Loading...

TMS2758-JL0

Texas Instruments

TMS2758-JL0 by Texas Instruments

TMS2758-JL0 by Texas Instruments is a 1Kx8 MOS memory IC with 8192-bit density and 450ns access time. It features 3-STATE output characteristics, operates b/w 0°C to 70°C, and has a rectangular ceramic package. Ideal for applications requiring common I/O type and commercial temperature grade.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,234

-

-

-

-

Digiode

USA . 2,429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,429

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 383 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

383

$1.000

-

-

-

Parana Technologies

USA . 1,865 parts In-Stock

1+ parts

$5.183

100+ parts

-

1k+ parts

$5.786

10k+ parts

-

1,865

$5.183

-

$5.786

-

IDEA Electronic Components Group

UK . 2,021 parts In-Stock

1+ parts

$5.824

100+ parts

-

1k+ parts

$5.242

10k+ parts

-

2,021

$5.824

-

$5.242

-

ChromeModa Solutions

Germany . 1,258 parts In-Stock

1+ parts

$5.824

100+ parts

$4.776

1k+ parts

-

10k+ parts

-

1,258

$5.824

$4.776

-

-

AZTECH Wire

Italy . 632 parts In-Stock

1+ parts

$11.402

100+ parts

-

1k+ parts

-

10k+ parts

-

632

$11.402

-

-

-

Corphita

USA . 3,693 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,693

-

-

-

-

DigiPath Technology Company

USA . 354 parts In-Stock

1+ parts

-

100+ parts

$5.251

1k+ parts

-

10k+ parts

-

354

-

$5.251

-

-

Overview

Elevate your products with the TMS2758-JL0 by Texas Instruments, a high-quality memory IC that offers unmatched performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will exceed your expectations. Ideal for a wide range of applications, this memory IC provides exceptional value and benefits to customers looking for a reliable solution. Upgrade your technology with the TMS2758-JL0 and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and durability, making this product suitable for applications where heat dissipation is important.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this memory IC can operate reliably in a wide range of environments.

Technology: MOS

MOS technology is known for its low power consumption and high speed, making this memory IC energy-efficient and fast in data processing.

Memory Width: 8

With a memory width of 8, this memory IC can handle data in 8-bit chunks efficiently, making it suitable for applications requiring processing of byte-sized data.

Technical Specifications

Other Function Memory ICs TMS2758-JL0 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

450 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T24

Memory Density:

8192 bit

Memory Width:

8

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2758-JL0 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20