Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Micron Technology's MT29GZ6A6BPIET-53AAT.112 is a 512MX16 FLASH+LPDDR memory IC with 149 terminals in a compact GRID ARRAY package. Operating at 1.8V, it offers synchronous mode and AEC-Q100 screening for automotive applications, with a wide temperature range from -40 to 105°C.
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Vyrian
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Nova Conductors
Netsource Technology, Inc.
Argo Parts USA
Continental Prestige Electronics
Corphita
Authorized Procurement Solutions
Aranea Global
Durable and lightweight material ensures the product is robust and easy to handle.
Allows for easy and secure mounting on circuit boards, saving space and enhancing stability.
Synchronous operation ensures precise timing and coordination, optimizing performance.
Operates efficiently at a standard voltage, ensuring compatibility with various systems.
Wider memory width allows for faster data transfer and processing capabilities.
CMOS technology offers low power consumption and high speed operation for energy-efficient performance.
Fast access time ensures quick retrieval of data, enhancing overall system speed and responsiveness.
Other Function Memory ICs MT29GZ6A6BPIET-53AAT.112 attributes and parameters. Explore more Other Function Memory ICs devices from Micron Technology
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MT29GZ6A6BPIET-53AAT.112 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
LM78L05ACMX/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
LL4148
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
NC7WZ17P6X
Onsemi
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
SN65HVD234DR
Texas Instruments
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
2N2222A
Fairchild Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
LM358AN
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
Semiconductors
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DP83848IVVX/NOPB
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
DS1204U-G04
Analog Devices
DS1204U-G04 by Analog Devices is a 128-bit MEMORY CIRCUIT with 128x1 organization. It operates SYNCHRONOUSLY at 5V, suitable for COMMERCIAL use up to 70 °C. This RECTANGULAR IC in SPECIAL SHAPE package is ideal for applications requiring reliable memory storage.
M38510/31901BEX
M38510/31901BEX by Texas Instruments is a MILITARY-grade MEMORY CIRCUIT with 16-bit memory density. It operates ASYNCHRONOUSLY at temperatures ranging from -55 to 125 °C, ideal for applications requiring reliable performance in harsh environments. The IC features a 4x4 organization and comes in a CERAMIC, METAL-SEALED COFIRED package with 16 terminals.
CY8C20110-SX2I
Cypress Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
CY15B102Q-SXET
Infineon Technologies
Infineon's CY15B102Q-SXET is a 256Kx8 memory IC with synchronous operation, suitable for automotive applications. It operates at 3.3V with power supplies of 2.5/3.3V, featuring a small outline package style and Gull Wing terminal form. With a max operating temperature of 125°C, it offers high memory density of 2097152 bits for reliable performance in automotive environments.
TMS4103NC
TMS4103NC by Texas Instruments is a MOS memory circuit IC with 28 terminals in an in-line rectangular package. It operates b/w -25°C to 85°C, making it suitable for various applications requiring reliable memory storage and retrieval. The through-hole terminal form and 2.54mm pitch enhance its versatility in electronic devices.
CY8C20110-SX2IT
MEMORY CIRCUIT; Moisture Sensitivity Level (MSL): 3;
CY15B108QN-20LPXCES
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; No. of Words: 1048576 words;
MR2A16ACMA35
Everspin Technologies
MR2A16ACMA35 by Everspin: 256KX16 memory IC with 35ns access time, operates at 3.3V. Suitable for industrial applications, features low profile grid array package and CMOS technology.
M36W108T100ZN1
STMicroelectronics
M36W108T100ZN1 by STMicroelectronics is a mixed memory IC featuring 1M x 8 organization with FLASH+SRAM technology. It operates asynchronously at voltages b/w 2.7V and 3.6V, with a max access time of 100 ns. Ideal for commercial applications, it supports surface mount in a very thin profile package.
SAA4955TJ
NXP Semiconductors
SAA4955TJ by NXP Semiconductors is a memory circuit IC with 245772x12 organization and 2949264 bit memory density. It operates synchronously at a nominal voltage of 3.3V and has a max access time of 21ns. This IC is commonly used in applications requiring small outline package style and commercial temperature grade.
DS2401A+
MEMORY CIRCUIT;
M36LLR8760T1ZAQ
M36LLR8760T1ZAQ by STMicroelectronics is a low-profile, asynchronous memory IC featuring 16M words of mixed FLASH+PSRAM. It operates at a nominal voltage of 1.8V and supports temperatures from -25 °C to 85 °C. Ideal for compact applications requiring efficient data storage and retrieval.
DS6204U-2
DS6204U-2 by Analog Devices is a 256-bit MEMORY CIRCUIT with 256X1 organization. Operating b/w 0 °C to 70°C, it features CMOS technology and TIN LEAD terminal finish. Ideal for applications requiring Other Function Memory ICs in commercial temperature grade environments.
TMS27C32-100NL4
Other Memory ICs;
DS1994L-F5
Maxim Integrated
DS1994L-F5 by Maxim Integrated is a 4096-bit MEMORY CIRCUIT with 4KX1 organization. It operates in ASYNCHRONOUS mode at temperatures from -40 to 70°C. This METAL package IC has a supply voltage range of 2.8-6V, making it suitable for various applications requiring reliable memory storage.
TMS27C32-12NE
TMX27C512-45
TMS4020NC
TMS4020NC by Texas Instruments is a 1KX2 MOS memory IC with 2048-bit density. It features separate I/O, open-drain output, and operates b/w -25°C to 70°C. Commonly used in applications requiring high-density memory storage with dual-terminal positions.
DS1963S-F5+
MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SN74170JP4
SN74170JP4 by Texas Instruments is a TTL memory IC with 16 terminals, operating at 5V. It has a rectangular ceramic package and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring reliable memory functions in electronic circuits.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MT29F4G01ADAGDWB-IT:GTR
Micron Technology
MT29F4G01ADAGDWB-IT:G
MT29C4G48MAZBAAKQ-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
MT29C8G96MAZBADKD-5WT
MT29C8G96MAZBADKD-5WT by Micron Technology is a 64MX32 memory IC with 67108864 words and 2147483648 bit memory density. Operating at 1.7-1.95V, it has a synchronous mode and thin profile grid array package shape. Ideal for applications requiring high-speed data processing in compact electronic devices.
MT29PZZZ4D4BKEPK-18W.94H
MT29C4G96MAZBACJG-5WT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;
MT29C4G48MAZBBAKS-48IT
Micron Technology's MT29C4G48MAZBBAKS-48IT is a 512MX8 memory IC with 4294967296 bit memory density. Operating at 1.8V, it features synchronous mode and industrial temperature grade. Suitable for various applications requiring high-density memory solutions.
MT29C4G48MAYBBAKS-48IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 137; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1 mm;
MT29GZ5A5BPGGA-046IT.87J
MEMORY CIRCUIT; No. of Terminals: 149; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Width: 16; No. of Words: 268435456 words;
MT29C4G96MAZAPCJG-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Terminal Form: BALL;
MT29GZ6A6BPIET-046AIT.112
MEMORY CIRCUIT; No. of Terminals: 149; Package Code: VFBGA; Package Shape: RECTANGULAR; Organization: 512MX16; No. of Words Code: 512M;
MT29C1G12MAURACA-75IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 152; Package Code: VFBGA; Package Shape: SQUARE; Surface Mount: YES;
MT29C1G12MAAIYAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
MT29C1G12MAVRACA-6IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 152; Package Code: VFBGA; Package Shape: SQUARE; Length: 14 mm;
MT29C1G12MAVRACA-75IT
MT29C1G12MAADVAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
MT29C1G12MAAIYAMR-5AIT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B130;
MT29C2DAJG-DC
MT29C2G24MAAAAHAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;
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