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DS2502X1+U

Analog Devices

DS2502X1+U by Analog Devices

DS2502X1+U by Analog Devices is a 1024-bit OTP ROM memory IC with 128x8 organization. It operates at temperatures from -40 to 85°C, suitable for industrial applications. With common I/O type and 3/5V power supplies, it's ideal for surface-mount designs in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

DS2502X1+U by Analog Devices
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Distributors (In-Stock)

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Digiode

USA . 3,092 parts In-Stock

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Vyrian

USA . 1,081 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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Anansix

USA . 804 parts In-Stock

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Semi Source

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Aztec Data Supply Inc.

USA . 165 parts In-Stock

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$2.292

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MARBEL Systems

Belgium . 3,004 parts In-Stock

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$2.506

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Texas Native Microelectronics

USA . 30 parts In-Stock

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$2.880

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$2.765

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$2.678

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$2.534

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Kenton Components

USA . 1,000 parts In-Stock

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$3.456

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$3.041

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Corohmni

South Africa . 65 parts In-Stock

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$3.487

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Qasali Group International

UK . 300 parts In-Stock

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$7.776

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$7.232

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$6.843

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One Stop Electronics

USA . 503 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 784 parts In-Stock

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Semicontronic

India . 308 parts In-Stock

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$13.000

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$12.675

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$12.610

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Ampacity Inc.

Singapore . 393 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,509 parts In-Stock

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Microchip USA

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

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Vigor

Singapore . 329 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the DS2502X1+U by Analog Devices, a leading manufacturer in the industry. This versatile memory IC offers endless possibilities for applications in various fields. With its common input/output type and industrial temperature grade, this product ensures optimal performance and longevity. Unlock the full potential of your projects with the DS2502X1+U's 1024-bit memory density and lightning-fast access time. Trust Analog Devices to deliver cutting-edge solutions that exceed expectations and provide unmatched value to customers. Elevate your designs and elevate your success with the DS2502X1+U.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the memory IC, ensuring long-lasting performance.

Surface Mount: YES

Surface mount design makes installation and integration into circuit boards easier and more efficient.

Input/Output Type: COMMON

Common input/output type allows for compatibility with a wide range of devices and systems.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V/5V) offers flexibility in different operating environments.

No. of Terminals: 4

Having 4 terminals allows for straightforward connectivity and signal processing.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliability and stable performance in various conditions.

Organization: 128X8

Organized into 128 words of 8 bits each, providing efficient and organized memory storage and retrieval.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for use in harsh or extreme environments without issues.

Terminal Finish: TIN SILVER COPPER NICKEL

Terminal finish with multiple materials ensures strong and reliable connections for data transfer.

Maximum Time At Peak Reflow Temperature (s): 30

Max time at peak reflow temperature of 30 seconds provides optimal soldering conditions for assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C enables secure and durable solder joints during the manufacturing process.

Temperature Grade: INDUSTRIAL

Industrial temperature grade makes this memory IC suitable for use in industrial settings with varying temperature conditions.

No. of Words: 128

With 128 words of memory, this IC offers sufficient storage capacity for data and program storage.

Memory Width: 8

Memory width of 8 bits allows for versatility and compatibility with different data formats and processing requirements.

No. of Words Code: 128

Having 128 word code provides specific addressing and organization for efficient data access and manipulation.

Memory Density: 1024 bit

High memory density of 1024 bits offers ample space for storing data and programs efficiently.

Memory IC Type: OTP ROM

OTP (One-Time Programmable) ROM type ensures secure and reliable data storage that cannot be altered once programmed.

Maximum Access Time: 15000 ns

Fast maximum access time of 15000 ns enables quick retrieval and processing of data for responsive system performance.

Technical Specifications

Other Function Memory ICs DS2502X1+U attributes and parameters. Explore more Other Function Memory ICs devices from Analog Devices

Specs

Maximum Access Time:

15000 ns

Input/Output Type:

COMMON

JESD-609 Code:

e2

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

4

No. of Words:

128 words

No. of Words Code:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA4,2X2,37/16

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER NICKEL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

DS2502X1+U Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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