages b/w 2.7V and 3.6V, with a max access time of 100 ns. Ideal for commercial applications, it supports surface mount in a very thin profile package.
NMC27C16QE-45
NMC27C16QE-45 by Texas Instruments is a 2Kx8 OTP ROM memory IC with 16384-bit density. It operates at a max access time of 450ns and has an industrial temperature grade range from -40°C to 85°C. This CMOS technology device features a common I/O type, 3-state output characteristics, and is commonly used in applications requiring non-volatile memory storage.
S70KS1281DPBHI020
Cypress Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Width: 6 mm;
M28F221-90N3
Other Memory ICs;
MR0A08BYS35R
Everspin Technologies
MR0A08BYS35R by Everspin Technologies is a 128KX8 memory circuit with a CMOS technology. It operates asynchronously at a nominal voltage of 3.3V and has a max access time of 35ns. This memory IC is commonly used in applications that require high-speed data storage and retrieval.
M36W108B120ZM1
M36W108B120ZM1 from STMicroelectronics is a low-profile, asynchronous memory IC featuring 8Mbit density with FLASH+SRAM technology. It operates b/w 2.7V and 3.6V, supports up to 70 °C, and has a max access time of 120ns. Ideal for applications requiring efficient data storage in compact designs.
47L16-I/ST
47L16-I/ST by Microchip Technology is a 2KX8 EEPROM+SRAM memory IC with synchronous operation. It has a memory density of 16384 bit and operates in industrial temperature grade range from -40 to 85 °C. This small outline, thin profile IC is ideal for applications requiring mixed memory types in compact spaces.
MR45V032AMAZBATL
Lapis Semiconductor
MR45V032AMAZBATL by Lapis Semiconductor is a small outline, low profile memory IC with a capacity of 4096 words and a memory density of 32768 bits. It operates synchronously at a nominal voltage of 3.3V and can withstand temperatures ranging from -40 to 85°C. This memory circuit is commonly used in industrial applications requiring compact and reliable storage solutions.
TMS27PC291-45J
TMS4020NC
TMS4020NC by Texas Instruments is a 1KX2 MOS memory IC with 2048-bit density. It features separate I/O, open-drain output, and operates b/w -25°C to 70°C. Commonly used in applications requiring high-density memory storage with dual-terminal positions.
DS6204U-XXX
Analog Devices
DS6204U-XXX by Analog Devices is a 128x1 memory circuit IC with synchronous operation. Featuring CMOS technology, it has 128-bit memory density and uses tin lead terminal finish. This rectangular package is ideal for applications requiring specialized shape memory ICs.
TMS2564JL
TMS2564JL by Texas Instruments is an 8KX8 memory IC with 65536 bit density and 450 ns access time. It features a MOS technology, operates b/w 0-70 °C, and has a package style of IN-LINE. Ideal for applications requiring fast data retrieval in commercial-grade environments.
SMJ27C128-25J
S27KS0641DPBHI020
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
TMS27PC64-120N
TMX27PC128N25
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MR0A16ACYS35
Freescale Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
MR0A16AYS35
MR0A16AYS35 by Freescale Semiconductor is a 256KX16 MEMORY CIRCUIT with 4194304 bit memory density. Operating at 3.3V, it has an access time of 35ns and supports asynchronous mode. This PLASTIC/EPOXY IC in SMALL OUTLINE package is ideal for various commercial applications requiring high-speed memory functions.
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 35 ns;
MR0A16ACYS35R
MR0A16AYS35R
MR0A16AYS35R by Freescale Semiconductor is a 64KX16 memory circuit with a supply voltage of 3.3V. It operates in asynchronous mode and has a max access time of 35ns. This memory IC is commonly used in applications requiring high-speed data storage and retrieval.
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Length: 18.41 mm;
MR0A08BCYS35R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Words Code: 128K;
MR0A16AVYS35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
MR0A16ACMA35R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
MR0A16AVMA35R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Memory Density: 1048576 bit;
MR0A16AMYS35R
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Functions: 1;
MR0A16AMYS35
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Equivalence Code: TSOP44,.46,32;
MR0A16ACMA35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Terminal Form: BALL;
MR0A16AVMA35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA48,6X8,30;
MR0A16AVYS35R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Memory Density: 1048576 bit;
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Operating Temperature: 105 Cel;
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