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TMS2564JDL

Texas Instruments

TMS2564JDL by Texas Instruments

TMS2564JDL by Texas Instruments is an 8KX8 memory IC with 65536-bit density and 450ns access time. Featuring a MOS technology, it has a temperature range of 0-70°C. Commonly used in applications requiring fast data retrieval such as embedded systems and industrial automation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,929 parts In-Stock

1+ parts

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3,929

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Vyrian

USA . 2,345 parts In-Stock

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2,345

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Q Components

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,133 parts In-Stock

1+ parts

$1.925

100+ parts

-

1k+ parts

$2.461

10k+ parts

-

2,133

$1.925

-

$2.461

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DigiPath Technology Company

USA . 2,179 parts In-Stock

1+ parts

$2.120

100+ parts

$1.950

1k+ parts

-

10k+ parts

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2,179

$2.120

$1.950

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ChromeModa Solutions

Germany . 6,709 parts In-Stock

1+ parts

$2.163

100+ parts

$1.774

1k+ parts

-

10k+ parts

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6,709

$2.163

$1.774

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IDEA Electronic Components Group

UK . 1,959 parts In-Stock

1+ parts

$2.163

100+ parts

-

1k+ parts

$1.947

10k+ parts

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1,959

$2.163

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$1.947

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One Stop Electronics

USA . 1,153 parts In-Stock

1+ parts

$8.000

100+ parts

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1,153

$8.000

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AZTECH Wire

Italy . 230 parts In-Stock

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$13.154

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230

$13.154

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Corphita

USA . 1,080 parts In-Stock

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1,080

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Overview

Unlock the power of reliable memory storage with the TMS2564JDL by Texas Instruments. Crafted with superior quality and precision, this memory IC offers unmatched performance in a variety of applications. From industrial automation to consumer electronics, this versatile component delivers seamless functionality and fast access times. Trust in Texas Instruments' reputation for excellence and choose the TMS2564JDL for all your memory needs. Experience the value and benefits of this top-tier product today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides durability and good thermal conductivity, ensuring reliability and efficient heat dissipation for the memory IC.

No. of Terminals: 28

With 28 terminals, this memory IC offers versatility in connectivity options, allowing for more complex circuit designs.

Organization: 8KX8

The organization of 8Kx8 means that the memory IC can store 8 kilobits of data in 8-bit chunks, providing a balance between storage capacity and retrieval speed.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this memory IC can function effectively in a wide range of operating conditions.

Technology: MOS

Using MOS technology, this memory IC offers high speed and low power consumption, making it suitable for various applications where efficiency is crucial.

Technical Specifications

Other Function Memory ICs TMS2564JDL attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

450 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T28

Memory Density:

65536 bit

Memory Width:

8

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2564JDL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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