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DS1207-XXX

Analog Devices

DS1207-XXX by Analog Devices

DS1207-XXX by Analog Devices is a CMOS memory circuit with 512-bit density. It operates b/w 0 °C to 70°C, making it suitable for commercial applications. This rectangular IC package with tin lead finish is ideal for various memory functions in electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,501 parts In-Stock

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Anansix

USA . 2,867 parts In-Stock

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Digiode

USA . 2,381 parts In-Stock

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One Stop Electronics

USA . 1,305 parts In-Stock

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$1.000

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MARBEL Systems

Belgium . 666 parts In-Stock

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$2.211

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Texas Native Microelectronics

USA . 550 parts In-Stock

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$2.541

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$2.439

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$2.363

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$2.236

550

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$2.439

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$2.236

Kenton Components

USA . 864 parts In-Stock

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$3.049

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$2.683

864

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AZTECH Wire

Italy . 295 parts In-Stock

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$6.016

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Qasali Group International

UK . 1,944 parts In-Stock

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$6.861

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$6.380

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$6.037

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Semicontronic

India . 595 parts In-Stock

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$22.000

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$21.450

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$21.340

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Corphita

USA . 1,330 parts In-Stock

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Northwest PG Solutions

USA . 1,266 parts In-Stock

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Native Components

USA . 1,259 parts In-Stock

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Overview

Unlock endless possibilities with the DS1207-XXX by Analog Devices, a cutting-edge memory circuit that guarantees top-notch quality and reliability. Manufactured by the trusted brand Analog Devices, this product offers unparalleled value and benefits to customers in various applications. Whether you're looking to enhance data storage or improve system performance, the DS1207-XXX is the perfect solution. Experience seamless operation and advanced technology with this exceptional memory IC, setting new standards in the industry. Elevate your projects with the DS1207-XXX and redefine excellence in memory circuits.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit boards and systems, making this product user-friendly and versatile.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this memory IC can reliably function under moderate to high temperature conditions.

Organization: 512X1

The 512X1 organization provides a high level of memory density in a compact package, making it suitable for applications where space is limited.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed performance, making this memory IC efficient and reliable for a variety of applications.

Technical Specifications

Other Function Memory ICs DS1207-XXX attributes and parameters. Explore more Other Function Memory ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XSSS-X

JESD-609 Code:

e0

Memory Density:

512 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X1

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

SPECIAL SHAPE

Qualification:

Not Qualified

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

UNSPECIFIED

Terminal Position:

SINGLE

Trade Compliance

DS1207-XXX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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