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TMS2716JL

Texas Instruments

TMS2716JL by Texas Instruments

TMS2716JL by Texas Instruments is a 2Kx8 MOS memory IC with 16384-bit density and 450ns access time. Featuring 3-STATE output, it operates b/w 0°C to 70°C. Ideal for commercial applications requiring fast data retrieval in a ceramic package with 24 terminals.

Median Price

$12.643

Lifecycle Status

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1k+

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American Microsemiconductor Inc.

USA . 15 parts In-Stock

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Freelance Electronics

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Forefront Electronics and Design

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Vyrian

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Digiode

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Q Components

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MRC Electronics

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M&R Communications

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Electronic Expediters

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Digital Electronic Gebert Verwaltungs UG

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J & M Industries LLC

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Bristol Electronics

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PC Components Company LLC

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Sinequanon

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Pride Electronics

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Electronics Depot

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Inland Empire Components Inc.

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MISTER SPROCKETS

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Prism Electronics

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Distributors (Availability)

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Parana Technologies

USA . 2,135 parts In-Stock

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$4.701

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$5.187

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DigiPath Technology Company

USA . 2,313 parts In-Stock

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$5.176

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$4.762

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ChromeModa Solutions

Germany . 5,450 parts In-Stock

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IDEA Electronic Components Group

UK . 76 parts In-Stock

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AZTECH Wire

Italy . 692 parts In-Stock

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One Stop Electronics

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Corphita

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Assy Fe

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Perfect Parts

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A-Plus Industry Inc.

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Resion (Excess)

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Montclair Electronics, Inc.

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Overview

Unlock the power of cutting-edge technology with the TMS2716JL by Texas Instruments. Crafted with precision and expertise, this memory IC offers unparalleled performance and reliability for a wide range of applications. Whether you're a tech enthusiast, hobbyist, or professional, this product is designed to meet your needs and exceed your expectations. Experience seamless operation, fast access times, and seamless integration with other devices. Elevate your projects to new heights with the TMS2716JL - the ultimate solution for all your memory IC needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and stability, ensuring reliable performance even in high temperature environments.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board.

No. of Terminals: 24

Sufficient number of terminals for versatile connectivity options.

Package Style (Meter): IN-LINE

In-line package style is easy to integrate into existing circuit designs.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stability in varying environmental conditions.

Organization: 2KX8

Organized as 2Kx8, providing a good balance between storage capacity and access speed.

Output Characteristics: 3-STATE

3-state output allows for efficient bus sharing and reduces power consumption.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in cold environments.

Terminal Position: DUAL

Dual terminal position offers redundancy in connectivity for enhanced reliability.

Temperature Grade: COMMERCIAL

Commercial grade ensures compatibility with common operating conditions.

Technology: MOS

MOS technology offers low power consumption and high speed performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and stable connections on a PCB.

No. of Words: 2048 words

2048 words of memory provide ample storage capacity for various applications.

Memory Width: 8

Memory width of 8 bits allows for efficient data processing and retrieval.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy integration into circuit layouts.

No. of Words Code: 2K

2K words code allows for easy identification of memory capacity.

Memory Density: 16384 bit

High memory density of 16384 bits provides ample storage for data.

Maximum Access Time: 450 ns

Fast maximum access time of 450 ns ensures quick data retrieval.

Technical Specifications

Other Function Memory ICs TMS2716JL attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

450 ns

JESD-30 Code:

R-XDIP-T24

Memory Density:

16384 bit

Memory Width:

8

No. of Terminals:

24

No. of Words:

2048 words

No. of Words Code:

2K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS2716JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

NSN

5962-01-087-6738, 5962010876738, 5962-01-140-1660, 5962011401660, 5962-01-086-2717, 5962010862717, 5962-01-135-1556, 5962011351556, 5962-01-140-1657, 5962011401657

NIIN

010876738, 011401660, 010862717, 011351556, 011401657

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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