Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M36P0R9070E0ZAQF by STMicroelectronics is a CMOS memory IC with a 32M x 16 organization, operating at 1.8V. It features a thin profile grid array package and supports asynchronous mode, making it ideal for compact electronic applications. With a temp range of -30 °C to 85 °C, it's suitable for commercial use.
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$5.053
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$3.213
Durable and lightweight, the plastic/epoxy body material enhances the reliability and longevity of the memory IC.
The surface mount capability allows for compact circuit designs, facilitating easier integration into modern electronic devices.
The rectangular shape optimizes space utilization on PCBs, making it suitable for a variety of applications.
Asynchronous operation supports faster performance by allowing independent read and write cycles without synchronization delays.
A low nominal supply voltage of 1.8V minimizes power consumption, making this IC energy-efficient for battery-operated devices.
The high number of terminals facilitates robust connectivity and ample functionality for various applications.
The grid array package style allows for high-density designs and efficient thermal performance in compact spaces.
Capable of operating at higher temperatures ensures reliability in demanding environments, suitable for industrial applications.
The memory organization of 32MX16 provides a balanced approach to read and write operations, optimizing performance.
The ability to operate at low temperatures makes it versatile, ideal for outdoor or extreme condition applications.
Bottom terminal positioning simplifies PCB layout design, enhancing overall manufacturability.
A low seated height supports better airflow and thermal management, contributing to improved device performance.
The compact width allows for easier placement on PCBs, facilitating more complex and space-saving designs.
The minimum supply voltage requirement is low, ensuring compatibility with a wide range of power sources.
A modest length makes it suitable for integration into various design layouts, enhancing design flexibility.
Designed for extended commercial temperature ranges, this IC is suitable for a wide variety of applications across multiple industries.
Leveraging advanced CMOS technology, this memory IC offers high performance and low power consumption.
Ball terminals provide excellent electrical performance and support for automatic soldering processes, ensuring manufacturing efficiency.
This substantial word count affords ample storage capacity to support complex applications requiring significant data management.
A memory width of 16 bits enhances data throughput, enabling faster processing and better overall system performance.
The 0.8 mm terminal pitch allows for higher-density packaging, ensuring more functions in a smaller form factor.
The coded memory capacity of 32M makes it a practical choice for applications needing substantial memory without taking up excessive space.
The maximum supply voltage of 1.95V ensures a stable operation under various conditions, enhancing reliability.
A high memory density maximizes data storage capabilities, making it ideal for applications requiring large amounts of data processing.
As a dedicated memory circuit, it provides optimized performance for data storage tasks, essential for modern electronic systems.
Other Function Memory ICs M36P0R9070E0ZAQF attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M36P0R9070E0ZAQF Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
BAV99
Toshiba
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Grande Electronics
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Weitronic Enterprise
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
SMBJ18CA
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
C0603C104K5RACTU
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
Tak Cheong Electronics Holdings
Vicor
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
Changzhou Starsea Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
AT88SC0104CA-SH-T
Microchip Technology
Microchip AT88SC0104CA-SH-T is a 1024-bit Crypto Memory IC with 128x8 organization. Operating in synchronous mode, it has a memory width of 8 and operates b/w -40°C to 85°C. Ideal for secure applications requiring small outline packages and dual terminal positions.
DS28E80Q+T
Analog Devices
MEMORY CIRCUIT; Terminal Finish: Matte Tin (Sn) - annealed; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1;
WSF512K32-27H2M
White Electronic Designs
MEMORY CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 66; Package Code: PGA; Package Shape: SQUARE; Maximum Seated Height: 5.7 mm;
TMS4020NC
Texas Instruments
TMS4020NC by Texas Instruments is a 1KX2 MOS memory IC with 2048-bit density. It features separate I/O, open-drain output, and operates b/w -25°C to 70°C. Commonly used in applications requiring high-density memory storage with dual-terminal positions.
47L16T-E/SN
47L16T-E/SN by Microchip Technology is a synchronous EEPROM+SRAM memory IC with 2KX8 organization. Operating at -40 to 125 °C, it has a memory density of 16384 bit and max access time of 400 ns. Ideal for automotive applications due to its small outline package style and CMOS technology.
TMS27PC32-25JL4
Other Memory ICs;
TMS27P32N45
TMS27PC32NE4
M36W108T120ZM5
STMicroelectronics
M36W108T120ZM5 from STMicroelectronics is a low-profile, asynchronous mixed memory IC featuring 1M x 8 organization with Flash+SRAM technology. It operates b/w -20 °C to 85°C and supports power supplies of 2.7V to 3.6V. Ideal for compact applications requiring efficient data storage and retrieval.
TMS2400NC
TMS2400NC by Texas Instruments is a MOS technology memory IC with 28 terminals in an IN-LINE package. It operates b/w -25°C to 85°C, making it suitable for various applications requiring reliable memory storage and retrieval in industrial settings. The PLASTIC/EPOXY rectangular package with dual terminal position and 2.54mm pitch offers durability and ease of integration.
DM87S191AJ/A+
TMS27C49-5TL
S71KL512SC0BHV003
Infineon Technologies
S71KL512SC0BHV003 by Infineon Technologies is a 64MX8 memory IC with 536Mbit density. Operating at 3V, it features synchronous mode and CMOS technology. Ideal for industrial applications, this very thin profile GRID ARRAY package has 24 terminals and operates b/w -40 to 105°C.
TMX27PC256N25
DS2411R+T&R
Maxim Integrated
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Memory Width: 1;
M36W0R5020T0ZAQ
M36W0R5020T0ZAQ by STMicroelectronics is a mixed memory IC featuring 2M x 16 organization, operating at a nominal voltage of 1.8V. It supports asynchronous mode with a max access time of 70ns and operates in industrial temperatures from -40 °C to 85 °C. Ideal for applications requiring compact, high-density memory solutions.
CY8C20110-LDX2I
CY8C20110-LDX2I by Infineon Technologies is a 2KX1 MEMORY CIRCUIT IC with SYNCHRONOUS operation, suitable for INDUSTRIAL applications. It operates at 3V with a temperature range of -40 to 85 °C and features a SQUARE package style measuring 3x3 mm in size. This NO LEAD chip carrier has 16 terminals on a 0.5mm pitch, making it ideal for compact electronic designs.
47L16-E/ST
47L16-E/ST by Microchip Technology is a small outline memory IC with 2Kx8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is ideal for automotive applications due to its thin profile, wide temperature range (-40 to 125°C), and high memory density of 16384 bits.
TMX27C512-25
CY15B256Q-SXA
CY15B256Q-SXA by Infineon Technologies is a 32KX8 memory IC with synchronous operation and 262144 bit memory density. It operates at a voltage range of 2V to 3.6V, suitable for industrial applications requiring reliable small outline package (SOP) design with gull wing terminals.
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M36P0R8070E0ZACE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M36P0R8070E0ZACF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
M36P0R9060E0ZACE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA107,9X12,32;
M36P0R9060E0ZACF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words: 33554432 words;
M36P0R9070E0ZAC
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Width: 8 mm;
M36P0R9070E0ZACE
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Additional Features: PSRAM IS ORGANISED AS 8M X 16BIT;
M36P0R9070E0ZACF
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8;
M36P0R9070E0ZAQE
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
Micron Technology
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
M36P0R9060N0ZANE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: FBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8;
M36P0R9060N0ZANF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: FBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -30 Cel;
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B107;
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
Numonyx
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm;
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Organization: 32MX16;
M36P0R9070E0ZAQF
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
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