Loading...

M36W108B120ZM6

STMicroelectronics

M36W108B120ZM6 by STMicroelectronics

M36W108B120ZM6 from STMicroelectronics is a low-profile, asynchronous mixed memory IC featuring 1M x 8 organization with Flash+SRAM technology. It operates b/w -40 °C to 85°C and supports supply voltages of 2.7V to 3.6V. Ideal for industrial applications requiring compact memory solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,950

-

-

-

-

Vyrian

USA . 1,717 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,717

-

-

-

-

Anansix

USA . 282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

282

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,664 parts In-Stock

1+ parts

$2.890

100+ parts

-

1k+ parts

$2.601

10k+ parts

-

1,664

$2.890

-

$2.601

-

MKK Technologies

India . 55 parts In-Stock

1+ parts

$5.434

100+ parts

-

1k+ parts

-

10k+ parts

-

55

$5.434

-

-

-

DigiPath Technology Company

USA . 55 parts In-Stock

1+ parts

$5.434

100+ parts

-

1k+ parts

-

10k+ parts

-

55

$5.434

-

-

-

Corphita

USA . 835 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

835

-

-

-

-

Parana Technologies

USA . 112 parts In-Stock

1+ parts

-

100+ parts

$3.455

1k+ parts

-

10k+ parts

-

112

-

$3.455

-

-

Overview

Unleash the power of reliable memory solutions with the M36W108B120ZM6 from STMicroelectronics. Renowned for its cutting-edge technology, STMicroelectronics delivers exceptional quality and performance in every chip. This versatile FLASH+SRAM memory IC is perfect for industrial applications, providing robust operation even in extreme temperatures. Experience faster data access, energy efficiency, and enhanced reliability—empowering your designs to reach new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy for the package body enhances reliability and longevity in various environments.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs and improves assembly efficiency.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient board space utilization, making it ideal for space-constrained applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for simplified control and interfacing, making it suitable for various system designs.

Mixed Memory Type: FLASH+SRAM

Combining FLASH and SRAM types provides a versatile memory solution capable of balancing speed and endurance requirements.

Power Supplies (V): 3/3.3

Compatibility with common power supply voltages makes integration into existing systems straightforward.

No. of Terminals: 48

Having 48 terminals allows for a rich set of I/O options, enhancing functionality in complex applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The low-profile grid array design minimizes overall device height, making it perfect for low-profile applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in a broad range of industrial applications.

Organization: 1MX8

The 1MX8 organization structure allows for efficient data handling and memory access in applications.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C supports applications in harsh environments and extreme temperatures.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good solderability for reliable connections during assembly.

Terminal Position: BOTTOM

Bottom terminal positioning optimizes space and layout in densely packed circuit designs.

Maximum Seated Height: 1.35 mm

The low seated height aids in fitting within compact spaces while maintaining performance.

Width: 9.8 mm

With a width of 9.8 mm, this device is suitable for high-density applications without compromising performance.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7 V enables operation in low-power applications, optimizing energy efficiency.

Length: 11.8 mm

The length of 11.8 mm allows compatibility with a wide range of PCB layouts and design configurations.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robust performance suitable for critical applications in various industries.

Technology: CMOS

CMOS technology ensures low power consumption while delivering high performance, perfect for modern applications.

Terminal Form: BALL

Ball terminal form allows for compact soldering and superior electrical connectivity with the PCB.

Maximum Supply Current: 100 mA

The maximum supply current of 100 mA supports high-demand applications, allowing for robust performance.

No. of Words: 1048576 words

The large number of 1,048,576 words provides ample memory capacity for storing complex data and applications.

Memory Width: 8

An 8-bit memory width matches well with various data formats and programming interfaces, enhancing compatibility.

Terminal Pitch: 1 mm

A terminal pitch of 1 mm enables high density layouts, ideal for modern electronic designs requiring compact solutions.

No. of Words Code: 1M

A memory code of 1M words offers substantial storage for applications needing sizeable data retention.

Maximum Supply Voltage (Vsup): 3.6 V

Support for a maximum supply voltage of 3.6 V enhances compatibility with various power sources while maintaining stability.

Memory Density: 8388608 bit

With a density of 8,388,608 bits, this memory IC is well-suited for applications that require substantial storage capacity.

Memory IC Type: MEMORY CIRCUIT

As a dedicated memory circuit, it provides essential functionality for data storage in various electronic applications.

Maximum Standby Current: 0.00002 Amp

The extremely low maximum standby current ensures minimal power consumption when the device is not in use.

Maximum Access Time: 120 ns

A maximum access time of 120 ns delivers fast data retrieval, enhancing overall system performance.

Technical Specifications

Other Function Memory ICs M36W108B120ZM6 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Maximum Access Time:

120 ns

Additional Features:

ALSO CONTAINS 128K X 8 SRAM

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e0

Length:

11.8 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Mixed Memory Type:

FLASH+SRAM

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.35 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

9.8 mm

Trade Compliance

M36W108B120ZM6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20