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DS6207-3

Analog Devices

DS6207-3 by Analog Devices

DS6207-3 by Analog Devices is a CMOS Memory Circuit with 384-bit memory density. It operates b/w 0 °C to 70°C, suitable for commercial applications. The IC has 5 terminals in a special shape package, ideal for various memory circuit functions.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,609 parts In-Stock

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Anansix

USA . 2,466 parts In-Stock

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Digiode

USA . 1,492 parts In-Stock

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Northwest PG Solutions

USA . 3,235 parts In-Stock

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$2.711

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MARBEL Systems

Belgium . 2,827 parts In-Stock

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$4.907

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One Stop Electronics

USA . 2,277 parts In-Stock

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$5.000

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Texas Native Microelectronics

USA . 50 parts In-Stock

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$5.640

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$5.414

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$5.245

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$4.963

50

$5.640

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$4.963

Kenton Components

USA . 1,576 parts In-Stock

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$6.768

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$5.956

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Qasali Group International

UK . 798 parts In-Stock

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$15.228

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$14.162

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$13.401

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AZTECH Wire

Italy . 789 parts In-Stock

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$16.092

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Semicontronic

India . 1,030 parts In-Stock

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$19.000

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Native Components

USA . 1,680 parts In-Stock

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Corphita

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Overview

Unlock the potential of your electronic devices with the DS6207-3 by Analog Devices. Known for their high-quality manufacturing, Analog Devices delivers superior products that stand the test of time. This memory circuit offers endless possibilities in various applications, providing customers with unbeatable value and performance. Whether you're looking to enhance the functionality of your device or increase its memory capacity, the DS6207-3 is the perfect solution. Upgrade your technology today with Analog Devices and experience the difference.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shapes are commonly used for memory ICs, providing a compact and space-saving design for easy integration into various electronic devices.

No. of Terminals: 5

Having 5 terminals simplifies the installation process and reduces the likelihood of errors during setup, making the product user-friendly.

Package Style (Meter): SPECIAL SHAPE

The special shape package style offers uniqueness and potential customization options, making the product stand out in the market.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this memory IC can withstand high temperatures, ensuring reliable performance in various environmental conditions.

Organization: 384X1

The organization of 384 words in a 384X1 configuration helps in efficient data storage and retrieval, enhancing the overall functionality of the memory IC.

Minimum Operating Temperature: 0 °C

The capability to operate at 0 °C ensures reliable performance even in low-temperature environments, making the product versatile for different applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability, making it easy for manufacturers to assemble the memory IC onto circuit boards, saving time and effort in production.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades certifies that this memory IC is suitable for standard consumer electronic devices, ensuring compatibility with a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this memory IC energy-efficient and reliable in processing and storing data accurately.

Memory Density: 384 bit

With a memory density of 384 bits, this IC can store a considerable amount of data efficiently, making it ideal for applications that require moderate memory capacity.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit IC, this product is specifically designed for storing and retrieving data, ensuring reliable performance in data storage applications.

Technical Specifications

Other Function Memory ICs DS6207-3 attributes and parameters. Explore more Other Function Memory ICs devices from Analog Devices

Specs

Additional Features:

DATA RETENTION > 10 YEARS

JESD-30 Code:

R-XXSS-X5

JESD-609 Code:

e0

Memory Density:

384 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

5

No. of Words:

384 words

No. of Words Code:

384

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

384X1

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

SPECIAL SHAPE

Qualification:

Not Qualified

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

UNSPECIFIED

Terminal Position:

UNSPECIFIED

Trade Compliance

DS6207-3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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