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MR2A16AVYS35R

Freescale Semiconductor

MR2A16AVYS35R by Freescale Semiconductor

MR2A16AVYS35R by Freescale Semiconductor is a 256Kx16 memory IC with 4194304-bit density. Operating at 3.3V, it has an access time of 35ns and max standby current of 0.028A. Ideal for commercial applications requiring fast asynchronous memory performance in a small outline package.

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Vyrian

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One Stop Electronics

USA . 342 parts In-Stock

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$7.000

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AZTECH Wire

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Ampacity Inc.

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QUARKTWIN TECHNOLOGY LTD

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Argo Parts USA

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Overview

Experience the top-notch quality and reliability of Freescale Semiconductor with the MR2A16AVYS35R memory circuit. This innovative product offers a wide range of applications in various industries, providing customers with unmatched value and benefits. From its compact design to its efficient performance, this memory IC is designed to exceed expectations. Trust Freescale Semiconductor for all your memory circuit needs and unlock endless possibilities for your projects. Elevate your technology with the MR2A16AVYS35R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the memory IC, making it suitable for various environments and applications.

Operating Mode: ASYNCHRONOUS

Allows for independent and flexible read and write operations, enhancing the memory IC's performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at an efficient voltage level, balancing performance and power consumption.

Organization: 256KX16

Organized in a 256K x 16 configuration, providing a high memory density and data storage capacity.

Technology: CMOS

Built with CMOS technology for low power consumption, high speed, and reliable operation.

Maximum Access Time: 35 ns

Offers fast access time, ensuring quick data retrieval and processing.

Technical Specifications

Other Function Memory ICs MR2A16AVYS35R attributes and parameters. Explore more Other Function Memory ICs devices from Freescale Semiconductor

Specs

Maximum Access Time:

35 ns

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.41 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.028 Amp

Sub-Category:

SRAMs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10.16 mm

Trade Compliance

MR2A16AVYS35R Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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