Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MR25H10CDF by Everspin Technologies is a synchronous memory IC with a capacity of 128Kx8 and a memory density of 1,048,576 bits. It operates at a nominal voltage of 3V and has a max operating temperature of 85°C. This memory circuit is commonly used in industrial applications requiring reliable and high-performance data storage.
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The plastic/epoxy package body material provides excellent durability and protection for the memory IC, making it a reliable choice even in harsh environments.
The surface mount feature allows for easy and convenient installation of the memory IC onto a circuit board, saving time and effort in assembly.
With a single function, this memory IC is designed to efficiently perform its intended task without any unnecessary complexities, ensuring optimal performance.
The rectangular package shape allows for efficient space utilization on the circuit board, making it suitable for compact designs.
The synchronous operating mode ensures precise and synchronized data transfer, making it ideal for applications that require accurate data handling.
Operating at a nominal supply voltage of 3V, this memory IC offers consistent and stable performance, enhancing its reliability.
With support for power supplies of both 3V and 3.3V, this memory IC provides flexibility and compatibility with various systems and devices.
The 8 terminals offer sufficient connectivity options, facilitating easy integration into different circuit designs.
The small outline, heat sink/slug, and very thin profile package style ensures efficient heat dissipation and enables space-saving installation in tight spaces.
With a maximum operating temperature of 85°C, this memory IC can withstand high-temperature environments, making it suitable for industrial applications.
The organization of 128KX8 (128 kilobits x 8) allows for the storage and retrieval of a large amount of data efficiently, making it suitable for data-intensive applications.
This memory IC can operate reliably even in extremely low-temperature conditions, enabling its usage in various environments.
The matte tin terminal finish provides excellent corrosion resistance and solderability, ensuring long-term reliability and ease of assembly.
The dual terminal position allows for easy and flexible connection options, enhancing the adaptability of this memory IC in different circuit layouts.
With a maximum seated height of 0.9mm, this memory IC is suitable for applications with strict height requirements, contributing to space optimization.
The compact width of 5mm ensures easy integration of this memory IC into various board designs, enabling efficient space utilization.
Operating at a minimum supply voltage of 2.7V, this memory IC offers a wide voltage range, allowing compatibility with different power sources.
The memory IC can withstand the peak reflow temperature for up to 30 seconds, ensuring proper soldering during the manufacturing process.
With a peak reflow temperature of 260°C, this memory IC can be subjected to high-temperature soldering processes without any detrimental effects.
The compact length of 6mm enables easy placement and integration of this memory IC, making it suitable for space-constrained designs.
The memory IC's industrial temperature grade ensures reliable operation in a wide range of temperatures, making it suitable for industrial applications.
Utilizing CMOS technology, this memory IC offers low power consumption, high-speed performance, and improved noise immunity, making it an efficient and reliable choice.
The no-lead terminal form eliminates the risk of lead-related environmental concerns and ensures compatibility with lead-free soldering processes.
With a maximum supply current of 27mA, this memory IC operates within a reasonable power range, providing energy-efficient performance.
The large number of words (131,072) that can be stored or accessed in this memory IC ensures the availability of a substantial amount of data.
The memory width of 8 bits allows for the simultaneous processing of 8-bit data, improving efficiency and enabling faster data transfer rates.
The terminal pitch of 1.27mm ensures compatibility with standard surface mount technologies and facilitates easy PCB routing and soldering.
With a code that supports 128K words, this memory IC provides a versatile storage capacity, accommodating a wide range of data requirements.
Rated at MSL 3, this memory IC can withstand moderate moisture exposure, ensuring reliability during storage and assembly processes.
The memory IC's maximum supply voltage of 3.6V allows for operation in systems with higher voltage requirements, offering flexibility in design.
With a memory density of 1,048,576 bits, this memory IC provides a substantial amount of data storage, suitable for applications with demanding memory requirements.
As a specialized memory circuit, this memory IC is designed to provide efficient and reliable data storage capabilities, making it a suitable choice for memory-intensive applications.
With a low maximum standby current of 0.000115 Amp, this memory IC ensures minimal power consumption during idle or standby periods, enhancing energy efficiency.
Other Function Memory ICs MR25H10CDF attributes and parameters. Explore more Other Function Memory ICs devices from Everspin Technologies
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MR25H10CDF Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Design/Specification - All Dev Trace Code Chgs 20/Oct/2021
PCN Assembly/Origin - Assembly Site Add 23/Dec/2016
Everspin Technologies, Inc. Headquartered in Chandler, Arizona, Everspin Technologies, Inc. is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-transfer Torque MRAM (STT-MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount. With over 120 Million MRAM and STT-MRAM products deployed in data center, cloud storage, energy, industrial, automotive, and transportation markets, Everspin has built the strongest and fastest growing foundation of MRAM users in the world. Core Competence with MRAM: From Perpendicular to Field-Switched Everspin’s knowledge and experience in magnetic memory design, manufacture and delivery into relevant applications is unique within the semiconductor industry. With an intellectual property portfolio of more than 600 active patents and applications, Everspin leads the market in development of both in-plane and perpendicular magnetic tunnel junction (MTJ) STT-MRAM bit cells. Manufacturing - The Capacity to Deliver In 2014, Everspin partnered with GLOBALFOUNDRIES for full turn-key 300mm high-volume production of in-plane and perpendicular MTJ ST-MRAM on advanced technology nodes including 40nm, 28nm and beyond. In addition, Everspin owns and operates an integrated magnetic fabrication line located in Chandler, Arizona, where Everspin produces MRAM products are based on 180nm, 130nm, and 90nm process technology nodes. Product package and test operations are located in China, Taiwan and other Asian countries.
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
SMBJ18CA
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N2222A
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
LM555CM
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148W-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
1N4148WS
Diodes Incorporated
1N4148WT
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Philips Components
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
LM358DR2G
Onsemi
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
TMS2150-4JDL
Texas Instruments
TMS2150-4JDL by Texas Instruments is a 512x9 MEMORY CIRCUIT IC with 45ns access time, 145mA max supply current, and 5V nominal voltage. It is ideal for applications requiring fast memory operations in commercial temperature environments.
TMS4100JC
TMS4100JC by Texas Instruments is a MOS memory IC with 28 terminals in an IN-LINE package. It operates b/w -25°C to 85°C, making it suitable for various applications requiring reliable memory storage in harsh environments. The CERAMIC package ensures durability and stability, ideal for industrial and automotive electronics.
EPCQ4ASI8N
Intel
EPCQ4ASI8N by Intel is a 512Kx8 NOR type memory IC with 3-STATE output. Operating at 100 MHz, it has a supply voltage range of 2.7V to 3.6V and industrial temperature grade. With a compact package style and serial interface, it's ideal for applications requiring high-speed data storage in harsh environments.
AT88SC0104CA-SH
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
LC331632M-10
LC331632M-10 by Onsemi is a 32KX16 CMOS memory IC with 3-STATE output. It operates at a nominal voltage of 5V and has a memory density of 524288 bits. This small outline package is ideal for applications requiring common I/O type in commercial temperature grades.
DS2401Z+
Maxim Integrated
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 1;
M36LLR8860B1ZAQ
STMicroelectronics
M36LLR8860B1ZAQ by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of FLASH+PSRAM with a supply voltage range of 1.7-1.95V. It operates b/w -25 °C and 85 °C, making it ideal for compact electronic applications. With an 88-terminal grid array design, it ensures efficient space utilization in devices.
M36W108B100ZN6T
M36W108B100ZN6T by STMicroelectronics is a 1MX8 memory IC with 8388608 bit memory density. It operates in asynchronous mode, has a CMOS technology, and supports a supply voltage range of 2.7V to 3.6V. This rectangular package with grid array style and very thin profile is ideal for industrial applications requiring high memory capacity in compact spaces.
TMS4C1070-40DJ
TMS4C1070-40DJ by Texas Instruments is a 20-terminal memory circuit IC with 5V supply voltage. It operates b/w 0 to 70°C, consuming a max of 45mA current. This CMOS technology-based IC is ideal for applications requiring fast access times of up to 30ns in commercial-grade temperature environments.
MR2A16AYS35R
Everspin Technologies
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
SN74S262N1
SN74S262N1 by Texas Instruments is a TTL Memory Circuit IC with 20 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, suitable for commercial applications. The PLASTIC/EPOXY rectangular package makes it ideal for memory circuit functions.
TMS27PC64-15N
Other Memory ICs;
M36W216BI85ZA1T
M36W216BI85ZA1T from STMicroelectronics is a low-profile, asynchronous memory IC featuring 16Mbit density with FLASH+SRAM technology. It operates at 3V and supports a max access time of 85ns. Ideal for commercial applications requiring efficient data storage and retrieval.
SN74LS170D3
SN74LS170D3 by Texas Instruments is a TTL technology memory IC with 16 terminals, operating at 5V. It has a small outline package shape and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring reliable memory functions in electronic devices.
TMS27PC291-50N
7230
Intel 7230 is a CMOS memory circuit with 22 terminals in an in-line rectangular package. It has a max seated height of 5.08mm, width of 10.16mm, and length of 27.3685mm. Ideal for applications requiring compact memory ICs with through-hole terminals.
TMS2564-45JDL
TMS2564-45JDL by Texas Instruments is an 8KX8 MOS memory IC with 65536 bit density and 450 ns access time. It features a 3-STATE output, operates b/w 0 to 70 °C, and has a DUAL terminal position. Ideal for applications requiring fast data retrieval in commercial temperature environments.
M36LLR8760B1ZAQ
M36LLR8760B1ZAQ by STMicroelectronics is a low-profile, asynchronous memory IC featuring 16M x 16 organization and operates at a nominal voltage of 1.8V. With mixed FLASH+PSRAM technology, it supports applications in compact devices. Its robust design withstands temperatures from -25 °C to 85 °C.
SNC54AS871JD
SNC54AS871JD by Texas Instruments is a MIL-STD-883 Class B (Modified) rated TTL IC with 28 terminals in an IN-LINE package. It operates b/w -55°C to 125°C, making it suitable for military applications requiring high temperature tolerance. The CERAMIC package body material ensures durability and reliability in harsh environments.
MR2A16AMYS35R
MR2A16AMYS35R by Everspin Technologies is a 256Kx16 memory IC with CMOS technology. Operating at 3.3V, it has a temperature range of -40 to 125°C and is AEC-Q100 compliant for automotive applications. This small outline, thin profile package with 44 terminals is ideal for high-performance asynchronous memory needs in automotive electronics.
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MR25H10CDFR
MR25H10CDFR by Everspin Technologies is a 128KX8 MEMORY CIRCUIT IC with 1048576 bit Memory Density. It operates at 3V, has a small outline package style, and can withstand industrial temperatures. Ideal for applications requiring fast synchronous memory access in compact electronic devices.
MR25H256ACDF
MR25H256ACDF by Everspin Technologies is a 32KX8 SPI BUS SERIAL EEPROM memory IC with a memory density of 262144 bits. It operates at a nominal voltage of 3V and has an industrial temperature grade. This memory IC is suitable for applications requiring small outline, heat sink, and very thin profile packages.
MR25H10MDF
MR25H10MDF by Everspin Technologies is a 128Kx8 memory IC with CMOS technology. It operates synchronously at a nominal voltage of 3V, suitable for automotive applications. With a small outline package style and very thin profile, it offers high memory density of 1048576 bits for various electronic devices.
MR25H256CDC
MR25H256CDC by Everspin Tech is a 32Kx8 memory IC with CMOS tech. Operating at 3V, it has a temp range of -40 to 85°C. With synchronous mode and 262144-bit density, it suits industrial applications needing reliable non-volatile memory solutions.
MR25H256CDF
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
MR25H10CDC
MR25H10CDC by Everspin Technologies is a 128KX8 MEMORY CIRCUIT with 1048576 bit Memory Density. Operating at 3V, it features SYNCHRONOUS mode and INDUSTRIAL temperature grade. Ideal for applications requiring high-speed data storage in compact devices.
MR25H256ACDFR
SPI BUS SERIAL EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Words Code: 32K;
MR256A08BMA35
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
MR25H256MDC
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HSON; Package Shape: RECTANGULAR; Terminal Position: DUAL;
MR25H10CDCR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-N8;
MR25H10MDCR
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
MR25H10MDC
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
MR25H10MDFR
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE;
MR25H256CDFR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Organization: 32KX8;
MR25H256MDFR
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
MR25H256MDF
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Seated Height: .9 mm;
MR25H256CDCR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HSON; Package Shape: RECTANGULAR; Organization: 32KX8;
MR25H256APDFR
SPI BUS SERIAL EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
MR25H256APDF
SPI BUS SERIAL EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
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