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M36W216T100ZA1

STMicroelectronics

M36W216T100ZA1 by STMicroelectronics

M36W216T100ZA1 from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal supply and operates b/w 2.7V to 3.3V. It features a density of 16Mbit, organized as 1Mx16, and supports commercial temp ranges up to 70 °C. Ideal for compact applications requiring efficient data storage in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,138 parts In-Stock

1+ parts

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4,138

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Vyrian

USA . 1,108 parts In-Stock

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1k+ parts

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1,108

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Anansix

USA . 144 parts In-Stock

1+ parts

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100+ parts

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144

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,439 parts In-Stock

1+ parts

$3.837

100+ parts

-

1k+ parts

$3.454

10k+ parts

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1,439

$3.837

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$3.454

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MKK Technologies

India . 1,795 parts In-Stock

1+ parts

$7.216

100+ parts

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10k+ parts

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1,795

$7.216

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DigiPath Technology Company

USA . 1,795 parts In-Stock

1+ parts

$7.216

100+ parts

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10k+ parts

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1,795

$7.216

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Corphita

USA . 4,881 parts In-Stock

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4,881

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Parana Technologies

USA . 517 parts In-Stock

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100+ parts

$4.588

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517

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$4.588

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Overview

Unlock innovative potential with the M36W216T100ZA1 by STMicroelectronics—a top-tier memory solution designed for high-performance applications. Renowned for quality and reliability, STMicroelectronics ensures this asynchronous memory IC delivers seamless operation in various environments, from consumer electronics to industrial automation. Experience enhanced efficiency, compact design, and exceptional durability, empowering your projects with unmatched speed and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making the IC reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration onto PCBs, leading to space-saving and enhanced performance.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and design on circuit boards, optimizing space utilization in electronic devices.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent operation of the memory, providing flexibility and speed advantages in data access.

Nominal Supply Voltage / Vsup: 3 V

Operating at a nominal voltage of 3 V is energy efficient and suitable for battery-powered applications, maximizing battery life.

No. of Terminals: 66

With 66 terminals, this IC provides ample connectivity options for complex circuits, enhancing versatility in design.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile grid array design reduces height, enabling miniaturization of devices without compromising performance.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in moderate thermal environments, suitable for a wide range of applications.

Organization: 1MX16

The organization of 1MX16 supports high data storage within a compact architecture, making it efficient for various data-intensive tasks.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows for versatile applications in moderate climates, ensuring functionality across various environments.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient mounting and better thermal dissipation, enhancing overall performance and reliability.

Maximum Seated Height: 1.4 mm

A low seated height of 1.4 mm contributes to the overall compactness of electronic assemblies, making it ideal for space-constrained designs.

Width: 8 mm

An 8 mm width provides a balance of compact design without sacrificing connectivity options, making installation straightforward.

Minimum Supply Voltage: 2.7 V

The ability to operate down to 2.7 V enhances compatibility with various power supply designs, improving design flexibility.

Length: 12 mm

At 12 mm in length, this memory IC is manageable for integration into various device sizes while maintaining performance integrity.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, this IC is suitable for general consumer electronics applications, ensuring reliability in everyday use.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, making it suitable for modern electronic applications.

Terminal Form: BALL

Ball terminal form optimizes soldering and enhances electrical conductivity, resulting in improved reliability and performance.

No. of Words: 1,048,576 words

With a data capacity of over 1 million words, this IC offers substantial storage capabilities for demanding applications.

Memory Width: 16

A memory width of 16 bits allows for efficient data processing, making it ideal for applications requiring fast access to large data sets.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch enables finer pitch designs accommodating more connections in compact spaces.

No. of Words Code: 1M

The 1M word capacity indicates high capability for data storage, fitting the needs of complex applications and enhancing user experience.

Maximum Supply Voltage: 3.3 V

Supporting a maximum supply voltage of 3.3 V provides flexibility for integration with various voltage-sensitive components.

Memory Density: 16,777,216 bit

With a density of 16,777,216 bits, this IC boasts significant storage capacity, meeting the demands of high-performance applications.

Memory IC Type: MEMORY CIRCUIT

Classified as a memory circuit, this product is specifically designed for reliable data storage, meeting the requirements of various electronic devices.

Technical Specifications

Other Function Memory ICs M36W216T100ZA1 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO CONTAINS 128K X 16 SRAM

JESD-30 Code:

R-PBGA-B66

Length:

12 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

66

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36W216T100ZA1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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