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47L04-E/ST

Microchip Technology

47L04-E/ST by Microchip Technology

47L04-E/ST by Microchip Technology is a small outline, thin profile memory IC with 512x8 organization. It operates synchronously and combines EEPROM with SRAM technology. Ideal for automotive applications, it has a temperature range of -40 to 125°C and requires a supply voltage b/w 2.7V to 3.6V.

Median Price

$0.830

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,965 parts In-Stock

1+ parts

$0.830

100+ parts

$0.812

1k+ parts

$0.797

10k+ parts

-

1,965

$0.830

$0.812

$0.797

-

Microchip Technology

USA . 1,820 parts In-Stock

1+ parts

$0.830

100+ parts

$0.780

1k+ parts

$0.720

10k+ parts

$0.680

1,820

$0.830

$0.780

$0.720

$0.680

DigiKey

USA . 437 parts In-Stock

1+ parts

$0.830

100+ parts

$0.812

1k+ parts

-

10k+ parts

-

437

$0.830

$0.812

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.812

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.812

-

-

-

Chip Stock

USA . 19,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,300

-

-

-

-

Vyrian

USA . 2,512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,512

-

-

-

-

VNN

France . 1,223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,223

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,210 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

-

2,210

$0.710

-

-

-

Continental Prestige Electronics

USA . 3,797 parts In-Stock

1+ parts

$0.812

100+ parts

-

1k+ parts

-

10k+ parts

$0.795

3,797

$0.812

-

-

$0.795

Argo Parts USA

USA . 669 parts In-Stock

1+ parts

$0.812

100+ parts

-

1k+ parts

-

10k+ parts

-

669

$0.812

-

-

-

RGB Technical Solutions

Ukraine . 5,469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,469

-

-

-

-

iodParts Technologies Inc.

India . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.795

1k+ parts

$0.771

10k+ parts

$0.755

100

-

$0.795

$0.771

$0.755

Overview

Enhance your electronic devices with the high-quality 47L04-E/ST by Microchip Technology. As a leading manufacturer in the industry, Microchip delivers reliable products that guarantee superior performance and durability. The 47L04-E/ST falls under the category of Other Function Memory ICs, offering a mix of EEPROM and SRAM technology perfect for various applications. With its compact design, wide operating temperature range, and low power consumption, this memory circuit provides exceptional value and benefits to customers seeking efficient and dependable solutions for their projects. Upgrade your system today with the 47L04-E/ST and experience unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation helps in better data transfer and synchronization within the memory circuit.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables usage in varying environmental conditions.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage ensures compatibility with different power sources.

Technical Specifications

Other Function Memory ICs 47L04-E/ST attributes and parameters. Explore more Other Function Memory ICs devices from Microchip Technology

Specs

Maximum Access Time:

400 ns

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Mixed Memory Type:

EEPROM+SRAM

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

47L04-E/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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