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DS6204U-XXX

Analog Devices

DS6204U-XXX by Analog Devices

DS6204U-XXX by Analog Devices is a 128x1 memory circuit IC with synchronous operation. Featuring CMOS technology, it has 128-bit memory density and uses tin lead terminal finish. This rectangular package is ideal for applications requiring specialized shape memory ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,857 parts In-Stock

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Anansix

USA . 407 parts In-Stock

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407

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Digiode

USA . 255 parts In-Stock

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MARBEL Systems

Belgium . 25 parts In-Stock

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$1.867

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25

$1.867

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Texas Native Microelectronics

USA . 4,631 parts In-Stock

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$2.146

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$2.060

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$1.996

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$1.888

4,631

$2.146

$2.060

$1.996

$1.888

Kenton Components

USA . 2,915 parts In-Stock

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$2.575

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$2.266

2,915

$2.575

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$2.266

Qasali Group International

UK . 40 parts In-Stock

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$5.794

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$5.389

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$5.099

40

$5.794

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$5.389

$5.099

AZTECH Wire

Italy . 487 parts In-Stock

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$7.902

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$7.902

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One Stop Electronics

USA . 879 parts In-Stock

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$18.000

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879

$18.000

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Semicontronic

India . 232 parts In-Stock

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$18.000

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$17.550

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$17.460

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$18.000

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$17.460

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Corphita

USA . 1,470 parts In-Stock

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Native Components

USA . 1,315 parts In-Stock

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$3.554

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Northwest PG Solutions

USA . 250 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the DS6204U-XXX by Analog Devices. This high-quality memory circuit offers unparalleled performance and reliability, backed by Analog Devices' reputation for excellence in the industry. Whether you're looking to enhance data storage, improve system efficiency, or streamline operations, this synchronous memory IC is the perfect solution. With its innovative design and advanced features, the DS6204U-XXX provides unmatched value and benefits to customers seeking top-of-the-line memory solutions. Trust Analog Devices to deliver superior products that exceed expectations and drive success in your projects.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Standard package shape makes it easy to integrate into existing circuit designs.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and control, ideal for high-speed data transfer applications.

No. of Terminals: 5

Low number of terminals simplifies circuit connections and reduces chances of errors.

Package Style (Meter): SPECIAL SHAPE

Special shape package allows for unique and customized designs.

Organization: 128X1

Organized as 128 words of 1 bit each, providing flexibility in data storage and retrieval.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures reliable connections and solderability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Words: 128 words

Ample storage capacity for storing data or instructions.

Memory Density: 128 bit

128-bit memory density provides sufficient space for storing information.

Memory IC Type: MEMORY CIRCUIT

Specifically designed for memory circuit applications, ensuring optimal performance.

Technical Specifications

Other Function Memory ICs DS6204U-XXX attributes and parameters. Explore more Other Function Memory ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XXSS-X5

JESD-609 Code:

e0

Memory Density:

128 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

5

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Organization:

128X1

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

SPECIAL SHAPE

Qualification:

Not Qualified

Surface Mount:

NO

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

UNSPECIFIED

Terminal Position:

UNSPECIFIED

Trade Compliance

DS6204U-XXX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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