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SN74LS601ADWR

Texas Instruments

SN74LS601ADWR by Texas Instruments

SN74LS601ADWR by Texas Instruments is a 64KX1 memory circuit IC with TTL technology. It operates asynchronously at a supply voltage range of 4.75V to 5.25V, suitable for commercial temperature grades. This small outline package with gull wing terminals is ideal for applications requiring 65536-bit memory density in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,856

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-

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Digiode

USA . 2,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,960

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,315 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,315

$1.000

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-

-

Parana Technologies

USA . 2,344 parts In-Stock

1+ parts

$4.329

100+ parts

-

1k+ parts

$4.750

10k+ parts

-

2,344

$4.329

-

$4.750

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ChromeModa Solutions

Germany . 3,992 parts In-Stock

1+ parts

$4.864

100+ parts

$3.988

1k+ parts

-

10k+ parts

-

3,992

$4.864

$3.988

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IDEA Electronic Components Group

UK . 1,526 parts In-Stock

1+ parts

$4.864

100+ parts

-

1k+ parts

$4.378

10k+ parts

-

1,526

$4.864

-

$4.378

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AZTECH Wire

Italy . 816 parts In-Stock

1+ parts

$9.435

100+ parts

-

1k+ parts

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10k+ parts

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816

$9.435

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DigiPath Technology Company

USA . 2,212 parts In-Stock

1+ parts

-

100+ parts

$4.385

1k+ parts

-

10k+ parts

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2,212

-

$4.385

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Corphita

USA . 719 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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719

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Overview

Unlock the power of innovative technology with the Texas Instruments SN74LS601ADWR, a top-of-the-line Other Function Memory IC. With a reputation for quality and reliability, Texas Instruments delivers unmatched performance in every product they create. This versatile memory circuit is perfect for a wide range of applications, offering customers exceptional value and benefits. Say goodbye to limitations and hello to endless possibilities with the SN74LS601ADWR from Texas Instruments. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the memory IC, ensuring reliable performance over time.

Surface Mount: YES

Allows for easy and quick installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Optimal supply voltage for efficient and stable operation of the memory IC.

Operating Mode: ASYNCHRONOUS

Allows for flexiblity in data transfer and processing, enhancing the versatility of the memory IC.

Memory Density: 65536 bit

High memory density allows for storage of large amounts of data in a compact form factor.

Technical Specifications

Other Function Memory ICs SN74LS601ADWR attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

20

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN74LS601ADWR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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