Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Micron Technology's MT29C4G48MAZBBAKS-48IT is a 512MX8 memory IC with 4294967296 bit memory density. Operating at 1.8V, it features synchronous mode and industrial temperature grade. Suitable for various applications requiring high-density memory solutions.
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PLASTIC/EPOXY - This material provides durability and protection for the memory IC, making it a reliable choice.
YES - Allows for easy and efficient installation on a circuit board, saving time and effort during assembly.
RECTANGULAR - This shape allows for a compact design, ideal for space-constrained applications.
SYNCHRONOUS - Ensures synchronized data transfer, improving overall system performance and efficiency.
1.8V - Low power consumption with a stable supply voltage for reliable operation.
137 - Sufficient number of terminals for connecting to other components, ensuring proper communication within the system.
GRID ARRAY, VERY THIN PROFILE, FINE PITCH - This style enhances thermal performance while allowing for high-density integration on a PCB.
85 °C - Wide temperature range makes it suitable for a variety of environments, from industrial to consumer electronics.
512MX8 - Efficient memory organization for storing and accessing data with ease.
40 °C - Capable of operating in extreme temperature conditions without compromising performance.
TIN SILVER COPPER - Provides strong and reliable connections for efficient data transfer.
BOTTOM - Simplifies the installation process and improves accessibility during maintenance and repairs.
1 mm - Low profile design for easy integration in space-constrained applications.
10.5 mm - Compact width for fitting into tight spaces while ensuring proper functionality.
1.7V - Allows for operation at lower voltages, saving power and reducing energy consumption.
30s - Allows for easy soldering during assembly, ensuring a secure connection to the PCB.
260C - Withstands high-temperature reflow processes during assembly with no damage to the IC.
13 mm - Optimized length for fitting into various electronic devices without taking up too much space.
INDUSTRIAL - Suitable for industrial applications requiring high reliability and durability in harsh environments.
CMOS - Utilizes advanced CMOS technology for efficient and reliable memory operations.
BALL - Provides a reliable connection and easy installation on the PCB.
536870912 words - Large storage capacity for storing a vast amount of data efficiently.
8 - Optimized memory width for efficient data transfer and processing.
0.8 mm - Fine pitch design for high-density integration on a PCB.
512M - Represents high memory capacity for storing and accessing data effectively.
1.95V - Safe maximum supply voltage for stable operation without risking damage to the IC.
4294967296 bit - High memory density for storing a large amount of data in a compact form factor.
MEMORY CIRCUIT - Versatile memory IC suitable for a wide range of applications requiring reliable data storage and access.
Other Function Memory ICs MT29C4G48MAZBBAKS-48IT attributes and parameters. Explore more Other Function Memory ICs devices from Micron Technology
Additional Features:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
MT29C4G48MAZBBAKS-48IT Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Assembly/Origin - Tray Pkg Label Chgs 8/Oct/2020
PCN Packaging - Memory 24-May-2022 Tray 05-May-2022
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
ULN2803ADWG4
Texas Instruments
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
OPA2277UA/2K5E4
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
LM317TG
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
BAV99
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
1N4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
LM107H/883C
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32F103C8T6
STMicroelectronics
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
CRG0805F10K
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10000 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
LM317AEMP/NOPB
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Microsemi
DS1207-G02
DS1207-G02 by Analog Devices is a CMOS MEMORY CIRCUIT with 5 terminals, operating SYNCHRONOUSLY at temperatures from 0 °C to 70°C. Its RECTANGULAR package shape and TIN LEAD terminal finish make it ideal for COMMERCIAL applications.
CC2544RHBT
The Texas Instruments CC2544RHBT is a square chip carrier with a clock frequency of 2496 MHz, suitable for automotive applications. Operating temperature ranges from -40 to 125°C, with supply voltage ranging from 2V to 3.6V. Ideal for memory circuits requiring high-speed performance in compact designs.
MR2A16AVYS35
Everspin Technologies
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
M36W0R6030B0ZAQE
M36W0R6030B0ZAQE by STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It combines FLASH and SRAM in a compact grid array package, ideal for industrial applications. With an access time of 70 ns and temp range from -40 °C to 85 °C, it ensures reliable performance.
M36W108T120ZN6
M36W108T120ZN6 from STMicroelectronics is a mixed memory IC featuring 1M x 8 organization with Flash+SRAM technology. It operates asynchronously at temperatures ranging from -40 °C to 85°C, supporting supply voltages of 2.7V to 3.6V. Ideal for industrial applications, it offers a max access time of 120 ns and comes in a very thin profile grid array package.
M36W108T100ZN5
M36W108T100ZN5 from STMicroelectronics is a mixed FLASH+SRAM memory IC with a 1MX8 organization, ideal for asynchronous applications. It operates b/w 2.7V and 3.6V, featuring a max access time of 100ns and a temp range of -20 °C to 85°C. Its compact design (9.8mm x 11.8mm) suits space-constrained devices.
DS1996L-F5
Maxim Integrated
DS1996L-F5 by Maxim Integrated is a 64KX1 MEMORY CIRCUIT with 65536 bit Memory Density. It operates in ASYNCHRONOUS mode at -40 to 70 °C, with Power Supplies of 3/5 V. This METAL DISK BUTTON IC is used for data storage applications requiring fast access times up to 15000 ns.
WSF512K16-39H2I
Mercury Systems
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: PGA; Package Shape: SQUARE; Memory Density: 8388608 bit;
DS28E80Q+U
MEMORY CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn) - annealed; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1;
SN74S262NP1
SN74S262NP1 by Texas Instruments is a TTL memory circuit IC with 20 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, suitable for commercial applications. The through-hole terminals are spaced at 2.54mm pitch, making it ideal for various function memory circuits.
M36W108T120ZM6T
STMicroelectronics M36W108T120ZM6T is a 1MX8 memory IC with 8388608 bit memory density. It operates in industrial temperature range (-40 to 85 °C) and supports asynchronous mode. The package is rectangular, low profile grid array with 48 terminals, suitable for various applications requiring high-density memory solutions.
M36W108T100ZN6
M36W108T100ZN6 by STMicroelectronics is a versatile memory IC featuring 1M x 8 organization, operating in asynchronous mode. It supports a supply voltage range of 2.7V to 3.6V and operates within -40 °C to 85°C, making it ideal for industrial applications. Its thin profile and surface mount design enhance space efficiency in electronic devices.
TMS27PC240-12FLN
Other Memory ICs;
DS2401P/T&R
Dallas Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 6 V;
DS6204U-XXX
DS6204U-XXX by Analog Devices is a 128x1 memory circuit IC with synchronous operation. Featuring CMOS technology, it has 128-bit memory density and uses tin lead terminal finish. This rectangular package is ideal for applications requiring specialized shape memory ICs.
M36W108B120ZM6T
STMicroelectronics M36W108B120ZM6T is a 1MX8 memory IC with 8388608 bit memory density. It operates in industrial temperature range (-40 to 85 °C) and supports asynchronous mode. With low profile grid array package, it's ideal for applications requiring high-speed data storage and retrieval.
TMS4103NC
TMS4103NC by Texas Instruments is a MOS memory circuit IC with 28 terminals in an in-line rectangular package. It operates b/w -25°C to 85°C, making it suitable for various applications requiring reliable memory storage and retrieval. The through-hole terminal form and 2.54mm pitch enhance its versatility in electronic devices.
TMS27C32-10NE4
DS2411P+T&R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Qualification: Not Qualified;
TMS2564-45JDL
TMS2564-45JDL by Texas Instruments is an 8KX8 MOS memory IC with 65536 bit density and 450 ns access time. It features a 3-STATE output, operates b/w 0 to 70 °C, and has a DUAL terminal position. Ideal for applications requiring fast data retrieval in commercial temperature environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MT29F4G01ADAGDWB-IT:GTR
Micron Technology
MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MT29F4G01ADAGDWB-IT:G
MT29C4G48MAZBAAKQ-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
MT29C8G96MAZBADKD-5WT
MT29C8G96MAZBADKD-5WT by Micron Technology is a 64MX32 memory IC with 67108864 words and 2147483648 bit memory density. Operating at 1.7-1.95V, it has a synchronous mode and thin profile grid array package shape. Ideal for applications requiring high-speed data processing in compact electronic devices.
MT29PZZZ4D4BKEPK-18W.94H
MEMORY CIRCUIT;
MT29C4G96MAZBACJG-5WT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;
MT29C4G48MAYBBAKS-48IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 137; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1 mm;
MT29GZ5A5BPGGA-046IT.87J
MEMORY CIRCUIT; No. of Terminals: 149; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Width: 16; No. of Words: 268435456 words;
MT29C4G96MAZAPCJG-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Terminal Form: BALL;
MT29GZ6A6BPIET-046AIT.112
MEMORY CIRCUIT; No. of Terminals: 149; Package Code: VFBGA; Package Shape: RECTANGULAR; Organization: 512MX16; No. of Words Code: 512M;
MT29GZ6A6BPIET-53AAT.112
MEMORY CIRCUIT; No. of Terminals: 149; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Memory Density: 8589934592 bit;
MT29C1G12MAURACA-75IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 152; Package Code: VFBGA; Package Shape: SQUARE; Surface Mount: YES;
MT29C1G12MAAIYAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
MT29C1G12MAVRACA-6IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 152; Package Code: VFBGA; Package Shape: SQUARE; Length: 14 mm;
MT29C1G12MAVRACA-75IT
MT29C1G12MAADVAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
MT29C1G12MAAIYAMR-5AIT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B130;
MT29C2DAJG-DC
MT29C2G24MAAAAHAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;
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