Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MR25H256ACDFR by Everspin: 32KX8 SPI BUS SERIAL EEPROM with 262144 bit memory density, operates at 3V, -40 to 85 °C. Ideal for industrial applications requiring small outline, heat sink package with synchronous operation.
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Plastic material offers durability and protection for the integrated circuit, ensuring long-lasting performance.
Surface mount capability makes installation and assembly easier, saving time and effort during manufacturing processes.
Synchronous operation allows for precise timing and coordination, enhancing overall performance and reliability.
Operates at a standard 3V supply voltage, making it compatible with a wide range of electronic systems.
With a high maximum operating temperature, this memory IC can withstand harsh environmental conditions without compromising functionality.
Can function reliably even in extremely low temperatures, making it suitable for diverse applications and environments.
Uses CMOS technology for low power consumption and high speed operation, improving energy efficiency and performance.
Offers a high memory density, allowing for storage of large amounts of data in a compact form factor.
Utilizes SPI bus interface for serial communication and EEPROM for non-volatile memory storage, offering versatility and flexibility in data transfer and retention.
Other Function Memory ICs MR25H256ACDFR attributes and parameters. Explore more Other Function Memory ICs devices from Everspin Technologies
JESD-30 Code:
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MR25H256ACDFR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Everspin Technologies, Inc. Headquartered in Chandler, Arizona, Everspin Technologies, Inc. is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-transfer Torque MRAM (STT-MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount. With over 120 Million MRAM and STT-MRAM products deployed in data center, cloud storage, energy, industrial, automotive, and transportation markets, Everspin has built the strongest and fastest growing foundation of MRAM users in the world. Core Competence with MRAM: From Perpendicular to Field-Switched Everspin’s knowledge and experience in magnetic memory design, manufacture and delivery into relevant applications is unique within the semiconductor industry. With an intellectual property portfolio of more than 600 active patents and applications, Everspin leads the market in development of both in-plane and perpendicular magnetic tunnel junction (MTJ) STT-MRAM bit cells. Manufacturing - The Capacity to Deliver In 2014, Everspin partnered with GLOBALFOUNDRIES for full turn-key 300mm high-volume production of in-plane and perpendicular MTJ ST-MRAM on advanced technology nodes including 40nm, 28nm and beyond. In addition, Everspin owns and operates an integrated magnetic fabrication line located in Chandler, Arizona, where Everspin produces MRAM products are based on 180nm, 130nm, and 90nm process technology nodes. Product package and test operations are located in China, Taiwan and other Asian countries.
BSS138
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
SMBJ18CA
Concord Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V;
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
LM358AN
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
LM358N
Philips Semiconductors
SS14
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
PIC18F4550-I/PT
Microchip Technology
PIC18F4550-I/PT by Microchip: 8-bit microcontroller with 44 terminals, 48 MHz clock frequency, and USB connectivity. Ideal for industrial applications requiring low power mode and 10-bit ADC channels.
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
4554
Jw Miller Magnetics
Other Semiconductors;
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
Meritek Electronics
1N4148
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
STM32F103C8T6
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
2N2222A
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
MR44V100AMAZAATL
Lapis Semiconductor
MR44V100AMAZAATL by Lapis Semiconductor is a 128KX8 MEMORY CIRCUIT with 1048576 bit Memory Density. Operating at 3.3V, it has a temperature range of -40 to 85 °C and is ideal for industrial applications requiring small outline, low profile Package Style.
FM25L256-GC
Cypress Semiconductor
Other Memory ICs;
CT1000MX500SSD1
Micron Technology
Micron Technology's CT1000MX500SSD1 is a RECTANGULAR memory IC with 1TX8 organization and CMOS technology. It operates ASYNCHRONOUSLY at temperatures b/w 0-70 °C, offering a memory density of 8796093022208 bit. Ideal for commercial applications requiring high-speed data processing in compact devices.
SNJ54ALS871FK
Texas Instruments
SNJ54ALS871FK by Texas Instruments is a MILITARY-grade TTL IC with 28 terminals in a CHIP CARRIER package. It operates b/w -55°C to 125°C, making it suitable for harsh environments. This IC is ideal for applications requiring high reliability and performance in military and aerospace systems.
TACT2152-25JD
TACT2152-25JD by Texas Instruments is a 2Kx8 memory circuit IC with 16384-bit memory density. It operates at 5V, has a max access time of 25ns, and supports commercial temperature grade. This CMOS technology IC comes in an IN-LINE package style and is ideal for applications requiring fast data access and reliable memory storage.
NMC27C32Q-45/883C
Other Memory ICs; Terminal Finish: TIN LEAD; JESD-609 Code: e0;
M36W0R5020B0ZAQT
M36W0R5020B0ZAQT by STMicroelectronics is a versatile memory IC featuring 2M words of mixed FLASH+SRAM with a max access time of 70 ns. It operates asynchronously at a nominal voltage of 1.8V, suitable for industrial applications. Its compact design (8x10 mm) ensures efficient space utilization in devices.
DS1996L-F5
Maxim Integrated
DS1996L-F5 by Maxim Integrated is a 64KX1 MEMORY CIRCUIT with 65536 bit Memory Density. It operates in ASYNCHRONOUS mode at -40 to 70 °C, with Power Supplies of 3/5 V. This METAL DISK BUTTON IC is used for data storage applications requiring fast access times up to 15000 ns.
SN74AS870NT3
SN74AS870NT3 by Texas Instruments is a TTL technology IC with 24 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. With a rectangular plastic/epoxy body, it is commonly used in memory functions requiring dual terminal positions.
TMS27PC64-120N
DS1652B
Analog Devices
Analog Devices' DS1652B is a CMOS Memory Circuit IC with 8 terminals, operating at 0-70 °C. It has a supply voltage of 5V and comes in an IN-LINE package style. Ideal for commercial applications requiring reliable memory functions.
MR10Q010CMB
Everspin Technologies
MR10Q010CMB by Everspin Technologies is a 128Kx8 memory IC with CMOS technology. Operating at 3.3V, it offers synchronous operation and industrial temperature grade suitability. With a package style of grid array and low profile, it is ideal for applications requiring high-speed data storage in compact spaces.
SN74AS870NTP1
SN74AS870NTP1 by Texas Instruments is a TTL technology IC with 24 terminals in an IN-LINE package. Operating temperature range is 0-70°C, suitable for commercial applications. Ideal for memory functions due to its dual terminal position and rectangular shape.
DS1207-G1C
Analog Devices' DS1207-G1C is a CMOS MEMORY CIRCUIT with SYNCHRONOUS operation. It has an operating temperature range of 0-70 °C and TIN LEAD terminal finish. Ideal for applications requiring Other Function Memory ICs in COMMERCIAL grade environments.
CY15B256Q-SXA
Infineon Technologies
CY15B256Q-SXA by Infineon Technologies is a 32KX8 memory IC with synchronous operation and 262144 bit memory density. It operates at a voltage range of 2V to 3.6V, suitable for industrial applications requiring reliable small outline package (SOP) design with gull wing terminals.
SN74AS8834GB
SN74AS8834GB by Texas Instruments is a 64x40 memory circuit IC with 2560-bit memory density. Operating at 5V, it features synchronous mode and TTL technology. Ideal for commercial applications, this square-shaped IC has a grid array package style and operates b/w 0°C to 70°C.
M36W108B120ZM5T
STMicroelectronics M36W108B120ZM5T is a 1MX8 memory IC with 1048576 words and 8388608 bit memory density. It operates in asynchronous mode, has a CMOS technology, and supports a supply voltage range of 2.7V to 3.6V. This low-profile grid array package is suitable for various applications requiring high-density memory solutions.
DS1993L-F5
Dallas Semiconductor
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 2; Package Shape: ROUND; Maximum Supply Voltage (Vsup): 6 V; Qualification: Not Qualified;
TMX27C512-30
SN74HC670J4
SN74HC670J4 by Texas Instruments is a CMOS memory IC with 16 terminals, operating b/w -40 to 85°C. It has power supplies of 2/6V and comes in an industrial-grade ceramic package. Ideal for applications requiring reliable memory functions in harsh environments.
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MR25H10CDFR
MR25H10CDFR by Everspin Technologies is a 128KX8 MEMORY CIRCUIT IC with 1048576 bit Memory Density. It operates at 3V, has a small outline package style, and can withstand industrial temperatures. Ideal for applications requiring fast synchronous memory access in compact electronic devices.
MR25H10CDF
MR25H10CDF by Everspin Technologies is a synchronous memory IC with a capacity of 128Kx8 and a memory density of 1,048,576 bits. It operates at a nominal voltage of 3V and has a max operating temperature of 85°C. This memory circuit is commonly used in industrial applications requiring reliable and high-performance data storage.
MR25H256ACDF
MR25H256ACDF by Everspin Technologies is a 32KX8 SPI BUS SERIAL EEPROM memory IC with a memory density of 262144 bits. It operates at a nominal voltage of 3V and has an industrial temperature grade. This memory IC is suitable for applications requiring small outline, heat sink, and very thin profile packages.
MR25H10MDF
MR25H10MDF by Everspin Technologies is a 128Kx8 memory IC with CMOS technology. It operates synchronously at a nominal voltage of 3V, suitable for automotive applications. With a small outline package style and very thin profile, it offers high memory density of 1048576 bits for various electronic devices.
MR25H256CDC
MR25H256CDC by Everspin Tech is a 32Kx8 memory IC with CMOS tech. Operating at 3V, it has a temp range of -40 to 85°C. With synchronous mode and 262144-bit density, it suits industrial applications needing reliable non-volatile memory solutions.
MR25H256CDF
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
MR25H10CDC
MR25H10CDC by Everspin Technologies is a 128KX8 MEMORY CIRCUIT with 1048576 bit Memory Density. Operating at 3V, it features SYNCHRONOUS mode and INDUSTRIAL temperature grade. Ideal for applications requiring high-speed data storage in compact devices.
MR256A08BMA35
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
MR25H256MDC
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HSON; Package Shape: RECTANGULAR; Terminal Position: DUAL;
MR25H256CDFR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Organization: 32KX8;
MR25H256MDFR
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
MR25H256MDF
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Seated Height: .9 mm;
MR25H256CDCR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HSON; Package Shape: RECTANGULAR; Organization: 32KX8;
MR25H256MDCR
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HSON; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3 V;
MR25H256AMDFR
SPI BUS SERIAL EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3 V;
MR25H256AMDF
MR25H256APDFR
SPI BUS SERIAL EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
MR25H256APDF
SPI BUS SERIAL EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
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