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M36LLR8760M1ZAQE

STMicroelectronics

M36LLR8760M1ZAQE by STMicroelectronics

M36LLR8760M1ZAQE by STMicroelectronics is a low-profile, asynchronous memory IC featuring 16M words of mixed FLASH+PSRAM. It operates at a nominal voltage of 1.8V and supports temperatures from -25 °C to 85 °C. Ideal for compact applications requiring efficient data storage and retrieval.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,358 parts In-Stock

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4,358

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Vyrian

USA . 2,725 parts In-Stock

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2,725

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Anansix

USA . 2,321 parts In-Stock

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2,321

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 58 parts In-Stock

1+ parts

$4.709

100+ parts

-

1k+ parts

$4.239

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58

$4.709

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$4.239

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MKK Technologies

India . 1,656 parts In-Stock

1+ parts

$8.856

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1,656

$8.856

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DigiPath Technology Company

USA . 1,656 parts In-Stock

1+ parts

$8.856

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1,656

$8.856

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Corphita

USA . 150 parts In-Stock

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150

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Parana Technologies

USA . 57 parts In-Stock

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$5.631

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57

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$5.631

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Overview

Unlock unparalleled performance and efficiency with the M36LLR8760M1ZAQE from STMicroelectronics. Renowned for its commitment to quality, STMicroelectronics delivers a powerful mixed memory solution that combines flash and PSRAM in a compact design. Perfect for multimedia applications and advanced consumer electronics, this versatile memory IC enhances data processing while minimizing power consumption. Experience reliability and innovation where it matters most.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability and performance in various applications.

Surface Mount: YES

Facilitates compact design and easier automated assembly, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of PCB space, enhancing overall layout flexibility.

Operating Mode: ASYNCHRONOUS

Enables faster data access, providing higher performance for applications that require quick response times.

Mixed Memory Type: FLASH+PSRAM

Combining Flash and PSRAM offers a balanced solution for both storage and speed, suitable for multifaceted applications.

Nominal Supply Voltage / Vsup: 1.8 V

Low voltage operation enhances power efficiency, making it ideal for battery-powered devices.

Power Supplies (V): 1.8

Consistent power supply requirement ensures compatibility with modern low-power design needs.

No. of Terminals: 88

A higher number of terminals can facilitate more connections, providing flexibility for advanced designs.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile fine pitch design minimizes the profile while maximizing performance, suitable for high-density applications.

Maximum Operating Temperature: 85 °C

High operational temperature range makes it suitable for use in demanding environments.

Organization: 16MX16

This memory organization allows for efficient data storage and retrieval, enhancing overall performance.

Minimum Operating Temperature: -25 °C

Designed to perform in low temperatures, making it ideal for applications in cooler climates or environments.

Terminal Finish: TIN SILVER COPPER

Provides excellent solderability and improved conductivity for reliable connections.

Terminal Position: BOTTOM

Bottom-positioned terminals enhance layout simplicity and design flexibility for PCB mounting.

Maximum Seated Height: 1.4 mm

Low seated height allows for better component stacking and reduced overall device thickness.

Width: 8 mm

Compact width supports efficient board layout, useful for miniaturized electronic products.

Minimum Supply Voltage (Vsup): 1.7 V

Flexible supply voltage requirements offer compatibility with a wide range of systems.

Length: 10 mm

The shorter length contributes to the device's compact profile, making it suitable for smaller applications.

Technology: CMOS

CMOS technology allows for lower power consumption and high-speed operation, enhancing performance.

Terminal Form: BALL

Ball terminal form allows for reliable connections and simplifies the soldering process during assembly.

Maximum Supply Current: 52 mA

Provides a good balance between performance and power consumption, suitable for various applications.

No. of Words: 16777216 words

Generous word count offers ample storage capacity for complex applications, ideal for data-intensive tasks.

Memory Width: 16

A 16-bit memory width enhances data throughput, making it suitable for high-speed applications.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density PCB design, which is crucial for modern electronics.

No. of Words Code: 16M

Reflects substantial memory capacity, making it well-suited for applications that require significant data storage.

Maximum Supply Voltage (Vsup): 1.95 V

Allows for slightly higher supply voltages, providing flexibility in system design and integration.

Memory Density: 268435456 bit

High memory density offers extensive storage capability, critical for data-intensive applications.

Memory IC Type: MEMORY CIRCUIT

Specialized type designed for reliable data storage and access, enhancing performance in various applications.

Maximum Standby Current: 0.00011 Amp

Ultra-low standby current maximizes battery life in portable devices, making it an eco-friendly choice.

Technical Specifications

Other Function Memory ICs M36LLR8760M1ZAQE attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Additional Features:

PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

JESD-30 Code:

R-PBGA-B88

JESD-609 Code:

e1

Length:

10 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

Mixed Memory Type:

FLASH+PSRAM

No. of Functions:

1

No. of Terminals:

88

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

16MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA88,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Standby Current:

.00011 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

52 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36LLR8760M1ZAQE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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