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MR0A16AVYS35

NXP Semiconductors

MR0A16AVYS35 by NXP Semiconductors

MR0A16AVYS35 by NXP Semiconductors is a 128KX16 MEMORY CIRCUIT with 131072 words, operating at 3.3V. It has an access time of 35 ns, industrial temperature grade, and a package style of SMALL OUTLINE, THIN PROFILE. Ideal for applications requiring high memory density and fast data access in industrial environments.

Median Price

$22.810

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 235 parts In-Stock

1+ parts

$22.810

100+ parts

$19.969

1k+ parts

$18.298

10k+ parts

-

235

$22.810

$19.969

$18.298

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 364 parts In-Stock

1+ parts

$18.078

100+ parts

-

1k+ parts

-

10k+ parts

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364

$18.078

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-

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Vyrian

USA . 7,395 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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7,395

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Anansix

USA . 675 parts In-Stock

1+ parts

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675

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R&J Components

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 267 parts In-Stock

1+ parts

$16.180

100+ parts

-

1k+ parts

-

10k+ parts

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267

$16.180

-

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Corphita

USA . 2,960 parts In-Stock

1+ parts

$17.127

100+ parts

-

1k+ parts

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10k+ parts

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2,960

$17.127

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Component Stockers USA

USA . 109 parts In-Stock

1+ parts

$18.070

100+ parts

$14.250

1k+ parts

-

10k+ parts

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109

$18.070

$14.250

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QUARKTWIN TECHNOLOGY LTD

USA . 7,623 parts In-Stock

1+ parts

-

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1k+ parts

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7,623

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UNI Independent Distributors

Spain . 5,312 parts In-Stock

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5,312

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Experience unparalleled performance and reliability with the MR0A16AVYS35 by NXP Semiconductors. As a leader in the semiconductor industry, NXP ensures top-quality products that cater to various applications. This memory IC is perfect for industrial use with its wide temperature range and low power consumption. With a compact design and high memory density, this product offers exceptional value and benefits to customers looking for efficient and advanced solutions. Upgrade your systems today with the MR0A16AVYS35 and elevate your technology to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface-mount technology allows for easy installation and space-saving on printed circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, ensuring compatibility with other components.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, suitable for industrial applications.

Memory Width: 16

Provides ample memory width for storing large amounts of data efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance.

Maximum Access Time: 35 ns

Fast access time ensures quick retrieval of data, enhancing system speed and efficiency.

Technical Specifications

Other Function Memory ICs MR0A16AVYS35 attributes and parameters. Explore more Other Function Memory ICs devices from NXP Semiconductors

Specs

Maximum Access Time:

35 ns

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.41 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.028 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

165 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10.16 mm

Trade Compliance

MR0A16AVYS35 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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