Loading...

TMS2508-25JL

Texas Instruments

TMS2508-25JL by Texas Instruments

TMS2508-25JL by Texas Instruments is a 1Kx8 MOS memory IC with 8192-bit density and 250ns access time. It features 3-STATE output, operates b/w 0 to 70°C, and has a rectangular ceramic package. Ideal for applications requiring common I/O type in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,529 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,529

-

-

-

-

Digiode

USA . 2,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,503

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 782 parts In-Stock

1+ parts

$3.044

100+ parts

-

1k+ parts

$3.556

10k+ parts

-

782

$3.044

-

$3.556

-

ChromeModa Solutions

Germany . 2,383 parts In-Stock

1+ parts

$3.420

100+ parts

$2.804

1k+ parts

-

10k+ parts

-

2,383

$3.420

$2.804

-

-

IDEA Electronic Components Group

UK . 2,357 parts In-Stock

1+ parts

$3.420

100+ parts

-

1k+ parts

$3.078

10k+ parts

-

2,357

$3.420

-

$3.078

-

AZTECH Wire

Italy . 608 parts In-Stock

1+ parts

$13.941

100+ parts

-

1k+ parts

-

10k+ parts

-

608

$13.941

-

-

-

One Stop Electronics

USA . 665 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

10k+ parts

-

665

$18.000

-

-

-

DigiPath Technology Company

USA . 2,247 parts In-Stock

1+ parts

-

100+ parts

$3.083

1k+ parts

-

10k+ parts

-

2,247

-

$3.083

-

-

Corphita

USA . 1,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,271

-

-

-

-

Overview

Discover the top-quality TMS2508-25JL by Texas Instruments, a versatile memory IC that offers exceptional performance and reliability. Manufactured by a trusted industry leader, this product is perfect for a wide range of applications. With its innovative technology and 3-state output characteristics, the TMS2508-25JL provides unmatched value and benefits to customers. Whether you're looking to upgrade your current system or develop a new project, this memory IC is the ideal choice for maximizing efficiency and performance.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers excellent thermal conductivity and heat dissipation, making it ideal for high-performance memory ICs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into electronic circuits.

Input/Output Type: COMMON

Common input/output type simplifies interfacing with other components and devices, enhancing overall compatibility.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for versatile applications and circuit configurations.

Package Style (Meter): IN-LINE

In-line package style ensures easy installation and maintenance in electronic systems.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance of 70°C ensures reliable performance under varying environmental conditions.

Organization: 1KX8

1KX8 organization facilitates efficient data storage and retrieval with a memory width of 8 bits.

Output Characteristics: 3-STATE

3-STATE output characteristics enable flexible bus sharing and minimize conflicts in multi-device communication.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures functionality even in colder environments.

Terminal Position: DUAL

Dual terminal position enhances connectivity options and ensures secure connections in electronic circuits.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard commercial applications with reliable performance.

Technology: MOS

MOS technology offers high speed, low power consumption, and reliable operation for memory ICs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support and solder joint strength for secure connections.

No. of Words: 1024 words

Having 1024 words allows for ample data storage capacity and efficient processing capabilities.

Memory Width: 8

Memory width of 8 bits enables efficient data handling and processing in various applications.

Terminal Pitch: 2.54 mm

Terminal pitch of 2.54 mm ensures compatibility with standard electronic components and PCB layouts.

No. of Words Code: 1K

1K words code signifies a large memory capacity for storing data and information efficiently.

Memory Density: 8192 bit

High memory density of 8192 bits enables the storage of a large amount of data in a compact memory IC.

Maximum Access Time: 250 ns

Fast maximum access time of 250 nanoseconds ensures quick data retrieval and processing for efficient performance.

Technical Specifications

Other Function Memory ICs TMS2508-25JL attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

250 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T24

Memory Density:

8192 bit

Memory Width:

8

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2508-25JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20