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SN74170N1

Texas Instruments

SN74170N1 by Texas Instruments

SN74170N1 by Texas Instruments is a TTL technology IC with 16 terminals, operating at 5V. It has a rectangular package shape made of PLASTIC/EPOXY material. This IC is commonly used in memory applications due to its commercial temperature grade and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,635 parts In-Stock

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4,635

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Vyrian

USA . 4,508 parts In-Stock

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4,508

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,214 parts In-Stock

1+ parts

$2.096

100+ parts

-

1k+ parts

$2.614

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1,214

$2.096

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$2.614

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DigiPath Technology Company

USA . 1,753 parts In-Stock

1+ parts

$2.308

100+ parts

$2.123

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1,753

$2.308

$2.123

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IDEA Electronic Components Group

UK . 1,834 parts In-Stock

1+ parts

$2.355

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$2.120

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1,834

$2.355

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$2.120

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ChromeModa Solutions

Germany . 1,327 parts In-Stock

1+ parts

$2.355

100+ parts

$1.931

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1,327

$2.355

$1.931

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AZTECH Wire

Italy . 824 parts In-Stock

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$6.077

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824

$6.077

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One Stop Electronics

USA . 372 parts In-Stock

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$30.000

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372

$30.000

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Corphita

USA . 498 parts In-Stock

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498

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Overview

Unlock the power of advanced technology with the SN74170N1 by Texas Instruments. Designed with precision and quality in mind, this memory IC offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile component provides seamless integration and optimal functionality. Trust in Texas Instruments' reputation for excellence and experience the difference in your projects with the SN74170N1. Elevate your designs with the value and benefits that only this top-tier product can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a durable and lightweight material, making the product sturdy and easy to handle.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into electronic circuits and devices.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard electronic systems and components.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can perform reliably even in demanding environments.

Technology: TTL

Utilizing TTL technology ensures high-speed performance and efficient operation.

Technical Specifications

Other Function Memory ICs SN74170N1 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74170N1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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