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M36W216B85ZA1

STMicroelectronics

M36W216B85ZA1 by STMicroelectronics

M36W216B85ZA1 from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage. It features a 16-bit width and operates within -0 °C to 70 °C, making it ideal for commercial applications in compact electronics. With 1M words capacity, it's perfect for data storage needs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,858 parts In-Stock

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4,858

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Vyrian

USA . 1,385 parts In-Stock

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1,385

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Anansix

USA . 1,219 parts In-Stock

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1,219

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,544 parts In-Stock

1+ parts

$2.483

100+ parts

-

1k+ parts

$2.235

10k+ parts

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1,544

$2.483

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$2.235

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MKK Technologies

India . 282 parts In-Stock

1+ parts

$4.669

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282

$4.669

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DigiPath Technology Company

USA . 282 parts In-Stock

1+ parts

$4.669

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282

$4.669

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Corphita

USA . 4,389 parts In-Stock

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4,389

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Parana Technologies

USA . 573 parts In-Stock

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$2.969

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573

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$2.969

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Overview

Unlock exceptional performance with the M36W216B85ZA1 from STMicroelectronics, a leader in innovative memory solutions. This versatile memory IC offers robust quality and reliability, perfectly suited for a wide range of applications from automotive to industrial devices. With its low-profile design and efficient asynchronous operation, you’ll enjoy seamless integration and enhanced system performance, delivering unmatched value and efficiency for your projects. Elevate your designs with STMicroelectronics’ commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures resistance to environmental factors, enhancing reliability in various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, enabling more compact designs and efficient use of space.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and design on circuit boards, making integration smoother.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible timing requirements, leading to easier interfacing with various devices.

Nominal Supply Voltage / Vsup: 3V

The standard operating voltage is widely compatible with many devices, simplifying design and integration processes.

No. of Terminals: 66

A higher number of terminals provides increased connectivity options, allowing for more complex functionalities in designs.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low profile design enhances space efficiency while fine pitch supports high density circuit designs.

Maximum Operating Temperature: 70 °C

A higher temperature threshold ensures reliability in warmer environments, making it suitable for diverse applications.

Organization: 1MX16

The memory organization supports efficient data handling, optimizing performance in various applications.

Minimum Operating Temperature: 0 °C

The minimum temperature ensures operational viability in a range of environments, enhancing usability.

Terminal Position: BOTTOM

Bottom terminal positioning helps in neat assembly on PCBs, contributing to better thermal performance and space utilization.

Maximum Seated Height: 1.4 mm

A low seated height allows for compact designs, ideal for applications where space is a premium.

Width: 8 mm

The width of the package is designed to fit within standard PCB layouts, simplifying integration and assembly.

Minimum Supply Voltage (Vsup): 2.7 V

Compatibility with lower voltage inputs increases its versatility across different types of circuitry.

Length: 12 mm

The length is optimized for most PCB layouts, allowing easy integration without occupying excessive space.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for a wide variety of consumer electronics applications.

Technology: CMOS

CMOS technology contributes to lower power consumption and higher efficiency, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form enhances soldering ease and reliability, improving manufacturing efficiency.

No. of Words: 1048576 words

A significant number of words provides ample storage capacity for a variety of applications, accommodating diverse data needs.

Memory Width: 16

A 16-bit memory width supports efficient data processing, enhancing overall system performance.

Terminal Pitch: 0.8 mm

The 0.8 mm pitch allows for a compact layout, enabling higher density configurations and saving space on PCBs.

No. of Words Code: 1M

This specification indicates a substantial memory footprint, offering flexibility in data storage and management.

Maximum Supply Voltage (Vsup): 3.3 V

Ability to operate at a maximum of 3.3 V broadens the scope for compatibility with various modern electronic applications.

Memory Density: 16777216 bit

High memory density allows for storing more data in less space, making it ideal for advanced applications such as mobile devices and IoT.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit, it is specifically designed for data storage, ensuring reliability and performance in memory-intensive applications.

Technical Specifications

Other Function Memory ICs M36W216B85ZA1 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO CONTAINS 128K X 16 SRAM

JESD-30 Code:

R-PBGA-B66

Length:

12 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

66

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36W216B85ZA1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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