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SN74ALS870NTP3

Texas Instruments

SN74ALS870NTP3 by Texas Instruments

SN74ALS870NTP3 by Texas Instruments is a TTL technology IC with 24 terminals in an IN-LINE package. Operating temperature range is 0-70°C, suitable for commercial applications. Ideal for memory functions due to its dual terminal position and rectangular shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,947 parts In-Stock

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2,947

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Vyrian

USA . 2,474 parts In-Stock

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2,474

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Distributors (Availability)

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Parana Technologies

USA . 2,039 parts In-Stock

1+ parts

$3.854

100+ parts

$357.874

1k+ parts

$3.468

10k+ parts

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2,039

$3.854

$357.874

$3.468

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DigiPath Technology Company

USA . 2,029 parts In-Stock

1+ parts

$4.243

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2,029

$4.243

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ChromeModa Solutions

Germany . 4,943 parts In-Stock

1+ parts

$4.330

100+ parts

$3.551

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4,943

$4.330

$3.551

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IDEA Electronic Components Group

UK . 1,650 parts In-Stock

1+ parts

$4.330

100+ parts

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1k+ parts

$3.897

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1,650

$4.330

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$3.897

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AZTECH Wire

Italy . 384 parts In-Stock

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$8.519

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384

$8.519

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One Stop Electronics

USA . 864 parts In-Stock

1+ parts

$20.000

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864

$20.000

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Corphita

USA . 583 parts In-Stock

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583

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74ALS870NTP3. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products like this Other Function Memory IC that offer unmatched performance and durability. Ideal for a variety of applications, this product provides exceptional value and benefits to customers looking for high-quality solutions. Trust Texas Instruments to provide you with the best in class technology for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material means that this product is lightweight and durable, making it easy to handle and resistant to damage.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic devices and circuit boards, optimizing space and ensuring efficient utilization of resources.

No. of Terminals: 24

With 24 terminals, this memory IC provides ample connectivity options for different components, facilitating the smooth operation and communication within the system.

Package Style (Meter): IN-LINE

The in-line package style ensures easy installation and connectivity, making it suitable for applications where space is limited and a compact design is essential.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this memory IC can function effectively in a wide range of environments, providing reliable performance under varying thermal conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures that the memory IC remains operational even in colder climates, making it suitable for use in diverse settings and applications.

Terminal Position: DUAL

The dual terminal position allows for versatile connectivity options, enabling easy integration into different circuit configurations and enhancing the flexibility of the memory IC.

Temperature Grade: COMMERCIAL

Designed for commercial use, this memory IC meets industry standards for reliability and performance, making it a dependable choice for a wide range of electronic applications.

Technology: TTL

Using TTL technology, this memory IC offers high-speed operation and low power consumption, ensuring efficient data processing and reducing energy costs in electronic devices.

Terminal Form: THROUGH-HOLE

With through-hole terminals, this memory IC can be easily soldered onto circuit boards, providing secure electrical connections and ensuring stable performance in demanding environments.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for precise positioning and soldering of terminals, enhancing the reliability and accuracy of electrical connections in the memory IC.

Technical Specifications

Other Function Memory ICs SN74ALS870NTP3 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS870NTP3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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