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SN74LS170FN3

Texas Instruments

SN74LS170FN3 by Texas Instruments

SN74LS170FN3 by Texas Instruments is a TTL technology IC with 20 terminals in a square chip carrier package. It operates at temperatures b/w 0°C to 70°C and has a nominal voltage of 5V. This memory IC is commonly used in commercial applications requiring other function memory capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,489 parts In-Stock

1+ parts

-

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7,489

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Digiode

USA . 3,869 parts In-Stock

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3,869

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 645 parts In-Stock

1+ parts

$2.556

100+ parts

-

1k+ parts

$3.044

10k+ parts

-

645

$2.556

-

$3.044

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DigiPath Technology Company

USA . 503 parts In-Stock

1+ parts

$2.815

100+ parts

$2.589

1k+ parts

-

10k+ parts

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503

$2.815

$2.589

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IDEA Electronic Components Group

UK . 2,367 parts In-Stock

1+ parts

$2.872

100+ parts

-

1k+ parts

$2.585

10k+ parts

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2,367

$2.872

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$2.585

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ChromeModa Solutions

Germany . 946 parts In-Stock

1+ parts

$2.872

100+ parts

$2.355

1k+ parts

-

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946

$2.872

$2.355

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One Stop Electronics

USA . 1,268 parts In-Stock

1+ parts

$6.000

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1,268

$6.000

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AZTECH Wire

Italy . 400 parts In-Stock

1+ parts

$19.206

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400

$19.206

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Corphita

USA . 4,641 parts In-Stock

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4,641

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Overview

Unlock the power of efficient data storage and retrieval with the SN74LS170FN3 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions in the category of Other Function Memory ICs. This product offers customers unparalleled value with its advanced technology and commercial-grade temperature tolerance. Perfect for applications requiring precise memory functions, this chip carrier package ensures optimal performance in a compact square shape. Trust Texas Instruments to provide innovative solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, ensuring reliability in various operating conditions.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and potentially reducing costs.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage of 5V makes it compatible with many existing systems.

No. of Terminals: 20

Having 20 terminals allows for more connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance even in demanding environments.

Technology: TTL

Utilizing TTL technology provides fast switching speeds and reliable performance in digital circuits.

Technical Specifications

Other Function Memory ICs SN74LS170FN3 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Sub-Category:

Other Memory ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74LS170FN3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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