Loading...

TMS2564-45JL

Texas Instruments

TMS2564-45JL by Texas Instruments

TMS2564-45JL by Texas Instruments is an 8KX8 memory IC with 65536 bit density and 450 ns access time. It features a MOS technology, operates b/w 0 to 70 °C, and has a package style of IN-LINE. Ideal for applications requiring fast data retrieval in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,131

-

-

-

-

Digiode

USA . 4,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,263

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,286 parts In-Stock

1+ parts

$5.257

100+ parts

-

1k+ parts

$5.880

10k+ parts

-

1,286

$5.257

-

$5.880

-

DigiPath Technology Company

USA . 117 parts In-Stock

1+ parts

$5.789

100+ parts

$5.326

1k+ parts

-

10k+ parts

-

117

$5.789

$5.326

-

-

ChromeModa Solutions

Germany . 4,395 parts In-Stock

1+ parts

$5.907

100+ parts

$4.844

1k+ parts

-

10k+ parts

-

4,395

$5.907

$4.844

-

-

IDEA Electronic Components Group

UK . 674 parts In-Stock

1+ parts

$5.907

100+ parts

-

1k+ parts

$5.316

10k+ parts

-

674

$5.907

-

$5.316

-

AZTECH Wire

Italy . 652 parts In-Stock

1+ parts

$11.013

100+ parts

-

1k+ parts

-

10k+ parts

-

652

$11.013

-

-

-

One Stop Electronics

USA . 798 parts In-Stock

1+ parts

$23.000

100+ parts

-

1k+ parts

-

10k+ parts

-

798

$23.000

-

-

-

Corphita

USA . 3,543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,543

-

-

-

-

Overview

Experience superior quality and reliability with the TMS2564-45JL by Texas Instruments, a leading manufacturer in the industry. This memory IC offers unparalleled performance and versatility, making it ideal for a wide range of applications. Whether you're looking to upgrade existing systems or develop new solutions, this product delivers value, efficiency, and innovation. Trust Texas Instruments for cutting-edge technology that meets your needs and exceeds expectations. Elevate your projects with the TMS2564-45JL and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and are highly resistant to chemical and environmental damage, making this product durable and reliable.

Input/Output Type: COMMON

Common input/output type simplifies the integration of this memory IC into various systems, ensuring compatibility and ease of use.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options and enables the memory IC to interface with a wide range of devices and circuits.

Organization: 8KX8

The 8Kx8 organization means that this memory IC can store 8,192 words of data with each word being 8 bits wide, providing sufficient storage capacity for many applications.

Output Characteristics: 3-STATE

3-state output characteristics allow the memory IC to control the flow of data effectively, enabling efficient data transmission and processing.

Technology: MOS

MOS technology offers low power consumption and high speed performance, making this memory IC energy-efficient and capable of handling complex tasks swiftly.

Memory Density: 65536 bit

With a memory density of 65,536 bits, this memory IC offers ample storage capacity for data-intensive applications, ensuring efficient data management and processing.

Maximum Access Time: 450 ns

The maximum access time of 450 nanoseconds ensures fast data retrieval and access, enhancing the overall performance of the memory IC in time-critical tasks.

Technical Specifications

Other Function Memory ICs TMS2564-45JL attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

450 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T28

Memory Density:

65536 bit

Memory Width:

8

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2564-45JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20