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MT29GZ6A6BPIET-53AAT.112

Micron Technology

MT29GZ6A6BPIET-53AAT.112 by Micron Technology

Micron Technology's MT29GZ6A6BPIET-53AAT.112 is a 512MX16 FLASH+LPDDR memory IC with 149 terminals in a compact GRID ARRAY package. Operating at 1.8V, it offers synchronous mode and AEC-Q100 screening for automotive applications, with a wide temperature range from -40 to 105°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 20,900 parts In-Stock

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Vyrian

USA . 549 parts In-Stock

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Digiode

USA . 456 parts In-Stock

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456

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Nova Conductors

Japan . 84 parts In-Stock

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Netsource Technology, Inc.

USA . 40 parts In-Stock

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Argo Parts USA

USA . 5,817 parts In-Stock

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5,817

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Continental Prestige Electronics

USA . 1,495 parts In-Stock

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Corphita

USA . 678 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Aranea Global

USA . 100 parts In-Stock

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Overview

Experience the cutting-edge technology of Micron Technology with the MT29GZ6A6BPIET-53AAT.112. This top-of-the-line memory IC boasts unparalleled quality and reliability, making it ideal for a wide range of applications. From automotive to industrial use, this versatile component offers unmatched performance and efficiency. Trust Micron Technology to deliver exceptional value and benefits, ensuring that your projects run smoothly and seamlessly. Upgrade to the MT29GZ6A6BPIET-53AAT.112 today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures the product is robust and easy to handle.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and enhancing stability.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination, optimizing performance.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a standard voltage, ensuring compatibility with various systems.

Memory Width: 16

Wider memory width allows for faster data transfer and processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation for energy-efficient performance.

Maximum Access Time: 3.5 ns

Fast access time ensures quick retrieval of data, enhancing overall system speed and responsiveness.

Technical Specifications

Other Function Memory ICs MT29GZ6A6BPIET-53AAT.112 attributes and parameters. Explore more Other Function Memory ICs devices from Micron Technology

Specs

Maximum Access Time:

3.5 ns

JESD-30 Code:

R-PBGA-B149

Length:

9.5 mm

Memory Density:

8589934592 bit

Memory IC Type:

Memory Width:

16

Mixed Memory Type:

FLASH+LPDDR

No. of Functions:

1

No. of Terminals:

149

No. of Words:

536870912 words

No. of Words Code:

512M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA149,14X16,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

MT29GZ6A6BPIET-53AAT.112 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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