Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M36W0R6030T0ZAQT by STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It supports asynchronous access with a max access time of 70ns and operates in industrial conditions from -40 °C to 85 °C. Ideal for applications requiring mixed FLASH+SRAM memory in compact designs.
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$2.669
MKK Technologies
$5.576
DigiPath Technology Company
Corphita
Parana Technologies
$3.545
The durable plastic/epoxy material ensures reliability and protection against environmental factors, making it suitable for a variety of applications.
Surface mount compatibility allows for easier assembly and reduces the footprint on the PCB, facilitating compact designs.
The rectangular package shape provides a standard form factor that is widely accepted in design, simplifying integration into existing systems.
An asynchronous operating mode delivers faster data processing, enabling improved performance for real-time applications.
The combination of FLASH and SRAM offers flexibility for both data storage and quick access, optimizing performance for various use cases.
A nominal supply voltage of 1.8V promotes energy efficiency, which is crucial for battery-powered devices and reduces overall power consumption.
Supporting a 1.8V power supply aligns with modern low-voltage standards, ensuring compatibility with a wide range of electronics.
Having 88 terminals allows for extensive connectivity options, making it adaptable for various applications requiring multiple data lines.
The thin profile and fine pitch grid array design enable high-density integration, making it ideal for space-constrained applications.
With a maximum operating temperature of 85 °C, it suits industrial environments that require reliable performance under higher thermal conditions.
The 4M x 16 organization provides a good balance of capacity and access speed, making it suitable for a variety of applications.
A minimum operating temperature of -40 °C ensures functionality in extreme cold environments, enhancing versatility and durability.
The tin lead finish offers excellent solderability and reliability during installation, ensuring stable connections within the circuit.
Bottom terminal positioning facilitates efficient surface mounting, contributing to design flexibility and ease of integration.
A maximum seated height of 1.2 mm allows for low-profile designs, crucial for compact electronic devices.
At 8 mm wide, the size supports versatile design possibilities and fits into various electronic setups without bulky modifications.
The minimum supply voltage of 1.7V enhances compatibility with low-power systems, extending battery life and reducing energy costs.
With a length of 10 mm, the device can easily fit into compact layouts while still allowing for ample interconnectivity.
Rated for industrial temperature ranges, this product is designed for robust performance and longevity in demanding environments.
CMOS technology allows for lower power consumption combined with high-speed operation, making it suitable for modern applications.
Ball terminal form enables easy soldering and improves reliability in surface-mounted designs, reducing the risk of mechanical failures.
A maximum supply current of 45 mA ensures adequate power for operations, making it suitable for high-demand applications without overheating.
Offering 4,194,304 words of memory, this device provides a substantial data capacity for applications requiring extensive storage.
The 16-bit memory width supports high-speed data transfers, enhancing overall system efficiency.
A terminal pitch of 0.8 mm allows for higher density layouts while ensuring reliable connections in tighter spaces.
The 4M word code offers a sufficient code length for various applications, ensuring efficient data storage and access.
A maximum supply voltage of 1.95V provides flexibility in power supply options, ensuring compatibility with a variety of systems.
With a memory density of 67,108,864 bits, this IC provides ample storage capacity for complex applications and data processing.
As a memory circuit with advanced capabilities, it is ideal for applications ranging from consumer electronics to industrial systems.
The ultra-low maximum standby current of 0.00001 A enhances power efficiency, especially for battery-operated devices.
With a maximum access time of 70 ns, the product ensures rapid data retrieval, crucial for applications needing swift responses.
Other Function Memory ICs M36W0R6030T0ZAQT attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M36W0R6030T0ZAQT Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
2N2222A
General Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
LIS2DH12TR
STMicroelectronics
LIS2DH12TR by STMicroelectronics is a 3-axis accelerometer with digital voltage output. It operates b/w -40 to 85°C, with supply voltage range of 1.71-3.6V. Ideal for applications requiring precise motion sensing in compact spaces like wearables and IoT devices.
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
1N4148
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Weitron Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
350766-1
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
Comset Semiconductors
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
STM32H743ZIT6
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
1N4148W-7-F
Multicomp Pro
SNJ54ALS871JD
SNJ54ALS871JD by Texas Instruments is a MILITARY-grade TTL IC with 24 terminals in an IN-LINE package. It operates b/w -55°C to 125°C, making it suitable for harsh environments. This IC is commonly used in applications requiring high reliability and performance under extreme temperature conditions.
DS6417P-001
Analog Devices
DS6417P-001 by Analog Devices is a 128Kx8 MEMORY CIRCUIT with CMOS tech. Operating at 0-70 °C, it has a supply voltage range of 4.5-5.5V. Ideal for applications requiring MICROELECTRONIC ASSEMBLY in COMMERCIAL settings.
DS14220-F50
DS14220-F50 by Analog Devices is a CMOS MEMORY CIRCUIT with 2048-bit memory density. It operates in an INDUSTRIAL temperature range (-40 to 85 °C) and has a supply voltage range of 2.8V to 6V. This ROUND, METAL package IC is ideal for applications requiring reliable non-volatile memory storage in harsh environments.
SN54HC670FK
SN54HC670FK by Texas Instruments is a CMOS memory IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -55°C to 125°C, suitable for military-grade applications. It has power supplies of 2-6V and is surface mountable, making it ideal for compact electronic devices.
DS2411P
Dallas Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-C6;
DS6204
Analog Devices' DS6204 is a CMOS Memory Circuit with 256-bit memory density. It operates b/w 0 °C to 70°C, making it suitable for commercial applications. The IC has a rectangular shape with 5 terminals and is ideal for various other function memory tasks.
TMS27PC32-20NE4
Other Memory ICs;
DS1204V
Analog Devices' DS1204V is a CMOS memory IC with 5V supply, 5 terminals, and 6mA max current. It operates from 0 to 70 °C, ideal for commercial applications requiring reliable non-volatile memory storage in microelectronic assemblies.
DS2422P/T&R
DS2422P/T&R by Analog Devices is a 1KX1 MEMORY CIRCUIT with 1024 bit Memory Density. It operates in ASYNCHRONOUS mode at 5V, suitable for INDUSTRIAL applications. This SMALL OUTLINE IC has PLASTIC/EPOXY body, DUAL terminals, and can function b/w -40 to 85 °C.
DS2502R+U
Other Memory ICs; Peak Reflow Temperature (C): 260; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;
SAA4955HL
Philips Semiconductors
Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE; Terminal Pitch: .8 mm;
SNC54LS170W
SNC54LS170W by Texas Instruments is a MIL-STD-883 Class B (Modified) rated TTL IC with 16 terminals and a supply voltage of 5V. Its ceramic package can operate b/w -55°C to 125°C, making it suitable for military-grade applications requiring reliable memory functions in harsh environments. This rectangular flatpack IC is surface mountable and ideal for use in rugged electronic systems where high temperature tolerance and durability are essential.
TMS4C1060-40N
TMS4C1060-40N by Texas Instruments is a 16-terminal MEMORY CIRCUIT IC with 5V supply, 30ns access time, and 70°C max temp. Ideal for commercial applications requiring CMOS technology in an IN-LINE package style.
TMS4C1060-30DJ
TMS4C1060-30DJ by Texas Instruments is a 20-terminal memory IC with 5V supply, operating b/w 0-70°C. It features a max access time of 25ns and standby current of 0.01A. Ideal for commercial applications requiring fast memory circuits in small outline packages.
DS1207-G2C
Analog Devices' DS1207-G2C is a CMOS MEMORY CIRCUIT with SYNCHRONOUS operation. It has an operating temperature range of 0-70 °C and TIN LEAD terminal finish. Ideal for applications requiring high-speed memory functions in COMMERCIAL grade environments.
TMS27PC32-25JE4
M28F221-80XN6
TMS44C251-12SD
TMS44C251-12SD by Texas Instruments is a 256KX4 MEMORY CIRCUIT IC with 1048576 bit Memory Density. It operates at 5V, has a Max Access Time of 120ns, and consumes up to 95mA. This CMOS technology chip is used in applications requiring fast memory access and high data storage capacity.
TMS4100NC
TMS4100NC by Texas Instruments is a MOS memory IC with 28 terminals in an IN-LINE package. It operates b/w -25°C to 85°C, making it suitable for various applications requiring reliable memory storage in electronic devices. The rectangular PLASTIC/EPOXY body and DUAL terminal position enhance its durability and ease of integration.
TMS2708-35JL
TMS2708-35JL by Texas Instruments is a 1KX8 MOS memory IC with 8192-bit density and 350 ns access time. It features 3-STATE output characteristics, operates b/w 0 to 70 °C, and comes in a ceramic rectangular package. Ideal for applications requiring fast data retrieval in commercial temperature environments.
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M36W0R5020B0ZAQT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M36W0R5020T0ZAQ
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
M36W0R6030B0ZAQT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
M36W0R5020T0ZAQT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Organization: 2MX16;
M36W0R5020T0ZAQE
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 33554432 bit;
M36W0R6030T0ZAQE
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
M36W0R6030B0ZAQF
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Width: 16;
M36W0R6040B0ZAQE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Mixed Memory Type: FLASH+PSRAM;
M36W0R5020B0ZAQE
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8;
M36W0R6030B0ZAQ
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 67108864 bit;
M36W0R6030T0ZAQF
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Mixed Memory Type: FLASH+SRAM;
M36W0R5020B0ZAQF
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 70 ns;
M36W0R6030T0ZAQ
M36W0R6040B0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
M36W0R6040B0ZAQT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -30 Cel;
M36W0R6040B0ZAQF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
M36W0R6030B0ZAQE
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
M36W0R5020B0ZAQ
M36W0R5020T0ZAQF
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Length: 10 mm;
Numonyx
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Additional Features: SRAM IS ORGANIZED AS 512K X 16;
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