Loading...

TMS2564-50JL

Texas Instruments

TMS2564-50JL by Texas Instruments

TMS2564-50JL by Texas Instruments is an 8KX8 memory IC with 65536 bit density and 500 ns access time. It features a CERAMIC package, RECTANGULAR shape, and COMMON I/O type. Ideal for commercial applications requiring fast data retrieval in a compact IN-LINE style package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,552

-

-

-

-

Digiode

USA . 1,811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,811

-

-

-

-

Q Components

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,247 parts In-Stock

1+ parts

$2.421

100+ parts

-

1k+ parts

$2.917

10k+ parts

-

2,247

$2.421

-

$2.917

-

DigiPath Technology Company

USA . 83 parts In-Stock

1+ parts

$2.666

100+ parts

$2.452

1k+ parts

-

10k+ parts

-

83

$2.666

$2.452

-

-

ChromeModa Solutions

Germany . 1,511 parts In-Stock

1+ parts

$2.720

100+ parts

$2.230

1k+ parts

-

10k+ parts

-

1,511

$2.720

$2.230

-

-

IDEA Electronic Components Group

UK . 616 parts In-Stock

1+ parts

$2.720

100+ parts

-

1k+ parts

$2.448

10k+ parts

-

616

$2.720

-

$2.448

-

AZTECH Wire

Italy . 361 parts In-Stock

1+ parts

$9.978

100+ parts

-

1k+ parts

-

10k+ parts

-

361

$9.978

-

-

-

One Stop Electronics

USA . 961 parts In-Stock

1+ parts

$16.000

100+ parts

-

1k+ parts

-

10k+ parts

-

961

$16.000

-

-

-

Corphita

USA . 313 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

313

-

-

-

-

Overview

Unleash the power of innovation with the TMS2564-50JL by Texas Instruments. Crafted with precision and quality, this memory IC offers unparalleled reliability and performance. Perfect for a wide range of applications, this product promises seamless integration and optimal functionality. Elevate your projects with the cutting-edge technology of Texas Instruments and experience the value and benefits that the TMS2564-50JL brings to the table. Trust in Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides good thermal conductivity and helps in dissipating heat efficiently, making this product suitable for applications that require stable temperature environments.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can function reliably in a wide range of environmental conditions without risking damage due to overheating.

Memory Density: 65536 bit

High memory density allows for storing a larger amount of data in a compact size, making this product ideal for applications where space is a constraint.

Maximum Access Time: 500 ns

With a maximum access time of 500 nanoseconds, this product offers fast data retrieval, which is essential for applications that require quick response times.

Technical Specifications

Other Function Memory ICs TMS2564-50JL attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

500 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T28

Memory Density:

65536 bit

Memory Width:

8

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2564-50JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20