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MR2A16ATS35C

Freescale Semiconductor

MR2A16ATS35C by Freescale Semiconductor

MR2A16ATS35C by Freescale Semiconductor is a 256KX16 memory IC with 35 ns access time, operating at 3.3V. It features a small outline, thin profile package style and Gull Wing terminal form. Ideal for applications requiring high-speed data storage in commercial temperature environments.

Median Price

$23.946

Lifecycle Status

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Nova Conductors

Japan . 100 parts In-Stock

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AZTECH Wire

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One Stop Electronics

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Continental Prestige Electronics

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Netroflash

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Microchip USA

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Overview

Experience unmatched reliability and performance with the MR2A16ATS35C by Freescale Semiconductor. As a leading manufacturer in the industry, Freescale Semiconductor delivers cutting-edge memory ICs like the MR2A16ATS35C that offer exceptional value and benefits to customers. Ideal for a wide range of applications, this memory circuit provides high-quality storage solutions with fast access times and low standby currents. Trust Freescale Semiconductor to provide you with top-notch products that exceed expectations. Elevate your projects with the MR2A16ATS35C today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection to the memory IC, making it suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the memory IC onto PCBs, saving time and effort during assembly.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode enables flexible data access and processing, making the memory IC versatile for different applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V provides efficiency and reliability in power consumption for the memory IC.

Organisation: 256KX16

With an organization of 256KX16, the memory IC offers a high capacity and data width for storing and accessing large amounts of information efficiently.

Maximum Operating Temperature: 70 °C

The memory IC can operate effectively in a wide range of temperatures up to 70°C, ensuring reliable performance in various environments.

Technology: CMOS

Utilizing CMOS technology, the memory IC delivers low power consumption and high-speed performance, ideal for applications requiring efficient data processing.

Technical Specifications

Other Function Memory ICs MR2A16ATS35C attributes and parameters. Explore more Other Function Memory ICs devices from Freescale Semiconductor

Specs

Maximum Access Time:

35 ns

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.41 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.028 Amp

Sub-Category:

SRAMs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10.16 mm

Trade Compliance

MR2A16ATS35C Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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