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SN74AS870JT

Texas Instruments

SN74AS870JT by Texas Instruments

SN74AS870JT by Texas Instruments is a TTL technology IC with 24 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. This rectangular ceramic package is ideal for other function memory circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,526 parts In-Stock

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3,526

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Vyrian

USA . 3,070 parts In-Stock

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3,070

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Distributors (Availability)

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One Stop Electronics

USA . 898 parts In-Stock

1+ parts

$3.000

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898

$3.000

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Parana Technologies

USA . 2,342 parts In-Stock

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$4.418

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$4.841

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2,342

$4.418

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$4.841

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DigiPath Technology Company

USA . 642 parts In-Stock

1+ parts

$4.865

100+ parts

$4.476

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642

$4.865

$4.476

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IDEA Electronic Components Group

UK . 873 parts In-Stock

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$4.964

100+ parts

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$4.468

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873

$4.964

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$4.468

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ChromeModa Solutions

Germany . 100 parts In-Stock

1+ parts

$4.964

100+ parts

$4.070

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100

$4.964

$4.070

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AZTECH Wire

Italy . 758 parts In-Stock

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$10.598

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758

$10.598

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Corphita

USA . 1,418 parts In-Stock

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Overview

Elevate your projects with the SN74AS870JT from Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This versatile memory IC belongs to the category of Other Function Memory ICs and boasts a durable ceramic package with 24 terminals. With a temperature range of 0 to 70°C, this TTL technology-based product is ideal for various commercial applications. Trust in Texas Instruments to provide reliable solutions that bring value and efficiency to your designs. Upgrade your projects today with the SN74AS870JT!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent heat dissipation properties, ensuring the component stays cool during operation, which can increase its reliability and lifespan.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board, making this memory IC suitable for compact designs.

No. of Terminals: 24

Having 24 terminals allows for a greater number of connections, enabling more complex circuitry or features in a device.

Package Style (Meter): IN-LINE

In-line package style makes it easy to mount and solder the IC onto a PCB, simplifying the assembly process.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can be used in a wide range of environments without risk of overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature means this IC can function reliably even in colder conditions, ensuring consistent performance.

Terminal Position: DUAL

Dual terminal position allows for more secure connections and better electrical performance, reducing the risk of signal loss or interference.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this memory IC meets industry standards for reliability and performance in everyday use.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making this memory IC efficient and ideal for high-speed applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and easy soldering, ensuring a secure connection between the IC and the PCB.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54mm, this memory IC is compatible with a wide range of PCB layouts and soldering techniques.

Technical Specifications

Other Function Memory ICs SN74AS870JT attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS870JT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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