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SN74AS871JDP4

Texas Instruments

SN74AS871JDP4 by Texas Instruments

SN74AS871JDP4 by Texas Instruments is a TTL technology IC with 28 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, ideal for commercial applications. The ceramic rectangular package makes it suitable for various other function memory circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,629 parts In-Stock

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3,629

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Vyrian

USA . 3,489 parts In-Stock

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3,489

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 717 parts In-Stock

1+ parts

$3.622

100+ parts

-

1k+ parts

$4.136

10k+ parts

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717

$3.622

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$4.136

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DigiPath Technology Company

USA . 1,348 parts In-Stock

1+ parts

$3.989

100+ parts

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1,348

$3.989

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ChromeModa Solutions

Germany . 4,105 parts In-Stock

1+ parts

$4.070

100+ parts

$3.337

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4,105

$4.070

$3.337

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IDEA Electronic Components Group

UK . 1,355 parts In-Stock

1+ parts

$4.070

100+ parts

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1k+ parts

$3.663

10k+ parts

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1,355

$4.070

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$3.663

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AZTECH Wire

Italy . 821 parts In-Stock

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$17.792

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821

$17.792

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One Stop Electronics

USA . 974 parts In-Stock

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$30.000

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974

$30.000

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Corphita

USA . 2,544 parts In-Stock

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2,544

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Overview

Experience the unmatched quality and reliability of the SN74AS871JDP4 by Texas Instruments, a leading manufacturer in the industry. This versatile IC falls under the category of Other Function Memory ICs, making it suitable for a wide range of applications. With its durable ceramic package and commercial-grade temperature rating, this product is built to last. Trust Texas Instruments to deliver cutting-edge technology in every component, providing customers with unparalleled value, benefits, and advantages. Choose the SN74AS871JDP4 for your next project and experience the difference.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and stability, making them ideal for high-temperature applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of board space and easy integration into existing circuit designs.

No. of Terminals: 28

With 28 terminals, this product offers a high level of connectivity for complex circuitry.

Terminal Position: DUAL

Dual terminal positions provide redundancy and ensure secure connections for improved reliability.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making it suitable for high-performance applications.

Technical Specifications

Other Function Memory ICs SN74AS871JDP4 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS871JDP4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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