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47C04T-E/SN

Microchip Technology

47C04T-E/SN by Microchip Technology

47C04T-E/SN by Microchip Technology is a synchronous EEPROM+SRAM memory IC with 512x8 organization. Operating at 5V, it has a max access time of 400ns and is suitable for automotive applications due to its temperature grade.

Median Price

$1.086

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 67 parts In-Stock

1+ parts

$1.086

100+ parts

-

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67

$1.086

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Vyrian

USA . 4,330 parts In-Stock

1+ parts

-

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4,330

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VNN

France . 2,384 parts In-Stock

1+ parts

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2,384

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,075 parts In-Stock

1+ parts

$1.086

100+ parts

-

1k+ parts

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10k+ parts

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4,075

$1.086

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Continental Prestige Electronics

USA . 504 parts In-Stock

1+ parts

$1.086

100+ parts

-

1k+ parts

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10k+ parts

$1.064

504

$1.086

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$1.064

Corohmni

South Africa . 129 parts In-Stock

1+ parts

$3.848

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129

$3.848

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Aztec Data Supply Inc.

USA . 2,271 parts In-Stock

1+ parts

$5.400

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2,271

$5.400

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AZTECH Wire

Italy . 462 parts In-Stock

1+ parts

$9.464

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462

$9.464

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Ampacity Inc.

Singapore . 1,250 parts In-Stock

1+ parts

$12.000

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1,250

$12.000

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Semicontronic

India . 1,443 parts In-Stock

1+ parts

$16.000

100+ parts

$15.600

1k+ parts

$15.520

10k+ parts

-

1,443

$16.000

$15.600

$15.520

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QualityLine Systems

Poland . 6,336 parts In-Stock

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6,336

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Marpe Global Electronics

Taiwan . 5,314 parts In-Stock

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5,314

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XL Components Corporation

Australia . 2,950 parts In-Stock

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2,950

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$1.064

1k+ parts

$1.032

10k+ parts

$1.010

100

-

$1.064

$1.032

$1.010

Overview

Experience unparalleled reliability and performance with the 47C04T-E/SN by Microchip Technology. This versatile memory IC offers a compact design, making it perfect for a wide range of applications. With a focus on quality and innovation, Microchip Technology ensures that this product delivers exceptional value to customers. Trust in the expertise of the manufacturer and unlock the benefits of seamless operation and enhanced functionality with the 47C04T-E/SN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes this product lightweight and durable, making it a good choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into circuit boards, making it a convenient choice for manufacturing processes.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, saving space in electronic devices and making it a versatile option for tight layouts.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures real-time data processing and synchronization, making it ideal for high-performance applications.

Mixed Memory Type: EEPROM+SRAM

The combination of EEPROM and SRAM memory types offers both non-volatile and volatile memory capabilities, providing flexibility for storing and accessing data.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures stable and reliable power delivery, making it compatible with a wide range of systems and devices.

No. of Terminals: 8

The 8 terminals enable secure connections and efficient data transfer, enhancing the overall performance of the memory IC.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and simplifies installation, making it suitable for compact electronic designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability even in harsh environments, making it a dependable choice for industrial and automotive applications.

Organization: 512X8

The 512X8 organization provides a balance between memory capacity and data width, offering versatility for various data storage requirements.

Technical Specifications

Other Function Memory ICs 47C04T-E/SN attributes and parameters. Explore more Other Function Memory ICs devices from Microchip Technology

Specs

Maximum Access Time:

400 ns

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Mixed Memory Type:

EEPROM+SRAM

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

47C04T-E/SN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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