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47C04T-E/ST

Microchip Technology

47C04T-E/ST by Microchip Technology

47C04T-E/ST by Microchip Technology is a small outline, thin profile EEPROM+SRAM memory IC with 512x8 organization. Operating at 5V, it has a max access time of 400ns and is suitable for automotive applications due to its temperature grade of -40 to 125°C.

Median Price

$1.110

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 94 parts In-Stock

1+ parts

$1.110

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$1.110

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VNN

France . 3,977 parts In-Stock

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Vyrian

USA . 2,539 parts In-Stock

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2,539

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,834 parts In-Stock

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$1.110

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2,834

$1.110

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Continental Prestige Electronics

USA . 1,386 parts In-Stock

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$1.110

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$1.088

1,386

$1.110

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$1.088

Netroflash

USA . 500 parts In-Stock

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$1.110

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$1.088

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500

$1.110

$1.088

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Aztec Data Supply Inc.

USA . 471 parts In-Stock

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$2.480

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471

$2.480

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Corohmni

South Africa . 383 parts In-Stock

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$3.349

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383

$3.349

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$4.656

100+ parts

$4.610

1k+ parts

$4.423

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50

$4.656

$4.610

$4.423

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Microchip USA

USA . 4,021 parts In-Stock

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$5.187

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$5.187

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Semicontronic

India . 1,249 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

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$8.730

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1,249

$9.000

$8.775

$8.730

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Ampacity Inc.

Singapore . 485 parts In-Stock

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$9.000

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485

$9.000

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AZTECH Wire

Italy . 817 parts In-Stock

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$18.975

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817

$18.975

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Marpe Global Electronics

Taiwan . 6,812 parts In-Stock

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QualityLine Systems

Poland . 6,812 parts In-Stock

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XL Components Corporation

Australia . 6,812 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,614 parts In-Stock

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5,614

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Overview

Unlock the power of innovative technology with the 47C04T-E/ST by Microchip Technology. This cutting-edge product offers a seamless blend of EEPROM and SRAM in a compact, reliable package. With a wide operating temperature range and automotive-grade durability, this memory IC is perfect for a variety of applications. Trust in the quality and expertise of Microchip Technology to deliver superior performance and value, making the 47C04T-E/ST the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the memory IC, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort in the manufacturing process.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this memory IC can function reliably in a range of environmental conditions, making it suitable for various applications.

Organization: 512X8

The organization of 512 words by 8 bits each provides ample storage capacity and efficient data retrieval, making this memory IC suitable for applications that require medium-sized memory.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, enhancing the efficiency and reliability of the memory IC.

Technical Specifications

Other Function Memory ICs 47C04T-E/ST attributes and parameters. Explore more Other Function Memory ICs devices from Microchip Technology

Specs

Maximum Access Time:

400 ns

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Mixed Memory Type:

EEPROM+SRAM

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

47C04T-E/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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