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MR2A16AVYS35

NXP Semiconductors

MR2A16AVYS35 by NXP Semiconductors

The NXP Semiconductors MR2A16AVYS35 is a 256Kx16 memory IC with CMOS technology. It operates asynchronously at temperatures ranging from -40 to 105°C, with a supply voltage of 3-3.6V. This small outline, thin profile package is ideal for industrial applications requiring high memory density and reliability.

Median Price

$33.540

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 33 parts In-Stock

1+ parts

$33.540

100+ parts

$27.580

1k+ parts

$26.270

10k+ parts

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33

$33.540

$27.580

$26.270

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Verical

USA . 33 parts In-Stock

1+ parts

$33.540

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$27.580

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$26.270

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33

$33.540

$27.580

$26.270

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Mouser Electronics

USA . 75 parts In-Stock

1+ parts

$44.800

100+ parts

$37.790

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75

$44.800

$37.790

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EBV Elektronik

Germany . 135 parts In-Stock

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135

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Distributors (In-Stock)

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Digiode

USA . 4,840 parts In-Stock

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$26.334

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4,840

$26.334

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Nova Conductors

Japan . 700 parts In-Stock

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$30.730

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$30.730

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Vyrian

USA . 2,444 parts In-Stock

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2,444

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Anansix

USA . 1,831 parts In-Stock

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Component Sense

UK . 211 parts In-Stock

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211

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NAC Semi

USA . 135 parts In-Stock

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$67.820

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135

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$67.820

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Cyclops Electronics Ltd

UK . 14 parts In-Stock

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Inventory MP

USA . 6 parts In-Stock

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Bristol Electronics

USA . 6 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,822 parts In-Stock

1+ parts

$2.355

100+ parts

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4,822

$2.355

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AZTECH Wire

Italy . 220 parts In-Stock

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$5.861

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220

$5.861

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Ampacity Inc.

Singapore . 139 parts In-Stock

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$23.560

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139

$23.560

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Corphita

USA . 2,704 parts In-Stock

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$24.948

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2,704

$24.948

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Continental Prestige Electronics

USA . 1,419 parts In-Stock

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$28.794

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$28.218

1,419

$28.794

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$28.218

Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$31.659

100+ parts

$30.076

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$30.076

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300

$31.659

$30.076

$30.076

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 3,360 parts In-Stock

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3,360

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QUARKTWIN TECHNOLOGY LTD

USA . 3,286 parts In-Stock

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3,286

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GreenTree Electronics

Israel . 1,350 parts In-Stock

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UNI Independent Distributors

Spain . 904 parts In-Stock

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904

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Perfect Parts

USA . 330 parts In-Stock

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330

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Glotronic Ltd.

UK . 108 parts In-Stock

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108

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Overview

Unleash the power of innovation with the MR2A16AVYS35 by NXP Semiconductors. This cutting-edge Other Function Memory IC boasts top-notch quality and reliability, thanks to its renowned manufacturer. Ideal for a wide range of applications, this memory circuit offers exceptional value and benefits to customers. Experience seamless performance and unmatched efficiency with this advanced technology, setting new standards in the industry. Elevate your projects to new heights with the MR2A16AVYS35 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the memory IC, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and facilitating mass production.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables flexible and independent access to the memory, improving efficiency and data retrieval speed.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V ensures compatibility with standard electronic systems and energy efficiency.

No. of Terminals: 44

Having 44 terminals allows for a greater variety of connection options, enhancing flexibility in system integration.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this memory IC can withstand harsh environmental conditions and extended usage.

Memory Density: 4194304 bit

High memory density of 4194304 bits ensures ample storage capacity for data-intensive applications, making it a reliable choice for memory storage.

Technical Specifications

Other Function Memory ICs MR2A16AVYS35 attributes and parameters. Explore more Other Function Memory ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G44

Length:

18.41 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

MR2A16AVYS35 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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