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SN74170J4

Texas Instruments

SN74170J4 by Texas Instruments

SN74170J4 by Texas Instruments is a TTL technology IC with 16 terminals, operating at 5V. It has a rectangular ceramic package style and can function in temperatures ranging from 0 to 70°C. This memory IC is commonly used in commercial applications requiring reliable data storage and retrieval.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,219 parts In-Stock

1+ parts

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8,219

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Digiode

USA . 2,642 parts In-Stock

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2,642

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 684 parts In-Stock

1+ parts

$4.591

100+ parts

-

1k+ parts

$5.051

10k+ parts

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684

$4.591

-

$5.051

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DigiPath Technology Company

USA . 808 parts In-Stock

1+ parts

$5.055

100+ parts

$4.650

1k+ parts

-

10k+ parts

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808

$5.055

$4.650

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ChromeModa Solutions

Germany . 5,978 parts In-Stock

1+ parts

$5.158

100+ parts

$4.230

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-

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5,978

$5.158

$4.230

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IDEA Electronic Components Group

UK . 1,413 parts In-Stock

1+ parts

$5.158

100+ parts

-

1k+ parts

$4.642

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1,413

$5.158

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$4.642

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One Stop Electronics

USA . 962 parts In-Stock

1+ parts

$16.000

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962

$16.000

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AZTECH Wire

Italy . 314 parts In-Stock

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$17.144

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314

$17.144

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Corphita

USA . 4,886 parts In-Stock

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4,886

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Overview

Unlock the power of efficient memory management with the SN74170J4 by Texas Instruments. This high-quality IC offers reliable performance and durability, reflecting the reputation of its trusted manufacturer. Ideal for a wide range of applications in the category of Other Function Memory ICs, this product stands out for its value and benefits to customers. Experience seamless integration, optimal functionality, and enhanced efficiency with the SN74170J4, setting new standards in memory solutions.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high thermal conductivity and resistance to heat, making it a reliable choice for memory ICs that may need to operate at high temperatures.

Nominal Supply Voltage / Vsup (V): 5

A supply voltage of 5V is a common standard in many electronic devices, ensuring compatibility and ease of integration with existing systems.

Maximum Operating Temperature: 70 °C

The ability to operate at temperatures up to 70°C ensures reliability and stability under various environmental conditions.

Technology: TTL

TTL technology is known for its high speed and low power consumption, making it suitable for applications where performance and efficiency are key.

Technical Specifications

Other Function Memory ICs SN74170J4 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Other Memory ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74170J4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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