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M36W0R6030B0ZAQF

STMicroelectronics

M36W0R6030B0ZAQF by STMicroelectronics

M36W0R6030B0ZAQF by STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It supports asynchronous access with a max temp of 85 °C, ideal for industrial applications. Its compact design ensures efficient space utilization in devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,164 parts In-Stock

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2,164

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Digiode

USA . 1,011 parts In-Stock

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1,011

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Anansix

USA . 944 parts In-Stock

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944

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 383 parts In-Stock

1+ parts

$4.159

100+ parts

-

1k+ parts

$3.743

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383

$4.159

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$3.743

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MKK Technologies

India . 2,331 parts In-Stock

1+ parts

$7.821

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$7.821

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DigiPath Technology Company

USA . 2,331 parts In-Stock

1+ parts

$7.821

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2,331

$7.821

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Parana Technologies

USA . 2,087 parts In-Stock

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$4.973

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2,087

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$4.973

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Corphita

USA . 232 parts In-Stock

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Overview

Elevate your designs with the M36W0R6030B0ZAQF from STMicroelectronics, a leader in innovative memory solutions. This advanced Flash+SRAM memory IC ensures exceptional performance in demanding applications, providing reliability even in extreme temperatures. With its compact design and low power consumption, it’s perfect for industrial automation, IoT devices, and more. Trust in STMicroelectronics for quality that drives your innovations forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability, making the IC suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on PCBs, supporting high-density designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility and simplicity in interfacing with other components, leading to faster designs.

Mixed Memory Type: FLASH+SRAM

Combining FLASH and SRAM technologies allows the IC to offer both non-volatile and high-speed performance.

Nominal Supply Voltage / Vsup: 1.8V

Low power consumption at 1.8V is conducive to energy-efficient designs, essential for battery-operated devices.

Power Supplies (V): 1.8V

Operating at 1.8V reduces heat generation and increases the longevity of the device.

No. of Terminals: 88

A high number of terminals (88) allows for greater connectivity and flexibility in circuit design.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This modern package style enhances thermal performance and supports high pin density applications.

Maximum Operating Temperature: 85 °C

Rated for high temperatures, ensuring reliability in harsh environments.

Organization: 4MX16

This organization structure allows efficient data access and concludes scalability for various applications.

Minimum Operating Temperature: -40 °C

The wide temperature range enables usage in extreme conditions, suitable for industrial and automotive applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish promotes better solderability and corrosion resistance, important for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal placement simplifies PCB routing and aids in compact designs, minimizing board space.

Maximum Seated Height: 1.2 mm

A thin profile helps to reduce the overall height requirement in compact electronic assemblies.

Width: 8 mm

Compact width aids in space-efficient placement in modern devices.

Minimum Supply Voltage (Vsup): 1.7V

The low minimum supply voltage enhances power management capabilities in designs.

Length: 10 mm

Small dimensions ease integration into space-constrained environments.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, promising reliability and performance under rigorous conditions.

Technology: CMOS

CMOS technology ensures low power consumption along with high-speed performance, making it suitable for a variety of applications.

Terminal Form: BALL

Ball terminals provide enhanced mechanical stability and easier soldering compared to traditional leads.

Maximum Supply Current: 45 mA

Relatively low maximum supply current benefits power-sensitive applications, allowing for more efficient designs.

No. of Words: 4194304 words

Provides a significant amount of memory, supporting complex applications and facilitating high-performance tasks.

Memory Width: 16

A 16-bit memory width enhances data processing capabilities, improving performance in applications that require larger data operations.

Terminal Pitch: 0.8 mm

A finer terminal pitch supports higher-density connections, contributing to miniaturization of devices.

No. of Words Code: 4M

With 4M words, the IC offers considerable storage capacity, suitable for a wide range of applications.

Maximum Supply Voltage (Vsup): 1.95V

A maximum supply voltage of 1.95V provides flexibility in power supply options while maintaining performance.

Memory Density: 67108864 bit

High memory density allows for more data storage in a compact footprint, ideal for high-performance applications.

Memory IC Type: MEMORY CIRCUIT

Classified as a memory circuit, it is specifically optimized for storage and retrieval operations.

Maximum Standby Current: 0.00001 Amp

Extremely low standby current means reduced power consumption during idle states, making it ideal for portable applications.

Maximum Access Time: 70 ns

Fast access time ensures quick data retrieval, enhancing overall system responsiveness.

Technical Specifications

Other Function Memory ICs M36W0R6030B0ZAQF attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

SRAM IS ORGANIZED AS 512K X 16

JESD-30 Code:

R-PBGA-B88

JESD-609 Code:

e1

Length:

10 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

Mixed Memory Type:

FLASH+SRAM

No. of Functions:

1

No. of Terminals:

88

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA88,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00001 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36W0R6030B0ZAQF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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