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SN74170N3

Texas Instruments

SN74170N3 by Texas Instruments

SN74170N3 by Texas Instruments is a TTL technology IC with 16 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy material. Ideal for commercial applications, it operates b/w 0°C to 70°C and features through-hole terminals with a pitch of 2.54mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,058 parts In-Stock

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7,058

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Digiode

USA . 3,077 parts In-Stock

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3,077

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 942 parts In-Stock

1+ parts

$3.601

100+ parts

$334.402

1k+ parts

$3.241

10k+ parts

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942

$3.601

$334.402

$3.241

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DigiPath Technology Company

USA . 2,257 parts In-Stock

1+ parts

$3.965

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2,257

$3.965

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IDEA Electronic Components Group

UK . 1,720 parts In-Stock

1+ parts

$4.046

100+ parts

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$3.641

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1,720

$4.046

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$3.641

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ChromeModa Solutions

Germany . 1,137 parts In-Stock

1+ parts

$4.046

100+ parts

$3.318

1k+ parts

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1,137

$4.046

$3.318

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AZTECH Wire

Italy . 670 parts In-Stock

1+ parts

$8.082

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670

$8.082

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One Stop Electronics

USA . 399 parts In-Stock

1+ parts

$13.000

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399

$13.000

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Corphita

USA . 578 parts In-Stock

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578

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Overview

Unlock the power of seamless functionality with the SN74170N3 by Texas Instruments. Crafted with precision and reliability, this cutting-edge Other Function Memory IC offers unparalleled performance in a compact rectangular package. Ideal for a wide range of applications, this TTL technology-based IC operates flawlessly at temperatures ranging from 0 to 70°C. With 16 terminals and a nominal supply voltage of 5V, this innovative product guarantees superior quality and efficiency. Elevate your projects with the SN74170N3 and experience the Texas Instruments advantage like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, ensuring the longevity of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and installation in various devices and applications.

Nominal Supply Voltage / Vsup (V): 5

Nominal supply voltage of 5V makes it compatible with a wide range of systems and devices.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable performance and reliable operation.

No. of Terminals: 16

Having 16 terminals provides versatility and flexibility for connecting to different components and circuits.

Package Style (Meter): IN-LINE

In-line package style makes it compact and space-efficient, ideal for applications with limited space.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperatures and harsh environments.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C allows for reliable performance in cold environments.

Terminal Position: DUAL

Dual terminal position enables easy and secure connection, enhancing the overall performance and reliability of the product.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards and specifications for optimal performance.

Technology: TTL

Utilizing TTL technology ensures high-speed and reliable data processing, making this product suitable for various digital applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong and durable connections, ensuring a stable and long-lasting performance.

Terminal Pitch: 2.54 mm

Having a terminal pitch of 2.54 mm offers compatibility and ease of installation with standard PCB layouts and components.

Technical Specifications

Other Function Memory ICs SN74170N3 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Other Memory ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74170N3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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