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M36W0R5020T0ZAQ

STMicroelectronics

M36W0R5020T0ZAQ by STMicroelectronics

M36W0R5020T0ZAQ by STMicroelectronics is a mixed memory IC featuring 2M x 16 organization, operating at a nominal voltage of 1.8V. It supports asynchronous mode with a max access time of 70ns and operates in industrial temperatures from -40 °C to 85 °C. Ideal for applications requiring compact, high-density memory solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,807 parts In-Stock

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Vyrian

USA . 2,036 parts In-Stock

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Anansix

USA . 1,478 parts In-Stock

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1,478

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 857 parts In-Stock

1+ parts

$2.819

100+ parts

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$2.537

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857

$2.819

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$2.537

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MKK Technologies

India . 253 parts In-Stock

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$5.301

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253

$5.301

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DigiPath Technology Company

USA . 253 parts In-Stock

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$5.301

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253

$5.301

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Corphita

USA . 4,638 parts In-Stock

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Parana Technologies

USA . 1,235 parts In-Stock

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$3.370

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$3.370

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Overview

Unlock unparalleled performance with the M36W0R5020T0ZAQ from STMicroelectronics, a leader in innovative memory solutions. This cutting-edge memory IC seamlessly integrates FLASH and SRAM, delivering unmatched reliability for industrial applications. Engineered for efficiency, it operates under extreme temperatures while consuming minimal power. Experience superior quality and versatility that enhances your designs, ensuring longevity and scalability, making it the perfect choice for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective materials ensure reliable performance in various applications.

Surface Mount: YES

Enables compact designs and efficient automated assembly, saving space on PCBs.

Package Shape: RECTANGULAR

Standard shape allows for easier integration into existing layouts and designs.

Operating Mode: ASYNCHRONOUS

Provides faster and easier data read/write operations, enhancing overall system performance.

Mixed Memory Type: FLASH+SRAM

Combines the advantages of both memory types, offering flexibility and efficiency in data storage.

Nominal Supply Voltage / Vsup (V): 1.8

Low voltage operation helps to reduce power consumption, making it suitable for battery-powered devices.

Power Supplies (V): 1.8

Supports low-power applications, essential for energy-efficient designs.

No. of Terminals: 88

Allows for complex connections and data lines, accommodating advanced functionalities.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Thin profile and fine pitch design enable high-density mounting, saving space in compact applications.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, ensuring reliability in industrial applications.

Organization: 2MX16

Facilitates effective memory organization, enhancing access speed and overall efficiency.

Minimum Operating Temperature: -40 °C

Suitable for harsh environments, making it ideal for industrial and automotive applications.

Terminal Finish: TIN LEAD

Provides good solderability and enhances the reliability of electrical connections.

Terminal Position: BOTTOM

Bottom positioning allows for efficient heat dissipation and compact assembly.

Maximum Seated Height: 1.2 mm

Low height profile supports space-constrained designs while maintaining performance.

Width: 8 mm

Compact width facilitates integration into smaller PCBs for space-sensitive applications.

Minimum Supply Voltage (Vsup): 1.7 V

Offers versatility in application designs with varying voltage requirements.

Length: 10 mm

Short length aids in developing smaller electronic devices without compromising functionality.

Temperature Grade: INDUSTRIAL

Designed for tough environments, ensuring longevity and reliability in demanding applications.

Technology: CMOS

CMOS technology allows for low power consumption and efficient performance.

Terminal Form: BALL

Ball grid array provides better thermal performance and electrical connectivity.

Maximum Supply Current: 45 mA

Low supply current enhances energy efficiency in various applications.

No. of Words: 2097152 words

Large memory capacity supports complex data storage needs in advanced systems.

Memory Width: 16

16-bit width allows for effective processing and quicker data transactions.

Terminal Pitch: 0.8 mm

Fine pitch enables dense packing of components on PCB, ideal for high-performance systems.

No. of Words Code: 2M

Indicates significant memory capacity suitable for varied applications including embedded systems.

Maximum Supply Voltage (Vsup): 1.95 V

Flexibility in supply voltage accommodates a variety of system designs.

Memory Density: 33554432 bit

High density provides significant data storage, essential for complex applications.

Memory IC Type: MEMORY CIRCUIT

Designed specifically for memory-intensive applications, ensuring optimal performance.

Maximum Standby Current: 0.00005 Amp

Extremely low standby current conserves power in idle states, prolonging battery life.

Maximum Access Time: 70 ns

Fast access time improves overall system responsiveness and performance.

Technical Specifications

Other Function Memory ICs M36W0R5020T0ZAQ attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

SRAM IS ORGANIZED AS 256K X 16

JESD-30 Code:

R-PBGA-B88

JESD-609 Code:

e0

Length:

10 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

Mixed Memory Type:

FLASH+SRAM

No. of Functions:

1

No. of Terminals:

88

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA88,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00005 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36W0R5020T0ZAQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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