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M36W0R6030B0ZAQE

STMicroelectronics

M36W0R6030B0ZAQE by STMicroelectronics

M36W0R6030B0ZAQE by STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It combines FLASH and SRAM in a compact grid array package, ideal for industrial applications. With an access time of 70 ns and temp range from -40 °C to 85 °C, it ensures reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,506 parts In-Stock

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3,506

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Digiode

USA . 2,466 parts In-Stock

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2,466

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Anansix

USA . 1,102 parts In-Stock

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1,102

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 182 parts In-Stock

1+ parts

$3.588

100+ parts

-

1k+ parts

$3.229

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182

$3.588

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$3.229

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MKK Technologies

India . 1,879 parts In-Stock

1+ parts

$6.747

100+ parts

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1,879

$6.747

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DigiPath Technology Company

USA . 1,879 parts In-Stock

1+ parts

$6.747

100+ parts

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1,879

$6.747

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Corphita

USA . 827 parts In-Stock

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827

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Parana Technologies

USA . 359 parts In-Stock

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$4.290

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359

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$4.290

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Overview

Unlock unparalleled performance with the M36W0R6030B0ZAQE from STMicroelectronics, a leader in innovative memory solutions. This versatile FLASH+SRAM memory IC excels in demanding environments, offering exceptional reliability and efficiency. Designed for various applications, it supports fast data access under extreme temperatures. Choose STMicroelectronics for cutting-edge quality that powers your projects while optimizing space and energy use, ensuring you stay ahead in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures protection against environmental factors, enhancing product longevity.

Surface Mount: YES

Surface mount compatibility allows for a compact design and ease of integration into various electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient PCB layout and space optimization in modern electronic devices.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster data access without the need for clock synchronization, improving performance.

Mixed Memory Type: FLASH+SRAM

Combining FLASH and SRAM provides a versatile memory solution, balancing speed and data retention efficiency.

Nominal Supply Voltage / Vsup: 1.8V

A low supply voltage of 1.8V minimizes power consumption, making this IC suitable for energy-efficient applications.

Power Supplies (V): 1.8

Operating at 1.8V reduces heat generation, contributing to reliability in sensitive electronic systems.

No. of Terminals: 88

With 88 terminals, this IC provides ample connectivity options for a wide range of applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array package supports high-density designs while maintaining a thin profile for compact applications.

Maximum Operating Temperature: 85 °C

Rated for high temperature operations, this IC ensures reliability in demanding industrial environments.

Organization: 4MX16

A 4MX16 organization allows for efficient data storage and retrieval, optimizing overall memory performance.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 85 °C) makes this IC ideal for use in extreme environments.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish improves solderability and corrosion resistance, enhancing reliability over time.

Terminal Position: BOTTOM

Bottom terminal positioning supports easier PCB assembly and contributes to better thermal management.

Maximum Seated Height: 1.2 mm

A low seated height allows for a more compact design, saving space in high-density applications.

Width: 8 mm

An 8 mm width helps maintain a balance between space efficiency and ease of handling during assembly.

Minimum Supply Voltage (Vsup): 1.7V

With a minimum supply voltage of 1.7V, it provides operational flexibility in various voltage-sensitive applications.

Length: 10 mm

The length of 10 mm fits well within compact electronic device designs, allowing for space optimization.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in challenging operational conditions.

Technology: CMOS

CMOS technology offers low static power consumption and high noise immunity, making it suitable for modern applications.

Terminal Form: BALL

Ball terminals enhance soldering capability and support robust electrical connections in surface mount technology.

Maximum Supply Current: 45 mA

A maximum supply current of 45 mA allows for efficient power usage without sacrificing performance.

No. of Words: 4,194,304 words

With over 4 million words of storage, it provides substantial capacity for data-intensive applications.

Memory Width: 16

A memory width of 16 bits allows for efficient data processing, improving overall performance in applications.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is suitable for modern PCB designs, supporting high-density layouts without sacrificing strength.

No. of Words Code: 4M

Supporting a 4M word code specification indicates significant memory capacity for various tasks and applications.

Maximum Supply Voltage (Vsup): 1.95V

The upper limit of 1.95V allows for operational flexibility in environments with varying voltage requirements.

Memory Density: 67,108,864 bits

This high memory density facilitates large-scale data storage, ideal for applications requiring extensive memory.

Memory IC Type: MEMORY CIRCUIT

Classified as a memory circuit, it is tailored for efficient data storage and retrieval tasks.

Maximum Standby Current: 0.00001 Amp

An exceptionally low standby current promotes energy efficiency, making it suitable for battery-operated devices.

Maximum Access Time: 70 ns

A maximum access time of 70 ns ensures swift data retrieval, enhancing system response times in high-performance applications.

Technical Specifications

Other Function Memory ICs M36W0R6030B0ZAQE attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

SRAM IS ORGANIZED AS 512K X 16

JESD-30 Code:

R-PBGA-B88

JESD-609 Code:

e1

Length:

10 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

Mixed Memory Type:

FLASH+SRAM

No. of Functions:

1

No. of Terminals:

88

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA88,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00001 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36W0R6030B0ZAQE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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