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MT29C4G48MAZBAAKQ-5IT

Micron Technology

MT29C4G48MAZBAAKQ-5IT by Micron Technology

Micron Technology's MT29C4G48MAZBAAKQ-5IT is a 256MX16 Synchronous Flash+SDRAM memory IC with 4294967296 bit density. Operating at 1.8V, it offers a max access time of 25ns and operates in industrial temperature range. Suitable for applications requiring high-speed data processing and storage in compact devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Chip Stock

USA . 17,200 parts In-Stock

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Vyrian

USA . 1,061 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Digiode

USA . 311 parts In-Stock

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PC Components Company LLC

USA . 35 parts In-Stock

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Bristol Electronics

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QIE Inc.

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AZTECH Wire

Italy . 636 parts In-Stock

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$12.540

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Ampacity Inc.

Singapore . 1,520 parts In-Stock

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$22.000

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A-Z Elektronik GmbH

Germany . 5,405 parts In-Stock

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Continental Prestige Electronics

USA . 5,339 parts In-Stock

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Kepictronics

USA . 930 parts In-Stock

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Argo Parts USA

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Corphita

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the cutting-edge MT29C4G48MAZBAAKQ-5IT by Micron Technology, a top-tier manufacturer known for delivering high-quality memory ICs. This innovative product falls under the category of Other Function Memory ICs, offering a unique blend of FLASH and SDRAM technology for optimal performance. With a nominal supply voltage of 1.8V, this memory IC boasts a range of applications across various industries. Elevate your projects with this versatile solution that guarantees reliability, speed, and efficiency. Unlock endless possibilities with Micron's MT29C4G48MAZBAAKQ-5IT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the memory IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Mixed Memory Type: FLASH+SDRAM

Combining both Flash and SDRAM memory types allows for versatile applications and efficient data storage and retrieval.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a standard voltage level, ensuring compatibility with various systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Memory Density: 4294967296 bit

High memory density allows for storage of large amounts of data efficiently.

Technical Specifications

Other Function Memory ICs MT29C4G48MAZBAAKQ-5IT attributes and parameters. Explore more Other Function Memory ICs devices from Micron Technology

Specs

Maximum Access Time:

25 ns

JESD-30 Code:

S-PBGA-B168

JESD-609 Code:

e1

Length:

12 mm

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

16

Mixed Memory Type:

FLASH+SDRAM

No. of Functions:

1

No. of Terminals:

168

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA168,23X23,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

.75 mm

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

12 mm

Trade Compliance

MT29C4G48MAZBAAKQ-5IT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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