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M36L0R7040T0ZAQF

STMicroelectronics

M36L0R7040T0ZAQF by STMicroelectronics

M36L0R7040T0ZAQF by STMicroelectronics is a mixed memory IC featuring 8M x 16 organization, operating at a nominal voltage of 1.8V. It supports asynchronous operation and has a max temp of 85 °C, ideal for compact applications in consumer electronics. Its thin profile design ensures efficient space utilization in modern devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,814 parts In-Stock

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4,814

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Digiode

USA . 2,845 parts In-Stock

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2,845

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Anansix

USA . 191 parts In-Stock

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191

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 893 parts In-Stock

1+ parts

$4.077

100+ parts

-

1k+ parts

$3.670

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893

$4.077

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$3.670

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MKK Technologies

India . 2,112 parts In-Stock

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$7.667

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2,112

$7.667

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DigiPath Technology Company

USA . 2,112 parts In-Stock

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$7.667

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2,112

$7.667

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Corphita

USA . 2,768 parts In-Stock

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2,768

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Parana Technologies

USA . 2,109 parts In-Stock

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$4.875

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2,109

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$4.875

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Overview

Unlock unparalleled performance with the M36L0R7040T0ZAQF from STMicroelectronics, a leader in innovative memory solutions. This cutting-edge memory IC combines Flash and PSRAM technologies to deliver exceptional speed and efficiency in compact designs. With its robust temperature range and low power consumption, it’s perfect for a variety of applications—from IoT devices to advanced consumer electronics. Elevate your projects and enjoy reliable quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and lightweight, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and high-density circuit configurations.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for efficient layout.

Operating Mode: ASYNCHRONOUS

Asynchronous operation simplifies design and enhances performance in specific applications.

Mixed Memory Type: FLASH+PSRAM

Combining FLASH and PSRAM provides versatility in memory allocation for different tasks.

Nominal Supply Voltage / Vsup (V): 1.8

A low nominal supply voltage of 1.8V contributes to low power consumption, extending battery life in portable devices.

Power Supplies (V): 1.8

Consistent power supply requirements ensure compatibility with various low-power systems.

No. of Terminals: 88

With 88 terminals, the IC offers ample connectivity options for complex circuits.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style supports high-density interconnections in constrained spaces.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliable operation in demanding environments.

Organization: 8MX16

This organization provides an efficient data structure for quick access and retrieval.

Minimum Operating Temperature: -25 °C

Wide temperature range allows for operation in both harsh and extreme conditions.

Terminal Finish: TIN SILVER COPPER

Quality terminal finishes increase reliability and enhance solderability.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient heat dissipation during operation.

Maximum Seated Height: 1.2 mm

Low profile design allows for space-saving on circuits, ideal for portable devices.

Width: 8 mm

Compact width contributes to a smaller overall footprint on the PCB.

Minimum Supply Voltage (Vsup): 1.7 V

Flexible supply voltage allows for compatibility with a range of power supply systems.

Length: 10 mm

Short length enhances space efficiency, making it suitable for compact devices.

Technology: CMOS

CMOS technology provides high speed while minimizing power consumption, ideal for battery-powered devices.

Terminal Form: BALL

Ball terminals enhance mechanical stability and improve soldering reliability.

Maximum Supply Current: 47 mA

Limited maximum supply current contributes to energy efficiency in various applications.

No. of Words: 8388608 words

High word count supports substantial data storage capabilities for complex applications.

Memory Width: 16

A 16-bit memory width allows for efficient data processing and storage.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for more compact designs and higher density circuit integrations.

No. of Words Code: 8M

The 8M word capacity indicates robust memory storage essential for modern applications.

Maximum Supply Voltage (Vsup): 1.95 V

Supports a range of supply voltages, enhancing versatility in design.

Memory Density: 134217728 bit

High memory density enables storage of large amounts of data, making it suitable for sophisticated applications.

Memory IC Type: MEMORY CIRCUIT

Specific memory circuit type ensures functionality tailored to data storage and retrieval tasks.

Maximum Standby Current: 0.00007 Amp

Ultra-low standby current contributes significantly to power efficiency, essential for battery-operated devices.

Technical Specifications

Other Function Memory ICs M36L0R7040T0ZAQF attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Additional Features:

PSRAM IS ORGANIZED AS 1M X 16

JESD-30 Code:

R-PBGA-B88

JESD-609 Code:

e1

Length:

10 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

Mixed Memory Type:

FLASH+PSRAM

No. of Functions:

1

No. of Terminals:

88

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

8MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA88,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00007 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

47 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36L0R7040T0ZAQF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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