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DS1207-G03

Analog Devices

DS1207-G03 by Analog Devices

DS1207-G03 by Analog Devices is a CMOS MEMORY CIRCUIT with 5 terminals. It operates SYNCHRONOUSLY at temperatures ranging from 0 °C to 70°C. This IC is used in applications requiring Other Function Memory ICs, featuring a RECTANGULAR package shape for commercial-grade temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,151 parts In-Stock

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Digiode

USA . 2,636 parts In-Stock

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2,636

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Anansix

USA . 2,084 parts In-Stock

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2,084

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MARBEL Systems

Belgium . 100 parts In-Stock

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$3.210

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100

$3.210

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Texas Native Microelectronics

USA . 15,129 parts In-Stock

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$3.690

100+ parts

$3.542

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$3.432

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$3.247

15,129

$3.690

$3.542

$3.432

$3.247

Semicontronic

India . 700 parts In-Stock

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$4.000

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$3.900

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$3.880

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700

$4.000

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$3.880

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Kenton Components

USA . 33,216 parts In-Stock

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$4.428

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$3.897

33,216

$4.428

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$3.897

One Stop Electronics

USA . 1,985 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 722 parts In-Stock

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$8.447

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$8.447

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Qasali Group International

UK . 3,565 parts In-Stock

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$9.963

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$9.266

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$8.767

3,565

$9.963

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$9.266

$8.767

Northwest PG Solutions

USA . 3,376 parts In-Stock

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$3.355

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Corphita

USA . 2,335 parts In-Stock

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Native Components

USA . 1,022 parts In-Stock

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$3.320

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$3.320

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Overview

Discover the DS1207-G03 by Analog Devices, a top-of-the-line memory circuit IC designed for high-performance applications. With a focus on quality and reliability, Analog Devices is known for their cutting-edge technology and innovative solutions. The DS1207-G03 offers customers value and benefits like never before, with its synchronous operating mode and commercial temperature grade ensuring optimal performance in a variety of settings. Upgrade your projects with the DS1207-G03 and experience the advantages of Analog Devices' superior products.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape is a common and efficient design that allows for easy integration into various circuit layouts.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures proper timing and coordination between different parts of the memory circuit, resulting in reliable and efficient performance.

No. of Terminals: 5

Having a low number of terminals simplifies the installation process and reduces the chances of errors during set up.

Package Style (Meter): SPECIAL SHAPE

The special shape of the package style can offer unique advantages such as improved thermal dissipation or space-saving benefits.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this memory IC is suitable for use in a wide range of environments without risk of overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures that the memory IC can function reliably even in cold conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and reliability, leading to stable connections and optimal performance.

Terminal Position: SINGLE

Having a single terminal position makes it easier to align and connect the memory IC during installation, reducing the risk of errors.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this memory IC is suitable for use in standard operating environments where reliability and consistency are key.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this memory IC energy-efficient and reliable under various operating conditions.

Memory IC Type: MEMORY CIRCUIT

Being a memory circuit, this IC is specifically designed to store and retrieve data efficiently, making it a crucial component in electronic devices that require data storage capabilities.

Technical Specifications

Other Function Memory ICs DS1207-G03 attributes and parameters. Explore more Other Function Memory ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XSSS-X

JESD-609 Code:

e0

Memory IC Type:

No. of Functions:

1

No. of Terminals:

5

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

MODULE,5LEAD,.65

Package Shape:

Package Style (Meter):

SPECIAL SHAPE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

UNSPECIFIED

Terminal Position:

SINGLE

Trade Compliance

DS1207-G03 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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