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47C04-I/ST

Microchip Technology

47C04-I/ST by Microchip Technology

47C04-I/ST by Microchip Technology is a CMOS memory IC with EEPROM+SRAM, 512X8 organization, and 4096-bit memory density. It operates synchronously at temperatures ranging from -40 to 85°C. This small outline package with 0.65mm terminal pitch is ideal for industrial applications requiring fast access times.

Median Price

$0.795

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 7,780 parts In-Stock

1+ parts

$0.770

100+ parts

$0.700

1k+ parts

$0.670

10k+ parts

$0.620

7,780

$0.770

$0.700

$0.670

$0.620

Mouser Electronics

USA . 465 parts In-Stock

1+ parts

$0.820

100+ parts

$0.755

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-

10k+ parts

-

465

$0.820

$0.755

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-

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.783

100+ parts

-

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100

$0.783

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NAC Semi

USA . 6,200 parts In-Stock

1+ parts

$0.830

100+ parts

$0.750

1k+ parts

$0.680

10k+ parts

-

6,200

$0.830

$0.750

$0.680

-

VNN

France . 5,469 parts In-Stock

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5,469

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Vyrian

USA . 4,924 parts In-Stock

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4,924

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,972 parts In-Stock

1+ parts

$0.650

100+ parts

-

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3,972

$0.650

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Continental Prestige Electronics

USA . 4,996 parts In-Stock

1+ parts

$0.783

100+ parts

-

1k+ parts

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10k+ parts

$0.767

4,996

$0.783

-

-

$0.767

Argo Parts USA

USA . 801 parts In-Stock

1+ parts

$0.783

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-

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801

$0.783

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-

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Aztec Data Supply Inc.

USA . 3,537 parts In-Stock

1+ parts

$2.250

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3,537

$2.250

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Corohmni

South Africa . 472 parts In-Stock

1+ parts

$5.768

100+ parts

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472

$5.768

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LOOK Integrated Logistics

Peru . 7,096 parts In-Stock

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7,096

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LMD Electronica

Estonia . 6,919 parts In-Stock

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6,919

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Ledger Components

France . 5,639 parts In-Stock

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5,639

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Montano Global Distributors

Canada . 2,361 parts In-Stock

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2,361

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.767

1k+ parts

$0.744

10k+ parts

$0.728

2,000

-

$0.767

$0.744

$0.728

NIA Electronics

USA . 1,060 parts In-Stock

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1,060

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Overview

Unlock the power of seamless data storage and retrieval with the 47C04-I/ST by Microchip Technology. This innovative Memory IC boasts a compact design and reliable performance, making it the perfect solution for a wide range of applications. From industrial automation to consumer electronics, this versatile device offers unmatched value and efficiency. Trust in the quality and expertise of Microchip Technology to elevate your projects to new heights. Experience the convenience and precision of the 47C04-I/ST today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the memory IC, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes it easier to integrate this memory IC onto circuit boards, saving space and improving efficiency.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer and processing, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 5

Operating at a 5V supply voltage provides stable and reliable power to the memory IC, ensuring consistent performance.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for seamless integration into the circuit design.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this memory IC can function reliably in a wide range of environments.

Organization: 512X8

The 512X8 organization means this memory IC can store 512 words of 8 bits each, offering ample storage capacity for various applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and high speed operation, making this memory IC energy-efficient and fast.

Technical Specifications

Other Function Memory ICs 47C04-I/ST attributes and parameters. Explore more Other Function Memory ICs devices from Microchip Technology

Specs

Maximum Access Time:

400 ns

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Mixed Memory Type:

EEPROM+SRAM

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

47C04-I/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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