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M36W216T100ZA6T

STMicroelectronics

M36W216T100ZA6T by STMicroelectronics

M36W216T100ZA6T from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage. It features a 1M x 16 organization and operates in temperatures ranging from -40 °C to 85 °C. Ideal for industrial applications, it offers reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,705 parts In-Stock

1+ parts

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1,705

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Digiode

USA . 723 parts In-Stock

1+ parts

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1k+ parts

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723

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Vyrian

USA . 715 parts In-Stock

1+ parts

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715

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 894 parts In-Stock

1+ parts

$4.655

100+ parts

-

1k+ parts

$4.190

10k+ parts

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894

$4.655

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$4.190

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MKK Technologies

India . 915 parts In-Stock

1+ parts

$8.754

100+ parts

-

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915

$8.754

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DigiPath Technology Company

USA . 915 parts In-Stock

1+ parts

$8.754

100+ parts

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915

$8.754

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Corphita

USA . 3,770 parts In-Stock

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3,770

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Parana Technologies

USA . 773 parts In-Stock

1+ parts

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$5.566

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773

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$5.566

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Overview

Unlock the potential of your designs with the M36W216T100ZA6T memory IC from STMicroelectronics, a leader in high-performance semiconductor solutions. This versatile, low-profile chip is engineered for durability and efficiency, making it perfect for industrial applications where reliability is key. With its asynchronous operation and wide temperature range, experience enhanced performance that meets the demands of modern technology while reducing energy consumption. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures good durability and protection from environmental factors, making the IC suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space and supports automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape provides versatility in design and integration into different types of electronic devices.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for simpler interfacing with other components, enhancing system performance.

Nominal Supply Voltage / Vsup (V): 3

A nominal supply voltage of 3V is compatible with a wide range of logic families and reduces power consumption.

No. of Terminals: 66

With 66 terminals, this IC provides ample connectivity options for various functions, enhancing its application range.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile, fine-pitch grid array style enables high-density mounting, suitable for compact devices.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this IC ideal for industrial applications where thermal management is critical.

Organization: 1MX16

This organization provides efficient memory structuring for handling large data sets, enhancing performance.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliability in extreme conditions, ideal for outdoor or harsh environment applications.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and improves soldering quality, ensuring reliable connections.

Maximum Seated Height: 1.4 mm

A low seated height allows for compact designs and easier integration into space-constrained environments.

Width: 8 mm

At 8 mm wide, the IC strikes a balance between performance and space efficiency in board layouts.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V allows it to operate in battery-powered devices, enhancing energy efficiency.

Length: 12 mm

The 12 mm length contributes to a compact design, suitable for modern electronic applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades ensures reliability and performance in demanding environments.

Technology: CMOS

CMOS technology enhances performance while minimizing power consumption, making it eco-friendly.

Terminal Form: BALL

Ball terminals provide reliable connections with minimal space, simplifying PCB assembly and enhancing performance.

No. of Words: 1048576 words

With over a million words, this memory capacity supports complex applications and data handling.

Memory Width: 16

A memory width of 16 allows for efficient data transfer and processing, optimizing performance.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch enables high-density packaging, making it suitable for advanced electronic designs.

No. of Words Code: 1M

Offering 1M words ensures sufficient memory for a variety of applications, from industrial to consumer electronics.

Maximum Supply Voltage (Vsup): 3.3 V

A maximum supply voltage of 3.3V ensures compatibility with modern digital systems and reduces power draw.

Memory Density: 16777216 bit

High memory density supports complex applications, making this IC suitable for memory-intensive tasks.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit, this product is crucial for storing data, making it versatile for various electronic designs.

Technical Specifications

Other Function Memory ICs M36W216T100ZA6T attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO CONTAINS 128K X 16 SRAM

JESD-30 Code:

R-PBGA-B66

Length:

12 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

66

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36W216T100ZA6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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