Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M36P0R9070E0ZAQE by STMicroelectronics is a CMOS memory IC with a 32M x 16 organization, operating at 1.8V. It features a thin profile grid array package and operates asynchronously within -30 °C to 85 °C. Ideal for compact electronic applications requiring efficient data storage.
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The use of plastic/epoxy ensures a lightweight and durable package, making it suitable for a wide range of applications.
Supports surface mounting, allowing for more compact PCB designs and increased flexibility in placement.
The rectangular shape is optimized for space efficiency and ease of integration into various circuit layouts.
Asynchronous operation allows for flexible timing control, making it easy to integrate with various systems.
Low operating voltage helps conserve energy, making it ideal for battery-powered devices.
A higher number of terminals facilitates multiple connections, allowing for extensive functionality within a compact design.
The grid array packaging optimizes space and enhances thermal performance, essential for high-density applications.
Withstand high temperatures, making it suitable for a variety of environments including industrial applications.
This organization denotes a large memory capacity, allowing for extensive data storage and efficient data retrieval.
Extended operation range ensures reliable performance in harsh environments and extreme temperatures.
Bottom terminal positioning contributes to better circuit board layout and enhances soldering reliability.
The low profile design saves space on the PCB while enabling a compact form factor for slim devices.
Compact width facilitates integration in tightly packed electronic assemblies, ideal for miniaturization.
Allows operation under varying voltage conditions, providing flexibility for different power supply circuits.
The concise length contributes to overall reduced footprint on the board, which is crucial for modern electronics.
This specification ensures reliability over a wider temperature range, making it suitable for diverse applications.
CMOS technology enhances speed and minimizes power consumption, making it efficient for high-performance requirements.
Ball terminals improve soldering qualities and thermal dissipation, which is crucial for reliable device performance.
This vast number of addressable words allows for significant memory capacity, supporting complex applications.
A 16-bit wide memory interface provides the ability for faster data processing, enhancing overall system performance.
The fine terminal pitch allows for higher density board designs while maintaining signal integrity.
Indicates a large storage capacity, essential for applications requiring substantial data handling.
Operational flexibility at higher voltages while still maintaining low power consumption, suitable for various applications.
High memory density facilitates advanced and data-intensive applications without requiring additional chips.
As a dedicated memory circuit, it ensures optimized performance for data storage and retrieval functions.
Other Function Memory ICs M36P0R9070E0ZAQE attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M36P0R9070E0ZAQE Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
LL4148
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
SS14
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
BAV99
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM78L05ACMX/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LM358AN
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Cheng-yi Electronic
Surge Components
Philips Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
1N4148WT
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
DS14220-F50
Analog Devices
DS14220-F50 by Analog Devices is a CMOS MEMORY CIRCUIT with 2048-bit memory density. It operates in an INDUSTRIAL temperature range (-40 to 85 °C) and has a supply voltage range of 2.8V to 6V. This ROUND, METAL package IC is ideal for applications requiring reliable non-volatile memory storage in harsh environments.
S27KL0641DABHB020
Infineon Technologies
Infineon's S27KL0641DABHB020 is a 8MX8 MEMORY CIRCUIT with 67108864 bit Memory Density. It operates at 3V, -40 to 105 °C, and has AEC-Q100 Screening Level for INDUSTRIAL applications. The PLASTIC/EPOXY GRID ARRAY IC is SYNCHRONOUS with 24 terminals in a RECTANGULAR package style.
AT88SC0104CA-SH-T
Atmel
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
TMS4C1060-30N
Texas Instruments
TMS4C1060-30N by Texas Instruments is a 16-terminal MEMORY CIRCUIT IC with 5V supply, 25ns access time, and 70°C max temp. Ideal for commercial applications requiring fast memory processing in a PLASTIC/EPOXY package.
WSF128K16-37G1UM
Mercury Systems
MEMORY CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFP; Package Shape: SQUARE; No. of Words: 131072 words;
TMS27C291-45FN
Other Memory ICs;
XC17S10XLPD8C
Xilinx
The Xilinx XC17S10XLPD8C is a 95752-bit memory circuit IC with 3.3V supply voltage, operating at up to 10MHz clock frequency. It features synchronous operation, common I/O type, and 3-STATE output characteristics. Ideal for applications requiring low power consumption and high-speed memory access in commercial-grade environments.
TMS27PC32-120JE
DS90922R-000
DS90922R-000 by Analog Devices is a CMOS MEMORY CIRCUIT with 2 terminals in a ROUND METAL package. It features TIN LEAD finish and THROUGH-HOLE terminal form. Ideal for applications requiring Other Function Memory ICs in CYLINDRICAL style packages.
AT88SC0104C-SH-T
Microchip Technology
AT88SC0104C-SH-T by Microchip Technology is a 1024-bit CRYPTO MEMORY IC with 128x8 organization. It operates in SYNCHRONOUS mode with a max access time of 35ns. Ideal for industrial applications, it has a temperature range of -40 to 85°C and requires a supply voltage b/w 2.7V to 5.5V.
DS6204
Analog Devices' DS6204 is a CMOS Memory Circuit with 256-bit memory density. It operates b/w 0 °C to 70°C, making it suitable for commercial applications. The IC has a rectangular shape with 5 terminals and is ideal for various other function memory tasks.
TMS27C32-10NL
DS2400T
Analog Devices' DS2400T is a 3-terminal memory IC with a supply voltage of 5V, suitable for industrial applications. With a temperature range of -40 to 85 °C, it features tin-lead terminal finish and plastic/epoxy package material. Ideal for various functions requiring reliable memory storage in harsh environments.
TMS27PC32-15NE
TC518512FL-80
Toshiba
Toshiba's TC518512FL-80 is a 512KX8 memory IC with 3-STATE output, operating at 5V. It has a max access time of 80ns and consumes up to 60mA. Ideal for applications requiring high memory density and fast data retrieval in commercial temperature environments.
SNJ54AS870FH
SNJ54AS870FH by Texas Instruments is a MILITARY-grade TTL IC with 28 terminals in a CHIP CARRIER package. Operating temperature range from -55 to 125 °C, suitable for harsh environments. Ideal for applications requiring high reliability and performance in military and aerospace industries.
DS2401AZ+
Maxim Integrated
MEMORY CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
DS2401A+
MEMORY CIRCUIT;
TMS2150-45JD
TMS2150-45JD by Texas Instruments is a 512x9 MEMORY CIRCUIT IC with 45ns access time, 135mA max supply current, and 5V nominal voltage. It is ideal for commercial applications requiring fast memory operations in a ceramic rectangular package with 24 terminals.
TMS27C32-20NE4
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M36P0R8070E0ZACE
STMicroelectronics
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M36P0R8070E0ZACF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
M36P0R9060E0ZACE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA107,9X12,32;
M36P0R9060E0ZACF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words: 33554432 words;
M36P0R9070E0ZAC
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Width: 8 mm;
M36P0R9070E0ZACE
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Additional Features: PSRAM IS ORGANISED AS 8M X 16BIT;
M36P0R9070E0ZACF
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8;
M36P0R9070E0ZAQF
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 32M;
Micron Technology
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
M36P0R9060N0ZANE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: FBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8;
M36P0R9060N0ZANF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: FBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -30 Cel;
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B107;
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
Numonyx
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm;
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Organization: 32MX16;
M36P0R9070E0ZAQE
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
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